Freescale Semiconductor
Advance Information
MC9328MX1/D
Rev. 3.0, 12/2003
MC9328MX1
(i.MX1) Integrated
Portable System
Processor
MC9328MX1/D
Rev. 4, 08/2004
MC9328MX1
MC9328MX1
Package Information
Plastic Package
(MAPBGA–256)
Ordering Information
See Table 2 on page 5
1 Introduction
Motorola’s i.MX family of microprocessors has
demonstrated leadership in the portable handheld market.
Continuing this legacy, the i.MX series provides a leap in
performance with an ARM9™ microprocessor core and
highly integrated system functions. The i.MX products
specifically address the requirements of the personal,
portable product market by providing intelligent integrated
peripherals, an advanced processor core, and power
management capabilities.
The new MC9328MX1 features the advanced and power-
efficient ARM920T™ core that operates at speeds up to
200 MHz. Integrated modules, which include an LCD
controller, static RAM, USB support, an A/D converter (with
touch panel control), and an MMC/SD host controller,
support a suite of peripherals to enhance any product seeking
to provide a rich multimedia experience. In addition, the
MC9328MX1 is the first Bluetooth™ technology-ready
applications processor. It is packaged in a 256-pin Mold
Array Process-Ball Grid Array (MAPBGA). Figure 1 on
page 2 shows the functional block diagram of the
MC9328MX1.
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Signals and Connections . . . . . . . . . . . . . . . . . . . . 6
3 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4 Pin-Out and Package Information . . . . . . . . . . . . 93
Contact Information . . . . . . . . . . . . . . . . . . . Last Page
© Freescale Semiconductor, Inc., 2004. All rights reserved.
This document contains information on a new product. Specifications and information herein are
subject to change without notice.
Introduction
System Control
JTAG/ICE
Bootstrap
Power
Control
CGM
(DPLLx2)
Standard
System I/O
GPIO
Connectivity
MMC/SD
Memory Stick®
Host Controller
SPI 1 and
SPI 2
UART 1
UART 2 & 3
SSI/I2S 1 & 2
I2C
USB Device
SmartCard I/F
Bluetooth
Accelerator
AIPI 1
MC9328MX1
CPU Complex
ARM9TDMI™
PWM
Timer 1 & 2
RTC
Watchdog
I Cache
D Cache
Multimedia
Multimedia
Accelerator
Video Port
Human Interface
Analog Signal
Processor
LCD Controller
VMMU
Interrupt
Controller
Bus
Control
AIPI 2
DMAC
(11 Chnl)
EIM &
SDRAMC
eSRAM
(128K)
Figure 1. MC9328MX1 Functional Block Diagram
1.1 Conventions
This document uses the following conventions:
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OVERBAR is used to indicate a signal that is active when pulled low: for example, RESET.
Logic level one
is a voltage that corresponds to Boolean true (1) state.
Logic level zero
is a voltage that corresponds to Boolean false (0) state.
To
set
a bit or bits means to establish logic level one.
To
clear
a bit or bits means to establish logic level zero.
A
signal
is an electronic construct whose state conveys or changes in state convey information.
A
pin
is an external physical connection. The same pin can be used to connect a number of signals.
Asserted
means that a discrete signal is in active logic state.
—
Active low
signals change from logic level one to logic level zero.
—
Active high
signals change from logic level zero to logic level one.
•
Negated
means that an asserted discrete signal changes logic state.
—
Active low
signals change from logic level zero to logic level one.
—
Active high
signals change from logic level one to logic level zero.
•
•
LSB means
least significant bit
or
bits,
and MSB means
most significant bit
or
bits.
References to low and
high bytes or words are spelled out.
Numbers preceded by a percent sign (%) are binary. Numbers preceded by a dollar sign ($) or
0x
are
hexadecimal.
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Introduction
1.2 Features
To support a wide variety of applications, the MC9328MX1 provides a robust array of features, including the
following:
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ARM920T Microprocessor Core
AHB to IP Bus Interfaces (AIPIs)
External Interface Module (EIM)
SDRAM Controller (SDRAMC)
DPLL Clock and Power Control Module
Three Universal Asynchronous Receiver/Transmitters (UART 1 UART 2 and UART 3)
Two Serial Peripheral Interfaces (SPI)
Two General-Purpose 32-bit Counters/Timers
Watchdog Timer
Real-Time Clock/Sampling Timer (RTC)
LCD Controller (LCDC)
Pulse-Width Modulation (PWM) Module
Universal Serial Bus (USB) Device
Multimedia Card and Secure Digital (MMC/SD) Host Controller Module
Memory Stick® Host Controller (MSHC)
SmartCard Interface Module (SIM)
Direct Memory Access Controller (DMAC)
Two Synchronous Serial Interfaces and Inter-IC Sound (SSI 1 and SSI 2/I
2
S) Module
Inter-IC (I
2
C) Bus Module
Video Port
General-Purpose I/O (GPIO) Ports
Bootstrap Mode
Analog Signal Processing (ASP) Module
Bluetooth Accelerator (BTA)
Multimedia Accelerator (MMA)
256-pin MAPBGA Package
1.3 Target Applications
The MC9328MX1 is targeted for advanced information appliances, smart phones, Web browsers, digital MP3
audio players, handheld computers based on the popular Palm OS platform, and messaging applications such as
Motorola's wireless cellular products, including the Accompli
TM
008 GSM/GPRS interactive communicator.
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Freescale Semiconductor
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Introduction
1.4 Document Revision History
The following table provides revision history for this release. This history includes technical content revisions only
and not stylistic or grammatical changes.
Table 1. MC9328MX1 Data Sheet Revision History
Revision Location
Throughout
Table 4 on page 14
Section 3.3, “Power Sequence
Requirements” on page 15
Section 3.12, “Bluetooth Accelerator”
on page 58
Revision
Clarified instances where BCLK signal is burst clock.
Maximum Ratings table replaced.
Added reference to AN2537.
Added “Important” note regarding no software support for the BTA.
1.5 Product Documentation
The following documents are required for a complete description of the MC9328MX1 and are necessary to design
properly with the device. Especially for those not familiar with the ARM920T processor or previous DragonBall
products, the following documents are helpful when used in conjunction with this manual.
ARM Architecture Reference Manual
(ARM Ltd., order number ARM DDI 0100)
ARM9DT1 Data Sheet Manual
(ARM Ltd., order number ARM DDI 0029)
ARM Technical Reference Manual
(ARM Ltd., order number ARM DDI 0151C)
EMT9 Technical Reference Manual
(ARM Ltd., order number DDI O157E)
MC9328MX1 Product Brief
(order number MC9328MX1P/D)
MC9328MX1S Reference Manual
(order number MC9328MX1SRM/D)
MC68VZ328 Product Brief
(order number MC68VZ328P/D)
MC68VZ328 User’s Manual
(order number MC68VZ328UM/D)
MC68VZ328 User’s Manual Addendum
(order number MC68VZ328UMAD/D)
MC68SZ328 Product Brief
(order number MC68SZ328P/D)
MC68SZ328 User’s Manual
(order number MC68SZ328UM/D)
The Motorola manuals are available on the Motorola Semiconductors Web site at http://www.motorola.com/
semiconductors. These documents may be downloaded directly from the Motorola Web site, or printed versions
may be ordered. The ARM Ltd. documentation is available from http://www.arm.com.
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Introduction
1.6 Ordering Information
Table 2 provides ordering information for the 256-lead mold array process ball grid array (MAPBGA) package.
Table 2. MC9328MX1 Ordering Information
Package Type
256-lead MAPBGA
256-lead MAPBGA
256-lead MAPBGA
256-lead MAPBGA
256-lead MAPBGA
256-lead MAPBGA
Frequency
200 MHz
200 MHz
200 MHz
200 MHz
150 MHz
150 MHz
Temperature
0°C to 70°C
0°C to 70°C
-30°C to 70°C
-30°C to 70°C
-40°C to 85°C
-40°C to 85°C
Solderball Type
Standard
Pb-free
Standard
Pb-free
Standard
Pb-free
Order Number
MC9328MX1VH20(R2)
MC9328MX1VM20(R2)
MC9328MX1DVH20(R2)
MC9328MX1DVM20(R2)
MC9328MX1CVH15(R2)
MC9328MX1CVM15(R2)
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