Lead-Free Solder Pastes
Formula
Application
Alloys
Product
Characteristics
Residue Characteristics
Typical Metal Percentage
Compliant Specifications
Suggested Packaging Style
Liquid Soldering Fluxes for
Lead-Free Wave Soldering
Lead-free wave and selective soldering require exposing the flux to
slightly higher soldering temperatures. Lead-free alloys traditionally
wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for
lead-free assembly have new activator packages to enable rapid wetting
and hole-filling, ensuring reliable product output.
Kester Part #
63-0004-0985
64-0004-0985
65-0004-0985
63-0020-0959
64-0020-0959
65-0020-0959
63-0056-2220
64-0056-2220
65-0056-2220
63-0000-2235
64-0000-2235
65-0000-2235
Description
985M No-Clean
985M No-Clean
985M No-Clean
959T No-Clean
959T No-Clean
959T No-Clean
2220-VF VOC-Free Water-Soluble
2220-VF VOC-Free Water-Soluble
2220-VF VOC-Free Water-Soluble
2235 Water-Soluble
2235 Water-Soluble
2235 Water-Soluble
Packaging
1 gallon
5 gallon
53 gallon drum
1 gallon
5 gallon
53 gallon drum
1 gallon
5 gallon
53 gallon drum
Page 4
Kester Lead-Free
EnviroMark™ 907
No-Clean Stencil Printing
Sn96.5Ag3.0Cu0.5
Designed to exceed customers' expectations for high yield lead-free manufac-
turing. EM907 is engineered for the high thermal demands of assembling with
lead-free alloys such as the family of SnAgCu (SAC). Joints are cosmetically
bright as SnPb joints. Prints down to 0201 pad sites. Designed to be reflowable
in air as well as nitrogen.
Light colored
88.5%, -325/+500 (Type 3)
Telcordia Issue 1 GR-78-CORE
IPC/J-STD-004 Flux Designator ROL0
500g jar, 600g, 1400g cartridges
EnviroMark™ 828
Water-Soluble Stencil Printing
Sn96.5Ag3.0Cu0.5
Kester EM828 provides excellent printability, activity, cleanability and low-
voiding behavior. EM828 is very robust and can tolerate a wide variety of
printing and reflow conditions. EM828 is first to market with a water-solu-
able lead-free paste that combines superior activity, cleanability and low-
voiding.
Cleanable in warm water
89.5%, -325/+500 (Type 3)
IPC/J-STD-004 Flux Designator ORH1
500g jar, 600g, 1400g cartridges
Kester Part #
7006050810
7006050811
7004030810
7004030811
Description
EM907 No-Clean, Type 3, 88.5% metal
EM907 No-Clean, Type 3, 88.5% metal
EM828 Water-Soluble, Type 3, 89.5% metal
EM828 Water-Soluble, Type 3, 89.5% metal
Alloy
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Packaging
500g jar
600g cartridge
500g jar
600g cartridge
*Formula
985M
No-Clean
959T
No-Clean
Spray or Foam
Halide - free
0.794
2.9
IPC/J-STD-004
Flux Designator
2220-VF VOC-Free
Water-Soluble
Spray, Wave or Foam
1.6
1.055
7
IPC/J-STD-004
Flux Designator ORH1
2235
Water-Soluble
Spray or Foam
1.6
0.856
11
IPC/J-STD-004
Flux Designator
Application
Halide Content %
Specific Gravity
Solids %
Compliant
Spray or Wave Fluxer
Halide - free
0.805
3.6
IPC/J-STD-004
Flux Designator ROL0
*
These products are designed specifically for high performance lead-free applications.
1 gallon
5 gallon
53 gallon drum
.
Kester Part #
04-9574-0050
Alloy
K100LD
Sn96.5Ag3.0Cu0.5
Each Bar
1 2/3 lbs.
1 2/3 lbs.
Sold As
25 lbs.
25 lbs.
Ultrapure
®
K100LD Lead-Free Solder Bar
K100LD is a new patent-pending low-cost lead-free solder alloy for use in wave soldering,
selective soldering, and tip tinning operations. K100LD has the Lowest Copper Dissolution
amongst all common solder alloys, including SN63, SAC305, and other lead-free options.
Kester K100LD provides the lowest cost for wave soldering operations. It also provides
solder joints with no shrinkage effects, excellent through-hole penetration and topside
fillet, and provides a low dross rate.
04-7068-0000
Common Lead-Free Alloys
*Alloys
K100LD
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.5
Melt Temperature
~227°C/441°F
217°C/423°F
221°C/430°F
Application
Wave/Hand Soldering
SMT/Hand/Wave
SMT/Hand Soldering
* These are the most common lead-free alloys used in the industry. Kester can also produce a multitude of
lead-free alloys as specified by individual requirements.
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