IDT72V18160L10PFI datasheet, PDF

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IDT72V18160L10PFI: DescriptionFIFO, 32KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80; Categorystorage storage; File Size231KB，26 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT72V18160L10PFI Overview

FIFO, 32KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80

IDT72V18160L10PFI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	TQFP-80
Contacts	80
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	6.5 ns
Maximum clock frequency (fCLK)	100 MHz
period time	10 ns
JESD-30 code	S-PQFP-G80
JESD-609 code	e0
length	14 mm
memory density	524288 bi
Memory IC Type	OTHER FIFO
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	80
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX16
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP80,.64SQ
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.015 A
Maximum slew rate	0.04 mA
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	14 mm
Base Number Matches	1

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3.3V MULTIMEDIA FIFO

16 BIT V-III, 32 BIT Vx-III FAMILY

UP TO 1 Mb DENSITY

IDT72V15160

IDT72V16160

IDT72V17160

IDT72V18160

IDT72V19160

IDT72V14320

IDT72V15320

IDT72V16320

IDT72V17320

IDT72V18320

IDT72V19320

FEATURES:

•

Choose among the following memory organizations: Commercial

V-III

Vx-III

•

IDT72V15160 - 4,096 x 16

IDT72V16160 - 8,192 x 16

IDT72V17160 - 16,384 x 16

IDT72V18160 - 32,768 x 16

IDT72V19160 - 65,536 x 16

IDT72V14320 - 1,024 x 32

IDT72V15320 - 2,048 x 32

IDT72V16320 - 4,096 x 32

IDT72V17320 - 8,192 x 32

IDT72V18320 - 16,384 x 32

IDT72V19320 - 32,768 x 32

•

Up to 100 MHz Operation of the Clocks

5V input tolerant

Auto power down minimizes standby power consumption

•

Master Reset clears entire FIFO

Partial Reset clears data, but retains programmable settings

Empty, Full and Half-Full flags signal FIFO status

Programmable Almost-Empty and Almost-Full flags, each flag can

default to one of eight preselected offsets

Program programmable flags through serial input

Output enable puts data outputs into high impedance state

JTAG port, provided for Boundary Scan function (PBGA Only)

Available in a 80-pin (V-III) Thin Quad Flat Pack, 128-pin(Vx-III)

Thin Quad Flat Pack (TQFP) or a 144-pin (Vx-III) Plastic Ball Grid

Array (PBGA) (with additional features)

Industrial temperature range (–40°C to +85°C)

High-performance submicron CMOS technology

FUNCTIONAL BLOCK DIAGRAM

Available on the Vx-III PBGA package only.

MRS

WCLK

WEN

PRS

RCLK

REN

D0 - Dn

Data In

x16, x32

FIFO ARRAY

Q0 - Qn

Data Out

x16, x32

WRITE

CONTROL

RESET LOGIC

READ

CONTROL

TCK

TRST

TMS

TDI

TDO

JTAG CONTROL

(BOUNDARY

SCAN)

SEN

PFM

FLAG LOGIC

FSEL1

FSEL0

PAE

PAF

6163 drw01

IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.

INDUSTRIAL TEMPERATURE RANGE



NOVEMBER 2003

DSC-6163/2

IDT72V18160L10PFI Related Products

	IDT72V18160L10PFI	IDT72V15160L10PFI	IDT72V19160L10PFI	IDT72V16160L10PFI	IDT72V17320L10PFI	IDT72V19320L10BBI	IDT72V16320L10BBI	IDT72V16320L10PFI
Description	FIFO, 32KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80	FIFO, 4KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80	FIFO, 64KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80	FIFO, 8KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80	FIFO, 8KX32, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128	FIFO, 32KX32, 6.5ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144	FIFO, 4KX32, 6.5ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144	FIFO, 4KX32, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFP	QFP	QFP	QFP	QFP	BGA	BGA	QFP
package instruction	TQFP-80	TQFP-80	TQFP-80	TQFP-80	TQFP-128	13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144	13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144	TQFP-128
Contacts	80	80	80	80	128	144	144	128
Reach Compliance Code	_compli	_compli	_compli	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	6.5 ns	6.5 ns	6.5 ns	6.5 ns	6.5 ns	6.5 ns	6.5 ns	6.5 ns
Maximum clock frequency (fCLK)	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
period time	10 ns	10 ns	10 ns	10 ns	10 ns	10 ns	10 ns	10 ns
JESD-30 code	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80	R-PQFP-G128	S-PBGA-B144	S-PBGA-B144	R-PQFP-G128
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	14 mm	14 mm	14 mm	14 mm	20 mm	13 mm	13 mm	20 mm
memory density	524288 bi	65536 bi	1048576 bi	131072 bit	262144 bit	1048576 bit	131072 bit	131072 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	16	16	16	16	32	32	32	32
Humidity sensitivity level	3	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	80	80	80	80	128	144	144	128
word count	32768 words	4096 words	65536 words	8192 words	8192 words	32768 words	4096 words	4096 words
character code	32000	4000	64000	8000	8000	32000	4000	4000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	32KX16	4KX16	64KX16	8KX16	8KX32	32KX32	4KX32	4KX32
Exportable	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LQFP	LQFP	LFQFP	BGA	BGA	LFQFP
Encapsulate equivalent code	QFP80,.64SQ	QFP80,.64SQ	QFP80,.64SQ	QFP80,.64SQ	QFP128,.63X.87,20	BGA144,12X12,40	BGA144,12X12,40	QFP128,.63X.87,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240	240	240	240	225	225	240
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.97 mm	1.97 mm	1.6 mm
Maximum standby current	0.015 A	0.015 A	0.015 A	0.015 A	0.015 A	0.015 A	0.015 A	0.015 A
Maximum slew rate	0.04 mA	0.04 mA	0.04 mA	0.04 mA	0.04 mA	0.04 mA	0.04 mA	0.04 mA
Maximum supply voltage (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
Minimum supply voltage (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL	BALL	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.5 mm	1 mm	1 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	BOTTOM	BOTTOM	QUAD
Maximum time at peak reflow temperature	20	20	20	20	20	30	30	20
width	14 mm	14 mm	14 mm	14 mm	14 mm	13 mm	13 mm	14 mm

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