Prototyping Boards (Circbord
®
)
VECTORBORD
®
8010
Circuit Pattern:
Contacts:
Width/Thick:
Height:
Contacts:
16-Pin DIP Capacity:
Material:
Wire-Wrap Terminals:
Solder Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
4.0" x 13.0"
Pad-Per-Hole
N/A
12.86"/.062"
4.00"
N/A
124
FR4 Epoxy Glass
T44, T46, T49, T68,
T42-1
R32
.042"
• Precision-Drilled,
plated-thru holes
• 0.080" diameter,
isolated solder pad
around each hole
• Board size and
surface area approxi-
mate Macintosh II
specifications
• Unrestricted
component
placement
8001
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
4.50" x 6.5"
3-Hole Solder Pad
N/A
6.50"/.062"
4.50"
20
CEM-1
T42-1, K24C, K31C
T44, T46, T49, T68
R32
.042"
• Circuit pattern etched
onto wiring side only
• Solder mount DIP
sockets or IC devices
with any lead spacing
• 3-hole solder pads
(0.28" X 0.080") for
interconnecting multiple
component leads
8002
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
4.5" x 6.5"
Interleaved Buses
N/A
6.50"/.062"
4.50"
36
CEM-1
T42-1
T44, T46, T49, T68
R32
.042"
• Ideal for wire-wrap
applications
• Power and ground buses
etched onto wiring side
only
• Bus surfaces solder
coated for user
convenience
• Mount components with
0.3", 0.6" and 0.9" lead
spacing
• I/O area with solder pads
for mounting connector
Products
8003
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
4.5" x 6.5"
Pad-Per-Hole
N/A
6.50"/.062"
4.50"
60
CEM-1
T42-1
T44, T46. T49. T68
R32
.042"
• Square solder pad
etched around each
hole on wiring side
• Accommodates any
type DIP IC device or
discrete component
11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708
Toll-Free (800) 423-5659
Web site: http://www.vectorelect.com
ELECTRONIC COMPANY
VECTORBORD
®
Prototyping Boards (Circbord
®
)
8004
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
4.5" x 6.5"
•
Ground Plane
N/A
6.50"/.062"
4.50"
•
50
CEM-1
•
T42-1
T44, T46, T49, T68
•
R32
•
.042"
To commit wire-wrap pins to
voltage and ground planes, use
Vector T124 solder washers,
available separately
0.085" diameter clearance
around holes
Etched overall ground plane on
wiring side only
Plane surfaces solder-coated
for user convenience
I/O area with solder pads for
mounting connector
8007
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
4.5" x 6.5"
• Pad-Per-Hole pattern on
component side - overall
Pad-Per-Hole/
Ground Plane pattern on
Ground Plane
wiring side
• To commit wire-wrap pins to
N/A
ground planes, use Vector T124
6.50"/.062"
solder washers, available
4.50"
separately
60
• 0.080" diameter, isolated solder
CEM-1
pad around holes, component
T42-1
side
T44, T46, T49, T68
• Accommodates any type DIP IC
device or discrete component
R32
• Plane and pad surfaces solder-
.042"
coated for user convenience
8008
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
4.5" x 6.5"
Pads & Planes
N/A
6.50"/.062"
4.50"
70
FR4 Epoxy Glass
T42-1
T44, T46, T49, T68
R32
.042"
• Unique circuit pattern features
full voltage and ground planes
on opposite sides with isolated,
plated-thru holes
• 0.080" diameter, isolated solder
pad around holes, component
side
• Plane surfaces solder-coated
for user convenience
• SMD cap positions for discrete
decoupling capacitors
General Proto
Products
3677-6
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
4.5" x 8.08"
3-Hole Solder Pad
N/A
8.08"/.062"
4.50"
21
CEM-1
T42-1
T44, T46, T49, T68
R32
.042"
• Etched circuit pattern on wiring
side only
• 0.080" diameter, isolated solder
pad around holes, both sides
• 3-hole solder pads
(0.028" X 0.080") for
interconnecting multiple
component leads
• Pad and bus surfaces solder-
coated for user convenience
Specifications subject to change without notice.
ELECTRONIC COMPANY
Prototyping Boards (Circbord
®
)
VECTORBORD
®
45P80-1
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
4.5" x 8.08"
Pad-Per-Hole
N/A
• Isolated, square pads around
8.08"/.062"
each hole
4.50"
80
CEM-1
T42-1
T44, T46, T49, T68
R32
.042"
8006
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
5.0" x 13.25"
Pad-Per-Hole
N/A
13.25"/.062"
5.00"
154
FR4 Epoxy Glass
T42-1
T44, T46, 49, T68
R32
.042"
• Copper plated-thru holes
• 0.080" diameter, isolated solder
pad around holes, both sides
• Unrestricted component place
ment, extended area for high
density applications
• Board can be cut down into
smaller units
Products
8012
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
9.2" x 11.0"
Pad-Per-Hole
N/A
11.00"/.062"
9.20"
283
FR4 Epoxy Glass
T42-1
T44, T46, T49, T68
R32
.042"
• Plated-thru holes
• Approximates Eurocard (DIN)
specifications: 6U x 280MM, can
be sheared down to 6U x 220MM,
or 160MM
• 0.080" diameter, isolated solder
pad around holes
• Unrestricted component
placement, extended area for
high density applications
11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708
Toll-Free (800) 423-5659
Web site: http://www.vectorelect.com
ELECTRONIC COMPANY
VECTORBORD
®
Prototyping Boards (Circbord
®
)
106P106-1 10.6" x 10.6"
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
Pad-Per-Hole
N/A
10.60"/.062"
10.60"
• 0.080" diameter, isolated solder
pad around each hole, both sides
275
FR4 Epoxy Glass
T42-1
T44, T46, T49, T68
R32
.042"
Ð
106P180-4 10.6" X 18.0"
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
Pad-Per-Hole &
Ground Plane,
2 sides
•
N/A
•
10.60"/.062"
18.00
•
400
FR4 Epoxy Glass
T42
T44, T46, T49,T68
R32
.042"
Individual pads with plated-thru
holes
Etched ground plane surrounds
pads on both sides
0.080" diameter, isolated solder
pad around each hole, both sides
18.0"
Ð
10.6"
General Proto
Products
Specifications subject to change without notice.
ELECTRONIC COMPANY
Ð
106P70-4 7.0" x 10.6"
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
Pad-Per-Hole &
Ground Plane
N/A
7.0"/.062"
10.60"
175
FR4 Epoxy Glass
2 sides
T42-1
T44, T46, T49, T68
R32
.042"
• Individual pads with plated-thru
holes
• Etched ground plane surrounds
pads on both sides
• 0.080" diameter, isolated solder
pad around each hole, both sides
Ð
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