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BS107ARL1G

Description
MOSFET 200V 250mA N-Channel
CategoryDiscrete semiconductor    The transistor   
File Size57KB,4 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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BS107ARL1G Overview

MOSFET 200V 250mA N-Channel

BS107ARL1G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
Parts packaging codeTO-92
package instructionCYLINDRICAL, O-PBCY-T3
Contacts3
Manufacturer packaging code29-11
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage200 V
Maximum drain current (Abs) (ID)0.25 A
Maximum drain current (ID)0.25 A
Maximum drain-source on-resistance6.4 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-226AA
JESD-30 codeO-PBCY-T3
JESD-609 codee1
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeROUND
Package formCYLINDRICAL
Peak Reflow Temperature (Celsius)260
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)0.35 W
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formTHROUGH-HOLE
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
transistor applicationsSWITCHING
Transistor component materialsSILICON
BS107A
Small Signal MOSFET
250 mA, 200 V, N−Channel TO−92
Features
AEC−Q101 Qualified and PPAP Capable
This is a Pb−Free Device*
http://onsemi.com
250 mAMPS, 200 VOLTS
R
DS(on)
= 6.4
W
MAXIMUM RATINGS
Rating
Drain −Source Voltage
Gate−Source Voltage
− Continuous
− Non−repetitive (t
p
50
ms)
Drain Current
Continuous (Note 1)
Pulsed (Note 2)
Total Device Dissipation @ T
A
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
Symbol
V
DS
V
GS
V
GSM
I
D
I
DM
P
D
T
J
, T
stg
Value
200
±
20
±
30
250
500
350
−55 to
150
mW
°C
Unit
Vdc
Vdc
Vpk
mAdc
G (2)
D (1)
S (3)
N−Channel
MARKING
DIAGRAM
A
BS107A
YWW
G
G
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. The Power Dissipation of the package may result in a lower continuous drain
current.
2. Pulse Test: Pulse Width
v
300
ms,
Duty Cycle
v
2.0%.
1
2
3
TO−92
CASE 29−11
STYLE 30
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BS107ARL1G
Package
TO−92
(Pb−Free)
Shipping
2000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2014
1
June, 2014 − Rev. 7
Publication Order Number:
BS107/D
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