Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= full range, T
A
= -40°C to +125°C, unless otherwise specified. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Operating Voltage Range
SYMBOL
V
CC
V
CC
= 5.5V, no load
V
CC
Supply Current
I
CC
V
CC
= 3.6V, no load
V
CC
= 2.5V, no load
V
CC
= 1.8V, no load
V
CC
Reset Threshold
(See Reset Thresholds table)
Reset Threshold Tempco
V
CC
to Reset Delay
T
A
= +25°C
V
TH
T
A
= -40°C to +125°C
∆V
TH
/°C
V
CC
falling at 10mV/µs from V
TH
+ 100mV
to V
TH
- 100mV
D1
D2
Reset Timeout Period
MAX6381–MAX6389
(See Reset Timeout table)
D3
t
RP
D5
D6
D4
D7
MR
timeout period
Reset Timeout Period
MAX6390
t
RP
V
CC
timeout period
V
IL
V
TH
< 4V
MR
Input Voltage
V
IH
V
IL
V
IH
V
TH
> 4V
0.7 x
V
CC
0.8
2.4
D4
D7
D4
D7
1
20
140
280
560
1120
1200
140
150
1120
1200
V
TH
-
1.5%
V
TH
-
2.5%
CONDITIONS
MIN
1.0
7
6
4
3
V
TH
V
TH
60
35
2
40
280
560
1120
2240
2400
280
300
2240
2400
0.3 x
V
CC
V
ms
ms
TYP
MAX
5.5
13
11
7
6
V
TH
+
1.5%
V
V
TH
+
2.5%
ppm/°C
µs
µA
UNITS
V
2
SC70/µDFN, Single/Dual Low-Voltage,
Low-Power µP Reset Circuits
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= full range, T
A
= -40°C to +125°C, unless otherwise specified. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
MR
Minimum Input Pulse Width
MR
Glitch Rejection
MR
to Reset Delay
MR
Internal Pullup Resistance
MAX6381–MAX6389
MAX6390
T
A
= +25°C
RESET IN Input Threshold
V
THRST
T
A
= 0°C to +85°C
T
A
= -40°C to +125°C
RESET IN to RESET Delay
RESET IN Input Leakage Current
Open-Drain
RESET
Output
Voltage
Open-Drain
RESET
Output
Leakage Current
I
RESET IN
V
CC
≥
4.5V, I
SINK
= 3.2mA, reset asserted
V
OL
V
CC
≥
2.5V, I
SINK
= 1.2mA, reset asserted
V
CC
≥
1.0V, I
SINK
= 80µA, reset asserted
I
LKG
V
CC
> V
TH
,
RESET
not asserted
V
CC
≥
4.5V, I
SINK
= 3.2mA, reset asserted
V
OL
Push-Pull
RESET
Output Voltage
V
OH
V
CC
≥
2.5V, I
SINK
= 1.2mA, reset asserted
V
CC
≥
1.0V, I
SINK
= 80µA, reset asserted
V
CC
≥
4.5V, I
SOURCE
= 800µA, reset not
asserted
V
CC
≥
2.5V, I
SOURCE
= 500µA, reset not
asserted
V
CC
≥
4.5V, I
SOURCE
= 800µA, reset asserted
V
CC
≥
2.5V, I
SOURCE
= 500µA, reset asserted
V
OH
V
CC
≥
1.8V, I
SOURCE
= 150µA, reset asserted
Push-Pull RESET Output Voltage
V
CC
≥
1.0V, I
SOURCE
= 1µA, reset asserted
V
CC
≥
4.5V, I
SINK
= 3.2mA, reset not
asserted
V
OL
V
CC
≥
2.5V, I
SINK
= 1.2mA, reset not
asserted
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.4
0.3
V
RESETIN
falling at 4mV/µs from
V
THRST
+ 40mV to V
THRST
- 40mV
-50
32
500
1.245
1.232
1.219
4.5
±1
+50
0.4
0.3
0.3
1.0
0.4
0.3
0.3
V
µA
V
SYMBOL
CONDITIONS
MIN
1
100
200
63
1560
1.27
100
3000
1.295
1.308
1.321
µs
nA
V
TYP
MAX
UNITS
µs
ns
ns
kΩ
Ω
MAX6381–MAX6390
V
Note 1:
Specifications over temperature are guaranteed by design, not production tested.
[i=s]This post was last edited by ljj3166 on 2015-2-18 01:13[/i] I used NXP's stuff a long time ago, but it was under the MDK environment. This time I decided to use NXP's own compilation environment ...
Please tell me where I can download the TCP-based network printing protocol. I am planning to develop network printing functions in an embedded system, and I only found IPP and Internet printing intro...
The board is the NSSTM32F4-R1 development board that I recently made. The schematic diagram has been converted into pdf format and uploaded for sharing....
The common high-speed USB interface currently uses the CY68013 solution of CYPRESS, but the chip programming is relatively complicated. Reference: [url]http://www.amobbs.com/thread-5510241-1-1.html[/u...
CPU: S3C2440; BSP: PB5.0; The problem is: when the system is suspended and then woken up, the LCD screen cannot display and is blank. I would like to ask the experts, what is going on? PS: Other drive...
[color=rgb(0, 0, 0)][font=Arial][size=14px]Common mode voltage: the average value of the phase voltage between each conductor and the specified reference point (usually the earth or the rack). Or the ...
1. Introduction
This design was made for participating in an electronic design competition. It effectively solved the problem of the operation and control of an electric car on a seesaw. The s...[Details]
With the advent of increasingly powerful processors, image sensors, memory, and other semiconductor devices, as well as the algorithms that enable them, computer vision can be implemented in a wide...[Details]
introduction
In the discharge process of tokamak plasma physics, the study of rupture and sawtooth is of great significance. Rupture and sawtooth exist in most tokamaks. Rupture is a notew...[Details]
The data collector of the automatic weather station is generally designed based on a single-chip microcomputer or a PC/104 bus controller. It has the characteristics of good compatibility with PC, low...[Details]
Smart lighting control systems provide high controllability for various buildings and further enhance the level of green energy. They are the core products of energy conservation and digital techn...[Details]
With the continuous consumption of earth's energy and the scarcity of resources, the harm of greenhouse effect to human beings, and the serious pollution of the atmosphere to the earth, the intern...[Details]
The traditional display screen using 51 single-chip microcomputer to control LED dot matrix has relatively simple functions. If it is to achieve diversified functions, it often takes a lot of time ...[Details]
FPGAs are used in 81% of electronic systems, including many commercial and defense products, and most FPGAs use BGA packaging. The BGA packaging is characterized by small solder balls and small sol...[Details]
Continuity test
A variety of devices need to be checked for continuity, including cable assemblies, printed circuit boards, and connectors to ensure that these components have the expected contin...[Details]
Printed circuit boards ( PCBs
)
are used in most electrical products
. If a PCB has low
insulation resistance
(IR), the performance of the circuits on the PCB will be greatly reduced...[Details]
As people's requirements for safety and comfort in the process of driving cars continue to increase, automotive radars are widely used in the car's adaptive cruise system, collision avoidance syste...[Details]
hint:
The number of speakers and their spacing limit the sound field of a portable stereo system.
Spatial audio attempts to artificially recreate the experience of listening to sounds i...[Details]
Liquid crystal display (LCD) panels have a wide range of applications, from small portable electronic devices to large fixed devices, including digital cameras, laptops, personal data assistants, d...[Details]
1 Basic Features
In computer control systems and various intelligent instruments and meters composed of single-chip microcomputers (or microprocessors), various external analog signals must be ...[Details]
With the rapid development of cities and the improvement of citizens' living standards, the number of various vehicles in cities is growing, and the demand for parking spaces in major commercial an...[Details]
NXP MCU
京公网安备 11010802033920号
EEWORLD
