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85411AMILF

Description
High Speed Operational Amplifiers Single Channel High Speed
Categorysemiconductor    Analog mixed-signal IC   
File Size192KB,15 Pages
ManufacturerIDT (Integrated Device Technology, Inc.)
Websitehttp://www.idt.com/
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85411AMILF Overview

High Speed Operational Amplifiers Single Channel High Speed

85411AMILF Parametric

Parameter NameAttribute value
Product CategoryClock Buffer
ManufacturerIDT (Integrated Device Technology, Inc.)
RoHSDetails
Number of Outputs2 Output
Propagation Delay - Max2.5 ns
Supply Voltage - Max3.63 V
Supply Voltage - Min2.97 V
Maximum Operating Temperature+ 85 C
Minimum Operating Temperature- 40 C
Mounting StyleSMD/SMT
Package / CaseSOIC-8
PackagingTube
Height1.5 mm
Length4.9 mm
Operating Supply Current50 mA
Factory Pack Quantity97
Width3.9 mm
Unit Weight0.019048 oz
Low Skew, 1-to-2 Differential-to-LVDS
Fanout Buffer
Data Sheet
85411I
G
ENERAL
D
ESCRIPTION
The 85411I is a low skew, high performance 1-to-2 Differential-
to-LVDS Fanout Buffer and a member of the family of High
Performance Clock Solutions from IDT. The CLK, nCLK pair
can accept most standard differential input levels.The 85411I is
characterized to operate from a 3.3V power supply. Guaranteed
output and part-to-part skew characteristics make the 85411I ideal
for those clock distribution applications demanding well defined
performance and repeatability.
F
EATURES
Two differential LVDS outputs
One differential CLK, nCLK clock input
CLK, nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, SSTL, HCSL
Maximum output frequency: 650MHz
Translates any single ended input signal to
LVDS levels with resistor bias on nCLK input
Output skew: 25ps (maximum)
Part-to-part skew: 300ps (maximum)
Additive phase jitter, RMS: 0.05ps (typical)
Propagation delay: 2.5ns (maximum)
3.3V operating supply
-40°C to 85°C ambient operating temperature
Available in lead free (RoHS 6) package
B
LOCK
D
IAGRAM
CLK
nCLK
Q0
nQ0
Q1
nQ1
P
IN
A
SSIGNMENT
Q0
nQ0
Q1
nQ1
1
2
3
4
8
7
6
5
V
DD
CLK
nCLK
GND
85411I
8-Lead SOIC
3.90mm x 4.90mm x 1.37mm package body
M Package
Top View
©2016 Integrated Device Technology, Inc
1
Revision B January 20, 2016
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