Absolute maximum ratings (AMR) are stress ratings only. Stresses greater than those listed below (Tables 1 and 2) may
cause permanent damage to the device. Operation of the IDTP9165 at AMR is not implied. Exposure to AMR may affect long-
term reliability.
Table 1 – Absolute Maximum Ratings.
PINS
VSEN0 to VGND, VSEN1 to VGND
VINB to VGND
XTAL0 to VGND, XTAL1 to VGND
VBAT to VGND
LDO0 to VGND, LDO1 to VGND
LDO0 to VGND, LDOTR to VGND
LDO3 to VGND, LDO4 to VGND
LDO5 to VGND
LDO6 to VGND, LDO7 to VGND
LDO8 to VGND, LDO9 to VGND
GPIO0 through GPIO7 to VGND
PGNDA to VGND, PGNDB to VGND, PGND1 to VGND
PGND2 to VGND, PGND3 to VGND, EP to VGND
All Other Pins to VGND
Table 2- Package Thermal Information
SYMBOL
θ
JA
θ
JC
θ
JB
T
J
T
A
T
STG
T
LEAD
DESCRIPTION
Thermal Resistance Junction to Ambient (NQG84 – QFN)
Thermal Resistance Junction to Case (NQG84 – QFN)
Thermal Characterization Junction to Board (NQG84 – QFN)
Junction Temperature
Ambient Operating Temperature
Storage Temperature
Lead Temperature (soldering, 10s)
MAXIMUM
RATING
30.6
21.9
1.2
-40 to +125
-40 to +85
-55 to +150
+300
UNIT
°C/W
°C/W
°C/W
°C
°C
°C
°C
MAXIMUM
RATING
-0.3 to 2.2
-0.3 to 20
-0.3 to VINA + 0.3
-0.3 to VSYS + 0.3
-0.3 to VINB + 0.3
-0.3 to VINC + 0.3
-0.3 to VIND + 0.3
-0.3 to VINE + 0.3
-0.3 to VSYS + 0.3
-0.3 to 0.3
-0.3V to 6.0
ABSOLUTE MAXIMUM RATINGS
UNIT
V
V
V
V
V
V
V
V
V
V
V
Note:
The maximum power dissipation is P
D(MAX)
= (T
J(MAX)
- T
A
) / θ
JA
where T
J(MAX)
is 125°C. Exceeding the maximum allowable power dissipation will
result in excessive die temperature, and the device will enter thermal shutdown.This thermal rating was calculated on a JEDEC 4 layer board (4.5”x4.0”),
using a 0.169”x0.169” ePad soldered down, with 16 PCB Thermal vias, arranged in a 4x4 symmetrical array.Actual thermal resistance is affected by PCB
size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.
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