EEWORLDEEWORLDEEWORLD

Part Number

Search

MBRM110ET1G

Description
USB Interface IC USB HS to Dual UART/ FIFO/SPI/JTAG/I2C
CategoryDiscrete semiconductor    diode   
File Size156KB,5 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric View All

MBRM110ET1G Online Shopping

Suppliers Part Number Price MOQ In stock  
MBRM110ET1G - - View Buy Now

MBRM110ET1G Overview

USB Interface IC USB HS to Dual UART/ FIFO/SPI/JTAG/I2C

MBRM110ET1G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
Parts packaging codeDO-216AA
package instructionLEAD FREE, MICRO MINIATURE, PLASTIC, CASE 457-04, POWERMITE-2
Contacts2
Manufacturer packaging code457-04
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time1 week
Is SamacsysN
Shell connectionCATHODE
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.36 V
JEDEC-95 codeDO-216AA
JESD-30 codeR-PSSO-G1
JESD-609 codee3
Humidity sensitivity level1
Maximum non-repetitive peak forward current50 A
Number of components1
Number of terminals1
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current1 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum repetitive peak reverse voltage10 V
surface mountYES
technologySCHOTTKY
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperature40
Base Number Matches1
MBRM110ET1G,
NRVBM110ET1G
Surface Mount
Schottky Power Rectifier
POWERMITE
Power Surface Mount Package
The Schottky POWERMITE
employs the Schottky Barrier
principle with a barrier metal and epitaxial construction that produces
optimal forward voltage drop−reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the POWERMITE
has the same thermal performance as the SMA
while being 50% smaller in footprint area, and delivering one of the
lowest height profiles,
1.1 mm in the industry. Because of its small
size, it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC−DC and
DC−DC converters, reverse battery protection, and “ORing” of
multiple supply voltages and any other application where performance
and size are critical.
Features
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES, 10 VOLTS
ANODE
CATHODE
POWERMITE
CASE 457
PLASTIC
MARKING DIAGRAM
Low I
R
Extends Battery Life
Low Profile
Maximum Height of 1.1 mm
Small Footprint
Footprint Area of 8.45 mm
2
150C Operating Junction Temperature
Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
ESD Ratings:
Human Body Model = 3B (> 16 kV)
Machine Model = V (> 400 V)
AEC−Q101 Qualified and PPAP Capable
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
POWERMITE
is JEDEC Registered as D0−216AA
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 16.3 mg (Approximately)
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Maximum for 10 Seconds
1
M
1E1G
2
M
1E1
G
= Date Code
= Device Code
= Pb−Free Package
ORDERING INFORMATION
Device
MBRM110ET1G
NRVBM110ET1G
MBRM110ET3G
Package
POWERMITE
(Pb−Free)
POWERMITE
(Pb−Free)
POWERMITE
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
12,000 /
Tape & Reel
Mechanical Characteristics:
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
January, 2012
Rev. 3
1
Publication Order Number:
MBRM110E/D

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 758  835  2513  1961  1142  16  17  51  40  23 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号