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PIC32MX370F512L-I-PF

Description
RF Cable Assemblies SMA(F) JK-IPEX MHF U.FL 1.13 100MM
Categorysemiconductor    The embedded processor and controller   
File Size2MB,365 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
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PIC32MX370F512L-I-PF Overview

RF Cable Assemblies SMA(F) JK-IPEX MHF U.FL 1.13 100MM

PIC32MX370F512L-I-PF Parametric

Parameter NameAttribute value
Product Category32-bit Microcontrollers - MCU
ManufacturerMicrochip
RoHSDetails
Mounting StyleSMD/SMT
Package / CaseTQFP-100
CoreMIPS32 M4K
Data Bus Width32 bit
Maximum Clock Frequency100 MHz
Program Memory Size512 kB
Data RAM Size128 kB
ADC Resolution10 bit
Operating Supply Voltage2.3 V to 3.6 V
Maximum Operating Temperature+ 85 C
Interface TypeI2C, SPI, UART
PackagingTray
Data RAM TypeSRAM
Minimum Operating Temperature- 40 C
Moisture SensitiveYes
Number of ADC Channels28
Number of Timers/Counters7 Timer
Processor SeriesPIC32MX
Program Memory TypeFlash
Factory Pack Quantity90
Unit Weight0.023175 oz
PIC32MX330/350/370/430/450/470
32-bit Microcontrollers (up to 512 KB Flash and 128 KB SRAM)
with Audio/Graphics/Touch (HMI), USB, and Advanced Analog
Operating Conditions: 2.3V to 3.6V
• -40ºC to +105ºC (DC to 80 MHz)
• -40ºC to +85ºC (DC to 100 MHz)
• 0ºC to +70ºC (DC to 120 MHz)
Timers/Output Compare/Input Capture
• Five General Purpose Timers:
- Five 16-bit and up to two 32-bit Timers/Counters
• Five Output Compare (OC) modules
• Five Input Capture (IC) modules
• Peripheral Pin Select (PPS) to allow function remap
• Real-Time Clock and Calendar (RTCC) module
Core: 120 MHz/150 DMIPS MIPS32
®
M4K
®
• MIPS16e
®
mode for up to 40% smaller code size
• Code-efficient (C and Assembly) architecture
• Single-cycle (MAC) 32x16 and two-cycle 32x32 multiply
Communication Interfaces
• USB 2.0-compliant Full-speed OTG controller
• Up to five UART modules (20 Mbps):
- LIN 2.1 protocols and IrDA
®
support
• Two 4-wire SPI modules (25 Mbps)
• Two I
2
C modules (up to 1 Mbaud) with SMBus support
• PPS to allow function remap
• Parallel Master Port (PMP)
Clock Management
0.9% internal oscillator
Programmable PLLs and oscillator clock sources
Fail-Safe Clock Monitor (FSCM)
Independent Watchdog Timer
Fast wake-up and start-up
Power Management
• Low-power management modes (Sleep and Idle)
• Integrated Power-on Reset, Brown-out Reset, and High
Voltage Detect
• 0.5 mA/MHz dynamic current (typical)
• 50
μA
I
PD
current (typical)
Direct Memory Access (DMA)
• Four channels of hardware DMA with automatic data
size detection
• 32-bit Programmable Cyclic Redundancy Check (CRC)
• Two additional channels dedicated to USB
Audio/Graphics/Touch HMI Features
External graphics interface with up to 34 PMP pins
Audio data communication: I
2
S, LJ, RJ, USB
Audio data control interface: SPI and I
2
C
Audio data master clock:
- Generation of fractional clock frequencies
- Can be synchronized with USB clock
- Can be tuned in run-time
• Charge Time Measurement Unit (CTMU):
- Supports mTouch™ capacitive touch sensing
- Provides high-resolution time measurement (1 ns)
Input/Output
• 15 mA or 12 mA source/sink for standard V
OH
/V
OL
and
up to 22 mA for non-standard V
OH1
• 5V-tolerant pins
• Selectable open drain, pull-ups, and pull-downs
• External interrupts on all I/O pins
Qualification and Class B Support
• AEC-Q100 REVH (Grade 2 -40ºC to +105ºC) planned
• Class B Safety Library, IEC 60730
Debugger Development Support
In-circuit and in-application programming
4-wire MIPS
®
Enhanced JTAG interface
Unlimited program and six complex data breakpoints
IEEE 1149.2-compatible (JTAG) boundary scan
Advanced Analog Features
• ADC Module:
- 10-bit 1 Msps rate with one Sample and Hold (S&H)
- Up to 28 analog inputs
- Can operate during Sleep mode
• Flexible and independent ADC trigger sources
• On-chip temperature measurement capability
• Comparators:
- Two dual-input Comparator modules
- Programmable references with 32 voltage points
Packages
Type
QFN
TQFP
100
85
0.40
12x12x1
100
85
0.50
14x14x1
VTLA
124
85
0.50
9x9x0.9
Pin Count
64
64
I/O Pins (up to)
53
53
Contact/Lead Pitch
0.50
0.50
Dimensions
9x9x0.9
10x10x1
Note:
All dimensions are in millimeters (mm) unless specified.
2012-2017 Microchip Technology Inc.
DS60001185G-page 1
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