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HSMP-3864-BLKG

Description
RF System on a Chip - SoC BLE 4.2 Wearables SoC AQFN60
CategoryDiscrete semiconductor    diode   
File Size233KB,10 Pages
ManufacturerBroadcom
Environmental Compliance
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RF System on a Chip - SoC BLE 4.2 Wearables SoC AQFN60

HSMP-3864-BLKG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerBroadcom
package instructionR-PDSO-G3
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresLOW DISTORTION
applicationATTENUATOR; SWITCHING
Minimum breakdown voltage50 V
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Nominal diode capacitance0.2 pF
Diode component materialsSILICON
Maximum diode forward resistance22 Ω
Diode resistance test current1 mA
Diode resistance test frequency100 MHz
Diode typePIN DIODE
JESD-30 codeR-PDSO-G3
JESD-609 codee4
Minority carrier nominal lifetime0.5 µs
Humidity sensitivity level1
Number of components2
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Maximum power dissipation0.25 W
Certification statusNot Qualified
Reverse test voltage50 V
surface mountYES
technologyPOSITIVE-INTRINSIC-NEGATIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
HSMP-386x
Surface Mount PIN Diodes
Data Sheet
Description/Applications
The HSMP-386x series of general purpose PIN diodes are
designed for two classes of applications. The first is attenu-
ators where current consumption is the most important
design consideration. The second application for this
series of diodes is in switches where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total Capacitance (C
T
) and Total
Resistance (R
T
) are typical specifications. For applications
that require guaranteed performance, the general purpose
HSMP-383x series is recommended.
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic, carrier
lifetime.
Features
Unique Configurations in Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
Switching
– Low Distortion Switching
– Low Capacitance
Attenuating
– Low Current Attenuating for Less Power
Consumption
Matched Diodes for Consistent Performance
Better Thermal Conductivity for Higher Power
Dissipation
Low Failure in Time (FIT) Rate
[1]
Lead-free
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
Pin Connections and Package Marking, SOT-363
1
2
3
6
5
4
LUx
Notes:
1. Package marking provides orientation, identification, and date code.
2. See “Electrical Specifications” for appropriate package marking.
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