(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Top
Copper Pattern
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Top
Copper Pattern
Footprints and Traces
Material
FR-4
Thickness
70μm
Board Size
114.3mm x 76.2mm x 1.57mmt
(Note 4) Using a PCB board based on JESD51-5, 7.
Material
FR-4
Thickness
70μm
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Copper Pattern
74.2mm x 74.2mm
Thickness
35μm
Thermal Via
(Note 5)
Pitch
Diameter
1.20mm
Φ0.30mm
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70μm
(Note 5) This thermal via connects with the copper pattern of all layers.
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Embedded System
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