Tflex HR600 Series
TM
Innovative
Technology
for a
Connected
World
Thermal Gap Filler
Mid-Performance Gap Filler with 3 W/mK
Tflex
™
HR600 is a cost-effective and compliant gap filler thermal interface material with
excellent thermal performance and great handling for mass-production applications.
The low modulus interface pad conforms to component topography, resulting in little stress
on the components, mating chassis or parts. The softness relieves mechanical stress from
high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex
HR600’s recovery properties for applications requiring material rework result in continued
mechanical integrity even after device rework and re-assembly.
Tflex HR600 is naturally tacky on both sides and requires no additional adhesive coating to
inhibit thermal performance. The tack is designed to hold the pad in place during
assembly and component transport.
Tflex HR600 is electrically insulating, stable from -45ºC thru 200ºC, and meets UL 94V0
flame rating.
Features and Benefits
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Thermal conductivity 3 W/mK
Soft and compliant
Available in thicknesses from 0.010” thru 0.200” (0.25mm thru 5.0mm)
Naturally tacky for adhesion during assembly and transport
Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
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Cooling components to chassis, frame, or other mating components
Memory modules
Home and small office network equipment
Mass storage devices
Automotive electronics
Telecommunication hardware
Radios
LED solid state lighting
Power electronics
LCD and PDP flat panel TV
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices
global
solutions:
local
support
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
Tflex HR600 Series
TM
Thermal Gap Filler
Innovative
Technology
for a
Connected
World
Tflex
TM
HR600 Typical Properties
Tflex
TM
HR600
Test
Method
Construction
Color
Thermal conductivity
Hardness (Shore 00)
Density
Thickness range
Thickness tolerance
UL flammability rating
Temperature range
Volume resistivity
Outgassing TML
Outgassing CVCM
Coefficient Thermal
Expansion (CTE)
Filled silicone
elastomer
Dark Grey
3 W/mK
40
(at 3 second delay)
2.5 g/cc
0.010" - .200"
(0.25 - 5.0mm)
±10%
94 V0
-45ºC to 200ºC
10 ^13 ohm-cm
0.19%
0.07%
217 ppm/C
NA
Visual
ASTM D5470
ASTM D2240
Helium
Pyncometer
UL
NA
ASTM D257
ASTM E595
ASTM E595
IPC-TM-650
2.4.24
Standard Thicknesses
0.010-inch to 0.200-inch (0.25 to 5.0 mm)
0.010-inch and 0.015-inch thick materials come standard with fiberglass reinforcement designated by the suffix “FG”
Options
Proprietary DC1 option available to eliminate tack from one side to aid in handling.
Material Name and Thickness
Tflex™ indicates elastomeric gap filler product line
HR6xxx indicates high recovery ‘6 series’ 3 W/mK material
FG desginates Fiberglass (available in 0.010 and 0.015-inch thickness only)
DC1 designates proprietary option eliminating tack from one side
Examples
Tflex™ HR6120 = 0.120-inch thick material
Tflex™ HR610FG = 0.010-inch thick material with fiberglass reinforecement
Tflex™ HR6120-DC1 = 0.120-inch thick material with proprietary DC1 option
THR-DS-Tflex-HR600 1109
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice.
Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential
uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses.
Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms
and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2009 Laird Technologies, Inc. All Rights Reserved. Laird,
Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other
product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
Document A15999-00 Rev A, 10/2009.
FPGA/CPLD
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