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FMM22-06PF

Description
Power Field-Effect Transistor, 12A I(D), 600V, 0.35ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLASTIC, ISOPLUS, I4PAK-5
CategoryDiscrete semiconductor    The transistor   
File Size96KB,2 Pages
ManufacturerLittelfuse
Websitehttp://www.littelfuse.com
Environmental Compliance
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FMM22-06PF Overview

Power Field-Effect Transistor, 12A I(D), 600V, 0.35ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLASTIC, ISOPLUS, I4PAK-5

FMM22-06PF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerLittelfuse
package instructionIN-LINE, R-PSIP-T5
Reach Compliance Codecompliant
Other featuresAVALANCHE RATED, UL RECOGNIZED
Avalanche Energy Efficiency Rating (Eas)1000 mJ
Shell connectionISOLATED
ConfigurationSERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage600 V
Maximum drain current (Abs) (ID)12 A
Maximum drain current (ID)12 A
Maximum drain-source on-resistance0.35 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PSIP-T5
JESD-609 codee1
Number of components2
Number of terminals5
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)130 W
Maximum pulsed drain current (IDM)66 A
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
Base Number Matches1
Advance Technical Information
PolarHV
TM
HiPerFET
N-Channel Power MOSFET
Phase leg Topology
FMM22-06PF
3
3
5
5
4
4
V
DSS
I
D25
T1
R
DS(on)
t
rr(max)
=
=
600V
12A
350mΩ
Ω
200ns
T2
1
1
2
2
ISOPLUS i4-Pak
TM
Symbol
T
J
T
JM
T
stg
V
ISOLD
T
L
T
SOLD
F
C
Test Conditions
Maximum Ratings
-55 ... +150
150
-55 ... +150
°C
°C
°C
~V
°C
°C
N/lb.
1
Isolated Tab
50/60H
Z
, RMS, t = 1min, leads-to-tab
1.6mm (0.062 in.) from case for 10s
Plastic body for 10s
Mounting force
2500
300
260
20..120 / 4.5..27
5
Features
Silicon chip on Direct-Copper Bond
(DCB) substrate
- UL recognized package
- Isolated mounting surface
- 2500V electrical isolation
Avalanche rated
Low Q
G
Low Drain-to-Tab capacitance
Low package inductance
Advantages
Low gate drive requirement
High power density
Fast intrinsic rectifier
Low drain to ground capacitance
Fast switching
Applications
Symbol
V
DSS
V
DGR
V
GSS
V
GSM
I
D25
I
DM
I
A
E
AS
dV/dt
P
D
Test Conditions
T
J
= 25°C to 150°C
T
J
= 25°C to 150°C, R
GS
= 1MΩ
Continuous
Transient
T
C
= 25°C
T
C
= 25°C, pulse width limited by T
JM
T
C
= 25°C
T
C
= 25°C
I
S
I
DM
, V
DD
V
DSS
, T
J
150°C
T
C
= 25°C
Maximum Ratings
600
600
±
30
±
40
12
66
22
1.0
10
130
V
V
V
V
A
A
A
J
V/ns
W
Symbol
C
P
d
S
,d
A
d
S
,d
A
Weight
Test Conditions
Coupling capacitance between shorted
pins and mounting tab in the case
pin - pin
pin - backside metal
Characteristic Values
Min.
Typ.
Max.
40
1.7
5.5
9
pF
mm
mm
g
DC and AC motor drives
UPS, solar and wind power inverters
Synchronous rectifiers
Multi-phase DC to DC converters
Industrial battery chargers
Switching power supplies
© 2008 IXYS CORPORATION, All rights reserved
DS100038(09/08)

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