5962-9466903QZX datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> 5962-9466903QZX

5962-9466903QZX: Description32-BIT, 50MHz, OTHER DSP, UUC325, DIE-325; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，58 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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5962-9466903QZX Overview

32-BIT, 50MHz, OTHER DSP, UUC325, DIE-325

5962-9466903QZX Parametric

Parameter Name	Attribute value
Parts packaging code	DIE
package instruction	DIE,
Contacts	325
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Address bus width	31
barrel shifter	YES
boundary scan	YES
maximum clock frequency	50 MHz
External data bus width	32
Format	FLOATING POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-XUUC-N325
low power mode	YES
Number of terminals	325
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	SQUARE
Package form	UNCASED CHIP
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class Q
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal location	UPPER
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

5962-9466903QZX Related Products

	5962-9466903QZX	5962-9466902QZC	5962-9466902QZX	5962-9466901QYC	5962-9466901QXA	5962-9466903QZC	5962-9466903QYX	5962-9466903QUX	5962-9466902QUX	5962-9466903QXX
Description	32-BIT, 50MHz, OTHER DSP, UUC325, DIE-325	32-BIT, 40MHz, OTHER DSP, UUC325, DIE-325	32-BIT, 40MHz, OTHER DSP, UUC325, DIE-325	32-BIT, 33.33MHz, OTHER DSP, CQFP352	32-BIT, 33.33MHz, OTHER DSP, CPGA325	32-BIT, 50MHz, OTHER DSP, UUC325, DIE-325	32-BIT, 50MHz, OTHER DSP, CQFP352, CERAMIC, QFP-352	32-BIT, 50MHz, OTHER DSP, UUC324, ENVIRONMENTALLY PROTECTED TAPE AUTOMATED BOND-325	32-BIT, 40MHz, OTHER DSP, UUC324, ENVIRONMENTALLY PROTECTED TAPE AUTOMATED BOND-325	32-BIT, 50MHz, OTHER DSP, CPGA325, CERAMIC, PGA-325
package instruction	DIE,	DIE,	DIE,	QFF, TPAK352,3.0SQ	PGA, SPGA325,35X35MOD	DIE,	QFF,	DIE,	DIE,	PGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	not_compliant	unknown	compliant	unknown	unknown	compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Address bus width	31	31	31	31	31	31	31	31	31	31
barrel shifter	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	50 MHz	40 MHz	40 MHz	33.33 MHz	33.33 MHz	50 MHz	50 MHz	50 MHz	40 MHz	50 MHz
External data bus width	32	32	32	32	32	32	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-XUUC-N325	S-XUUC-N325	S-XUUC-N325	S-CQFP-F352	S-CPGA-P325	S-XUUC-N325	R-CQFP-F352	S-XUUC-N324	S-XUUC-N324	S-CPGA-P325
low power mode	YES	YES	YES	NO	NO	YES	YES	YES	YES	YES
Number of terminals	325	325	325	352	325	325	352	324	324	325
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIE	DIE	DIE	QFF	PGA	DIE	QFF	DIE	DIE	PGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	FLATPACK	GRID ARRAY	UNCASED CHIP	FLATPACK	UNCASED CHIP	UNCASED CHIP	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Qualified	Not Qualified	Not Qualified	Qualified
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	NO	YES	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	NO LEAD	NO LEAD	FLAT	PIN/PEG	NO LEAD	FLAT	NO LEAD	NO LEAD	PIN/PEG
Terminal location	UPPER	UPPER	UPPER	QUAD	PERPENDICULAR	UPPER	QUAD	UPPER	UPPER	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1	1	1	1	1	1	1	1	1	1
Parts packaging code	DIE	DIE	DIE	-	-	DIE	QFP	DIE	DIE	PGA
Contacts	325	325	325	-	-	325	352	324	324	325
Filter level	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	-	-	MIL-PRF-38535 Class Q

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