NAND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | compliant |
| series | TTL/H/L |
| JESD-30 code | R-CDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.02 A |
| Humidity sensitivity level | 2A |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | OPEN-COLLECTOR |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| Maximum supply current (ICC) | 40 mA |
| Prop。Delay @ Nom-Sup | 15 ns |
| propagation delay (tpd) | 15 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | 38535Q/M;38534H;883B |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| 54H01DMQB | 74H01DCQM | 74H01DCQR | 74H01PCQM | 74H01PCQR | 74H01FCQR | 74H01FCQM | |
|---|---|---|---|---|---|---|---|
| Description | NAND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, TTL, CDIP14, | NAND Gate, TTL, CDIP14, | NAND Gate, TTL, PDIP14, | NAND Gate, TTL, PDIP14, | NAND Gate, TTL, CDFP14, | NAND Gate, TTL, CDFP14, |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 code | R-CDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-XDFP-F14 | R-XDFP-F14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| Humidity sensitivity level | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DFP | DFP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| Maximum supply current (ICC) | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA |
| Prop。Delay @ Nom-Sup | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
| Schmitt trigger | NO | NO | NO | NO | NO | NO | NO |
| surface mount | NO | NO | NO | NO | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | - | - | Not Qualified |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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