EEWORLDEEWORLDEEWORLD

Part Number

Search

36-9513-10TLH

Description
IC Socket, DIP36, 36 Contact(s),
CategoryThe connector    socket   
File Size189KB,1 Pages
ManufacturerAries Electronics
Download Datasheet Parametric View All

36-9513-10TLH Overview

IC Socket, DIP36, 36 Contact(s),

36-9513-10TLH Parametric

Parameter NameAttribute value
MakerAries Electronics
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresLOW PROFILE; UL 94V-0
Device slot typeIC SOCKET
Type of equipment usedDIP36
Shell materialGLASS FILLED POLYAMIDE46
Number of contacts36
Base Number Matches1
Series 513 LO-PRO
®
file Collet
Sockets with Solder Tail Pins
FEATURES:
• LO-PRO
®
file Collet Sockets are available with solder tail or wire wrap
pins. Consult Data Sheet No. 12012 for wire wrap pins.
• Choose from several size and plating options.
SPECIFICATIONS:
• Body material is black UL 94V-0 Glass-filled 4/6 Nylon.
• Pin body is Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-00.
• Pin body plating is either 10μ [.25μm] min. Gold per MIL-G-45204 or
200μ [5.08μm] min. 93/7 Tin/Lead per ASTM B545 or 200μ [5.08μm]
min. Tin per ASTM B545 Type 1 over 100μ [2.54μm] min. Nickel per
SAE-AMS-QQ-N-290.
• 4-fingered collet contact is Beryllium Copper Alloy per UNS C17200
ASTM-B194-01.
• Contact plating is either 200μ [5.08μm] min. 93/7 Tin/Lead per ASTM
B545 or 200μ [5.08μm] min Tin per ASTM B545 Type 1 or 10μ [.25μm]
Gold per MIL-G-45204 over 50μ min. [1.27μm] Nickel per SAE-AMS-
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
QQ-N-290. Heavy 30μ [.76μm] Gold Plating also available.
configurations can be furnished, depending on quantities. Aries reserves the
• Contact current rating=3 Amps.
right to change product specifications without notice.
• Insertion Force=180 grams/pin; Withdrawal Force=90 grams/pin; Normal
ORDERING INFORMATION
Force=140 grams/pin; based on a .018 [.46] dia. test lead.
• Operating temperature=221°F [105°C] Tin & Tin/Lead plating
XX-X513-1XXX XX
No. of pins
=257°F [125°C] Gold plating.
(see table)
• Accepts leads .015-.025 [.38-.64] in diameter,
Optional plating suffix:
Row-to-row spacing:
.100-.146 [2.54-3.71] long.
H=Heavy Gold on collet
2: “Y”=.200 [5.08]
MOUNTING CONSIDERATIONS:
T=Tin collet/Tin shell
3
: “Y”=.300 [7.62]
•Suggested PCB hole size=.030 ± .002 [.76 ± .05] dia.
TL=Tin/Lead Collet/
A
LL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
“W”=NO. OF PINS PER ROW X .100 [2.54]
“X”=(NO. OF PINS PER ROW - 1) X .100 [2.54]
4: “Y”=.400 [10.16]
6: “Y”=.600 [15.24]
9: “Y”=.900 [22.86]
Series:
Tin/Lead Shell
Plating:
0=Gold collet/Tin shell
0TL=Gold collet/Tin/Lead
shell
1=Gold collet/Gold shell
Solder tail pin
All tolerances ± .005 [.13]
unless otherwise specified
SOLDER TAIL PIN
Centers “Y”
.200 [5.08]
.300 [7.62]
.400 [10.16]
.600 [15.24]
Dim. “Z”
.300 [5.08]
.400 [10.16
.500 [12.70]
.700 [17.78]
Body Style Available Sizes
A
2 thru 10
C
B
C
C
B
B
2 thru 20
22 thru 40
2 thru 22
2 thru 40
42 thru 48
2 thru 64
.900 [22.86] 1.000 [25.40]
Consult Data Sheet No.
12012 for LO-PRO
®
file
collet sockets with wire
wrap pins.
http://www.arieselec.com • info@arieselec.com
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
NORTH AMERICA
Frenchtown, NJ USA
TEL:(908) 996-6841
FAX:(908) 996-3891
abc
EUROPE
TEL: +44 870 240 0249
FAX: +44 871 919 6033
europe@arieselec.com
12011
REV.G
Please take a look at: About stm32 timer capture
I want to achieve the following function: I want to use the AD built into stm32 to measure 32 points of one cycle of an AC signal. The idea is this: first use TIM4 to detect the zero-crossing point of...
hututu stm32/stm8
Circuit Selection: The driving circuit that some people once said they couldn't understand
In analog technology, as shown in the figure, someone once posted a comment saying that he didn't understand the electro-optical drive circuit shown in the figure. Why do those resistors and diodes ne...
呱呱 Analog electronics
How much do you know about FPGA and IDE?
I really don't know which section to put this question in, because this project is related to FPGA, so I'll put it here for now! Today I received a temporary task to find out about PATA interface desi...
廖欧亚大陆 FPGA/CPLD
Development Trends and Prospects of 3D Packaging
Development Trends and Prospects of 3D Packaging[Source: "Electronics and Packaging"] [Author: Weng Shousong]1 Why develop 3D packaging? So far, in the field of IC chips, SoC (system-on-chip) is the m...
fighting PCB Design
After WinCE enters sleep, the screen appears distorted and flashing when it comes back
As the title says. I wonder if anyone has encountered this before, please teach me....
tom_peng Embedded System
How does the OS know whether it is the USB cable or the power cable that is plugged in?
1. When the USB cable is plugged in, the OS will eject the SD card on the PC; when the power cable is plugged in, the OS will only charge. How does the OS distinguish? 2. When the SD card is unmounted...
Prenow Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 991  645  482  151  2450  20  13  10  4  50 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号