Basic information of BUF03N amplifier:
BUF03N is a BUFFER. The commonly used packaging method is 1.80 X 1.24 MM, DIE-6
BUF03N amplifier core information:
Its peak reflow temperature is NOT SPECIFIED
How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of BUF03N is 220 V/us. The maximum slew rate of BUF03N given by the manufacturer is 25 mA.
The nominal supply voltage of BUF03N is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of BUF03N is 6000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of BUF03N:
BUF03N has 6 terminals. Its terminal position type is: UPPER. Total pins: 6
BUF03N amplifier additional information:
BUF03N is not Rohs certified. The corresponding JESD-30 code is: R-XUUC-N6. The corresponding JESD-609 code is: e0. The packaging code of BUF03N is: DIE. The materials used in the BUF03N package are mostly UNSPECIFIED.
The package shape is RECTANGULAR. BUF03N package pin formats are: UNCASED CHIP. Its terminal forms are: NO LEAD.
Basic information of BUF03N amplifier:
BUF03N is a BUFFER. The commonly used packaging method is 1.80 X 1.24 MM, DIE-6
BUF03N amplifier core information:
Its peak reflow temperature is NOT SPECIFIED
How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of BUF03N is 220 V/us. The maximum slew rate of BUF03N given by the manufacturer is 25 mA.
The nominal supply voltage of BUF03N is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of BUF03N is 6000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of BUF03N:
BUF03N has 6 terminals. Its terminal position type is: UPPER. Total pins: 6
BUF03N amplifier additional information:
BUF03N is not Rohs certified. The corresponding JESD-30 code is: R-XUUC-N6. The corresponding JESD-609 code is: e0. The packaging code of BUF03N is: DIE. The materials used in the BUF03N package are mostly UNSPECIFIED.
The package shape is RECTANGULAR. BUF03N package pin formats are: UNCASED CHIP. Its terminal forms are: NO LEAD.
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ADI |
| Parts packaging code | DIE |
| package instruction | 1.80 X 1.24 MM, DIE-6 |
| Contacts | 6 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Amplifier type | BUFFER |
| Maximum input offset voltage | 6000 µV |
| JESD-30 code | R-XUUC-N6 |
| JESD-609 code | e0 |
| Negative supply voltage upper limit | -18 V |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of functions | 1 |
| Number of terminals | 6 |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Nominal slew rate | 220 V/us |
| Maximum slew rate | 25 mA |
| Supply voltage upper limit | 18 V |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | YES |
| technology | FET |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| BUF03N | BUF03G | |
|---|---|---|
| Description | IC BUFFER AMPLIFIER, UUC6, 1.80 X 1.24 MM, DIE-6, Buffer Amplifier | IC BUFFER AMPLIFIER, UUC6, 1.80 X 1.24 MM, DIE-6, Buffer Amplifier |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | ADI | ADI |
| Parts packaging code | DIE | DIE |
| package instruction | 1.80 X 1.24 MM, DIE-6 | 1.80 X 1.24 MM, DIE-6 |
| Contacts | 6 | 6 |
| Reach Compliance Code | compliant | compliant |
| ECCN code | EAR99 | EAR99 |
| Amplifier type | BUFFER | BUFFER |
| Maximum input offset voltage | 6000 µV | 15000 µV |
| JESD-30 code | R-XUUC-N6 | R-XUUC-N6 |
| JESD-609 code | e0 | e0 |
| Negative supply voltage upper limit | -18 V | -18 V |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V |
| Number of functions | 1 | 1 |
| Number of terminals | 6 | 6 |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIE | DIE |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | UNCASED CHIP |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified |
| Nominal slew rate | 220 V/us | 180 V/us |
| Maximum slew rate | 25 mA | 25 mA |
| Supply voltage upper limit | 18 V | 18 V |
| Nominal supply voltage (Vsup) | 15 V | 15 V |
| surface mount | YES | YES |
| technology | FET | FET |
| Terminal surface | TIN LEAD | TIN LEAD |
| Terminal form | NO LEAD | NO LEAD |
| Terminal location | UPPER | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 |
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