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ZL50418GKG2

Description
LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, LEAD FREE, MS-034, HSBGA-553
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,155 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Environmental Compliance
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ZL50418GKG2 Overview

LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, LEAD FREE, MS-034, HSBGA-553

ZL50418GKG2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerZarlink Semiconductor (Microsemi)
package instructionHBGA,
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B553
JESD-609 codee1
length37.5 mm
Number of functions1
Number of terminals553
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHBGA
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height2.46 mm
Nominal supply voltage2.5 V
surface mountYES
Telecom integrated circuit typesLAN SWITCHING CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width37.5 mm
Base Number Matches1
ZL50418
Managed 16-Port 10/100M + 2-Port
10/100/1000M Layer-2 Ethernet Switch
Data Sheet
Features
Integrated Single-Chip 10/100/1000M Ethernet
Switch
• Sixteen 10/100 Mbps auto-negotiating Fast Ethernet
(FE) ports with RMII or GPSI (7WS) interface
options per port
• Two 10/100/1000M auto-negotiating Gigabit
Ethernet (GE) ports with GMII, TBI, and MII
interface options per port
July 2006
Ordering Information
ZL50418/GKC
ZL50418GKG2
553 Pin HSBGA
553 Pin HSBGA**
**Pb Free Tin/Silver/Copper
-40°C to 85°C
High performance packet classification and
switching at full-wire speed
CPU access supports the following interface
options:
• 8/16-bit ISA interface in managed mode
• Serial interface in unmanaged mode, with optional
I
2
C EEPROM support
Operates stand-alone or can be cascaded
• Stacking port supports hot swap in managed
configuration
Supports two Frame Data Buffer (FDB) memory
domains
(2 MB or 4 MB)
with pipelined, sync-burst
SRAM at 100 MHz
• Applies centralized shared memory architecture
L2 Switching
• MAC address self learning, up to 64K MAC
addresses
• Supports port-based and tagged-based VLAN (IEEE
802.1Q)
• Supports up to 255 VLANs and IP multicast groups
• VLAN tag insertion and stripping selectable on a per
port, per VLAN basis
• Supports spanning tree on per-system (IEEE
802.1D/w) or per-VLAN basis (IEEE 802.1s)
Packet Filtering and Port Security
• Static address filtering for source and/or destination
MAC
• Static MAC address not subject to aging
• Secure mode freezes MAC address learning, each
port may independently use this mode
Supports IP Multicast with IGMP snooping
Supports Ethernet multicasting and broadcasting
and flooding control
Supports per-system option to enable flow
control for best effort frames even on QoS-
enabled ports
VLAN 1 MCT
Frame Data Buffer A
SRAM (1 M / 2 M)
VLAN 1 MCT
Frame Data Buffer B
SRAM (1 M / 2 M)
FDB Interface
LED
FCB
Frame Engine
Search
Engine
MCT
Link
16 x 10/100M
RMII
Ports 0 - 15
GMII/
PCS
Port
24
GMII/
PCS
Port
25
Management
Module
16-bit
Parallel /
Serial
Figure 1 - System Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2006, Zarlink Semiconductor Inc. All Rights Reserved.

ZL50418GKG2 Related Products

ZL50418GKG2
Description LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, LEAD FREE, MS-034, HSBGA-553
Is it Rohs certified? conform to
Maker Zarlink Semiconductor (Microsemi)
package instruction HBGA,
Reach Compliance Code compliant
JESD-30 code S-PBGA-B553
JESD-609 code e1
length 37.5 mm
Number of functions 1
Number of terminals 553
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code HBGA
Package shape SQUARE
Package form GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius) NOT SPECIFIED
Certification status Not Qualified
Maximum seat height 2.46 mm
Nominal supply voltage 2.5 V
surface mount YES
Telecom integrated circuit types LAN SWITCHING CIRCUIT
Temperature level INDUSTRIAL
Terminal surface TIN SILVER COPPER
Terminal form BALL
Terminal pitch 1.27 mm
Terminal location BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED
width 37.5 mm
Base Number Matches 1

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