IC,FILTER,BAND PASS/NOTCH,CMOS,DIP,18PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP18,.3 |
| Reach Compliance Code | unknown |
| Active filter type | SWITCHED CAPACITOR FILTER |
| JESD-30 code | R-PDIP-T18 |
| JESD-609 code | e0 |
| Number of functions | 2 |
| Number of terminals | 18 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Order | 2ND,6TH |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 10 V |
| Certification status | Not Qualified |
| response | BANDPASS/NOTCH |
| Maximum supply current (Isup) | 15 mA |
| Nominal supply voltage (Vsup) | 10 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MC145432P | MC145432L | MC145432PS | |
|---|---|---|---|
| Description | IC,FILTER,BAND PASS/NOTCH,CMOS,DIP,18PIN,PLASTIC | IC,FILTER,BAND PASS/NOTCH,CMOS,DIP,18PIN,CERAMIC | IC,FILTER,BAND PASS/NOTCH,CMOS,DIP,18PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP |
| package instruction | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| Active filter type | SWITCHED CAPACITOR FILTER | SWITCHED CAPACITOR FILTER | SWITCHED CAPACITOR FILTER |
| JESD-30 code | R-PDIP-T18 | R-XDIP-T18 | R-PDIP-T18 |
| JESD-609 code | e0 | e0 | e0 |
| Number of functions | 2 | 2 | 2 |
| Number of terminals | 18 | 18 | 18 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C |
| Order | 2ND,6TH | 2ND,6TH | 2ND,6TH |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| power supply | 10 V | 10 V | 10 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| response | BANDPASS/NOTCH | BANDPASS/NOTCH | BANDPASS/NOTCH |
| Nominal supply voltage (Vsup) | 10 V | 10 V | 10 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 |
| Maximum supply current (Isup) | 15 mA | 15 mA | - |
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