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LTC4301

Description
Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation
File Size225KB,12 Pages
ManufacturerLinear ( ADI )
Websitehttp://www.analog.com/cn/index.html
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LTC4301 Overview

Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation

LTC4301L
Hot Swappable 2-Wire
Bus Buffer with Low Voltage
Level Translation
DESCRIPTIO
The LTC
®
4301L hot swappable, 2-wire bus buffer allows
I/O card insertion into a live backplane without corruption
of the data and clock busses. In addition, the LTC4301L
SDAIN and SCLIN pins are compatible with systems with
pull-up voltages as low as 1V. Control circuitry prevents
the backplane from being connected to the card until a
stop bit or a bus idle is present. When the connection is
made, the LTC4301L provides bidirectional buffering,
keeping the backplane and card capacitances isolated.
When driven low, the CS input pin allows the part to
connect after a stop bit or bus idle occurs. Driving CS high
breaks the connection between SCLIN and SCLOUT and
between SDAIN and SDAOUT. A logic high on READY
indicates that the backplane and card sides are connected
together.
The LTC4301L is offered in 8-pin DFN (3mm
×
3mm) and
MSOP packages.
, LTC and LT are registered trademarks of Linear Technology Corporation.
I
2
C is a trademark of Philips Electronics N.V.
*Patent Pending
FEATURES
s
s
s
s
s
s
s
s
s
s
s
Level Translates 1V Signals to Standard 3.3V and
5V Logic Rails
Allows Bus Pull-Up Voltages as Low as 1V on
SDAIN and SCLIN
Bidirectional Buffer* for SDA and SCL Lines
Increases Fanout
Prevents SDA and SCL Corruption During Live Board
Insertion and Removal from Backplane
Isolates Input SDA and SCL Line from Output
10kV Human Body Model ESD Protection
Supports Clock Stretching, Arbitration and
Synchronization
High Impedance SDA, SCL Pins for V
CC
= 0V
CS Gates Connection from Input to Output
Compatible with I
2
C
TM
, I
2
C Fast Mode and SMBus
Standards (Up to 400kHz Operation)
Small 8-Pin MSOP and DFN (3mm
×
3mm) Packages
APPLICATIO S
s
s
s
s
Hot Board Insertion
Servers
Capacitance Buffer/Bus Extender
Desktop Computers
TYPICAL APPLICATIO
1.2V
Input-Output Connection
3.3V
0.01µF
2k
SDA
µP
SCL
2k
SDAIN
SCLIN
CS
GND
GND
4301l TA01a
V
CC
V
CC
SDAOUT
SCLOUT
READY
LTC4301L
10k
10k
SDA
SCL
OUTPUT
SIDE
20pF
0.5V/DIV
INPUT
SIDE
55pF
U
U
U
1µs/DIV
4301 TA01b
4301lf
1

LTC4301 Related Products

LTC4301 LTC4301LCDD8 LTC4301LIDD8 LTC4301LIMS8
Description Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation
Is it Rohs certified? - incompatible incompatible incompatible
Maker - Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
Parts packaging code - SON SON MSOP
package instruction - HVSON, SOLCC8,.11,20 HVSON, SOLCC8,.11,20 TSSOP, TSSOP8,.19
Contacts - 8 8 8
Reach Compliance Code - compli compli _compli
ECCN code - EAR99 EAR99 EAR99
Interface integrated circuit type - INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 code - S-XDSO-N8 S-XDSO-N8 S-PDSO-G8
JESD-609 code - e0 e0 e0
length - 3 mm 3 mm 3 mm
Humidity sensitivity level - 1 1 1
Number of functions - 1 1 1
Number of terminals - 8 8 8
Maximum operating temperature - 70 °C 85 °C 85 °C
Package body material - UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY
encapsulated code - HVSON HVSON TSSOP
Encapsulate equivalent code - SOLCC8,.11,20 SOLCC8,.11,20 TSSOP8,.19
Package shape - SQUARE SQUARE SQUARE
Package form - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) - 255 255 235
power supply - 3/5 V 3/5 V 3/5 V
Certification status - Not Qualified Not Qualified Not Qualified
Maximum seat height - 0.8 mm 0.8 mm 1.1 mm
Maximum slew rate - 6.2 mA 6.2 mA 6.2 mA
Maximum supply voltage - 5.5 V 5.5 V 5.5 V
Minimum supply voltage - 2.7 V 2.7 V 2.7 V
Nominal supply voltage - 3.3 V 3.3 V 3.3 V
surface mount - YES YES YES
technology - CMOS CMOS CMOS
Temperature level - COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - NO LEAD NO LEAD GULL WING
Terminal pitch - 0.5 mm 0.5 mm 0.65 mm
Terminal location - DUAL DUAL DUAL
Maximum time at peak reflow temperature - 40 40 20
width - 3 mm 3 mm 3 mm

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