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2623Y

Description
Support Circuit, 1-Func, SLIM, HERMETIC SEALED PACKAGE
CategoryWireless rf/communication    Telecom circuit   
File Size176KB,8 Pages
ManufacturerLSC/CSI
Websitehttps://lsicsi.com
Download Datasheet Parametric Compare View All

2623Y Overview

Support Circuit, 1-Func, SLIM, HERMETIC SEALED PACKAGE

2623Y Parametric

Parameter NameAttribute value
MakerLSC/CSI
Parts packaging codeMODULE
package instruction,
Reach Compliance Codeunknown
JESD-30 codeR-XXFO-X
Number of functions1
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFIBER OPTIC
Certification statusNot Qualified
surface mountNO
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelCOMMERCIAL
Terminal formUNSPECIFIED
Terminal locationUNSPECIFIED
Base Number Matches1
Data Sheet
November 2000
10 Gbits/s Lithium Niobate
Electro-Optic Modulator
Features
s
s
s
s
s
s
Ti-diffusion process
Single-drive technology
C- and L-band models
Slim, hermetic package
Bandwidths up to 10 GHz
Operational over a temperature range of 0
°
C to
70
°
C
43
design for minimal electrical reflections
Angled interfaces for minimal optical reflections
Integrated optical attenuator available on
10 Gbits/s modulator (2623CSA)
Tested to
Telcordia Technologies
* 468
s
s
s
s
The Lithium Niobate Modulators include three single-drive
modulators (2623N, 2623Y, 2623CS) and a single-drive modu-
lator with an integrated attenuator (2623CSA). All devices are
capable of modulation rates up to 10 Gbits/s.
Benefits
s
s
s
Excellent long-term bias stability
Internal polarizer
Low modulation voltages
Applications
s
Digital high-speed telecommunications:
— SONET: OC-1 through OC-192
— SDH: STM-16, STM-64
— Undersea communications
Internet data communications
SONET/SDH test equipment
s
s
*
Telcordia Technologies
is a trademark of Bell Communications
Research, Inc.

2623Y Related Products

2623Y 2623CS 2623N 2623CSA
Description Support Circuit, 1-Func, SLIM, HERMETIC SEALED PACKAGE Support Circuit, 1-Func, SLIM, HERMETIC SEALED PACKAGE Support Circuit, 1-Func, SLIM, HERMETIC SEALED PACKAGE Support Circuit, 1-Func, SLIM, HERMETIC SEALED PACKAGE
Maker LSC/CSI LSC/CSI LSC/CSI LSC/CSI
Parts packaging code MODULE MODULE MODULE MODULE
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code R-XXFO-X R-XXFO-X R-XXFO-X R-XXFO-X
Number of functions 1 1 1 1
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FIBER OPTIC FIBER OPTIC FIBER OPTIC FIBER OPTIC
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Terminal location UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Base Number Matches 1 1 1 1
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