90 V/1.0
Ω
, Hermetically Sealed,
Power MOSFET Optocoupler
Technical Data
HSSR-7110
HSSR-7111
HSSR-7112
5962-9314001
5962-9314002
Features
• Dual Marked with Device
Part Number and DSCC
Standard Microcircuit
Drawing
• ac/dc Signal & Power
Switching
• Compact Solid-State
Bidirectional Switch
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534
• MIL-PRF-38534 Class H
• Space Level Processing
Available
• Hermetically Sealed 8-Pin
Dual In-Line Package
• Small Size and Weight
• Performance Guaranteed
over -55
°
C to +125
°
C
• Connection A
0.8 A, 1.0
Ω
• Connection B
1.6 A, 0.25
Ω
• 1500 Vdc Withstand Test
Voltage
• High Transient Immunity
• 5 Amp Output Surge Current
Applications
• Military and Space
• High Reliability Systems
• Standard 28 Vdc and 48 Vdc
Load Driver
• Standard 24 Vac Load Driver
• Aircraft Controls
• ac/dc Electromechanical and
Solid State Relay
Replacement
• I/O Modules
• Harsh Industrial
Environments
constructed in eight-pin,
hermetic, dual-in-line, ceramic
packages. The devices operate
exactly like a solid-state relay.
The products are capable of
operation and storage over the
full military temperature range
and may be purchased as a
standard product (HSSR-7110),
with full MIL-PRF-38534 Class H
testing (HSSR-7111 and HSSR-
7112), or from the DSCC
Standard Microcircuit Drawing
(SMD) 5962-93140.
These devices may be purchased
with a variety of lead bend and
plating options. See Selection
Guide Table for details. Standard
Microcircuit (SMD) parts are
available for each lead style.
Description
The HSSR-7110, HSSR-7111,
HSSR-7112 and SMD 5962-
93140 are single channel power
MOSFET optocouplers,
Functional Diagrams
CONNECTION A
AC/DC CONNECTION
I
O
1 NC
I
F
+ 2
V
F
– 3
4 NC
6
5
–
7
V
O
V
F
– 3
4 NC
6
5
8
+
I
F
+ 2
7
1 NC
8
CONNECTION B
DC CONNECTION
I
O
+
V
O
–
TRUTH TABLE
INPUT
H
L
OUTPUT
CLOSED
OPEN
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
2
All devices are manufactured and
tested on a MIL-PRF-38534 certi-
fied line and are included in the
DSCC Qualified Manufacturers
List, QML-38534 for Hybrid
Microcircuits. Each device
contains an AlGaAs light emitting
diode optically coupled to a
photovoltaic diode stack which
drives two discrete power
MOSFETs. The device operates
as a solid-state replacement for
single-pole, normally open,
(1 Form A) relays used for
general purpose switching of
signals and loads in high
reliability applications.
The devices feature logic level
input control and very low output
on-resistance, making them
suitable for both ac and dc loads.
Connection A, as shown in the
Functional Diagram, allows the
device to switch either ac or dc
loads. Connection B, with the
polarity and pin configuration as
shown, allows the device to
switch dc loads only. The
advantage of Connection B is that
the on-resistance is significantly
reduced, and the output current
capability increases by a factor of
two.
The devices are convenient
replacements for mechanical and
solid state relays where high
component reliability with
standard footprint lead configu-
ration is desirable. Devices may
be purchased with a variety of
lead bend and plating options.
See Selection Guide table for
details. Standard Microcircuit
Drawing (SMD) parts are
available for each package and
lead style.
The HSSR-7110, HSSR-7111,
HSSR-7112 and SMD 5962-
93140 are designed to switch
loads on 28 Vdc power systems.
They meet 80 V surge and
±
600
V spike requirements.
Selection Guide–Package Styles and Lead
Configuration Options
Agilent Part # and Options
Commercial
MIL-PRF-38534 Class H
Standard Lead Finish
Solder Dipped
Butt Joint/Gold Plate
Gull Wing/Soldered
Crew Cut/Gold Plate
SMD Part #
Prescript for all below
Either Gold or Soldered
Gold Plate
Solder Dipped
Butt Joint/Gold Plate
Butt Joint/Soldered
Gull Wing/Soldered
Crew Cut/Gold Plate
Crew Cut/Soldered
HSSR-7110
HSSR-7111
Gold
Option #200
Option #100
Option #300
Option #600
5962-
9314001HPX
9314001HPC
9314001HPA
9314001HYC
9314001HYA
9314001HXA
9314001HZC
9314001HZA
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
HSSR-7112
Gold
Option -200
Option -100
Option -300
5962-
9314002HPX
9314002HPC
9314002HPA
9314002HYC
9314002HYA
9314002HXA
Outline Drawing
8-pin DIP Through Hole
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
3
Device Marking
Agilent DESIGNATOR
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Agilent CAGE CODE*
Absolute Maximum Ratings
Storage Temperature Range ........................................ -65°C to +150°C
Operating Ambient Temperature – T
A
.......................... -55°C to +125°C
Junction Temperature – T
J
......................................................... +150°C
Operating Case Temperature – T
C
......................................... +145°C
[1]
Lead Solder Temperature ............................................... 260°C for 10 s
(1.6 mm below seating plane)
Average Input Current – I
F
........................................................... 20 mA
Peak Repetitive Input Current – I
FPK
............................................ 40 mA
(Pulse Width < 100 ms; duty cycle < 50%)
Peak Surge Input Current – I
FPK
surge ....................................... 100 mA
(Pulse Width < 0.2 ms; duty cycle < 0.1%)
Reverse Input Voltage – V
R
............................................................... 5 V
Average Output Current – Figure 2
Connection A – I
O
....................................................................... 0.8 A
Connection B – I
O
...................................................................... 1.6 A
Single Shot Output Current – Figure 3
Connection A – I
OPK
surge (Pulse width < 10 ms) ...................... 5.0 A
Connection B – I
OPK
surge (Pulse width < 10 ms) ................... 10.0 A
Output Voltage
Connection A – V
O
...................................................... -90 V to +90 V
Connection B – V
O
.......................................................... 0 V to +90 V
Average Output Power Dissipation – Figure 4 ....................... 800 mW
[2]
Thermal Resistance
Maximum Output MOSFET Junction to Case –
θ
JC
= 15°C/W
ESD Classification
(MIL-STD-883, Method 3015) .......................................... (∆∆ ), Class 2
Recommended Operating Conditions
Parameter
Input Current (on)
Input Voltage (off)
Operating Temperature
Input Current (on)
Symbol
I
F(ON)
V
F(OFF)
T
A
I
F(ON)
Min.
5
0
-55
10
Max.
20
0.6
+125
20
Units
mA
V
°C
mA
– reference note 11
– reference note 10
4
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option
is available on commercial and hi-rel product.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and
hi-rel product. DSCC Drawing part numbers contain provisions for lead finish.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product. This option has solder dipped leads.
300
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
600
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option
is available on commercial and hi-rel product.
3.81 (0.150)
MAX.
0.20 (0.008)
0.33 (0.013)
1.02 (0.040)
TYP.
7.36 (0.290)
7.87 (0.310)
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
Note:
Dimensions in millimeters (inches).
5
Electrical Specifications
T
A
=-55°C to +125°C, unless otherwise specified. See note 9.
Group
A, Sub-
group
1, 2, 3
Parameter
Output Withstand
Voltage
Output On-Resistance
Connection A
Sym.
|V
O(OFF)
|
Test Conditions
V
F
= 0.6 V, I
O
= 10
µA
Min. Typ.* Max. Units
90
110
V
Fig.
5
Notes
R
(ON)
1, 2, 3
I
F
= 10 mA, I
O
= 800 mA,
(pulse duration
≤
30 ms
I
F
= 5 mA, I
O
= 800 mA,
(pulse duration
≤
30 ms
I
F
= 10 mA, I
O
= 1.6 A,
(pulse duration
≤
30 ms)
I
F
= 5 mA, I
O
= 1.6 A,
(pulse duration
≤
30 ms)
0.40
1.0
1.0
Ω
6,7
3, 11
3, 10
3, 11
3, 10
Connection B
0.12
0.25
0.25
Output Leakage
Current
Input Forward
Voltage
Input Reverse
Breakdown Voltage
Input-Output
Insulation
Turn On Time
I
O(OFF)
V
F
1, 2, 3
1, 2, 3
V
F
= 0.6 V, V
O
= 90 V,
I
F
= 10 mA
I
F
= 5 mA
1.0
10
-4
1.24
10
1.7
µA
V
8
9
11
10
V
R
I
I-O
1, 2, 3
1
I
R
= 100
µA
RH
≤
45%, t = 5 s,
V
I-O
= 1500 Vdc,
T
A
= 25°C
5.0
1.0
V
µA
4, 5
t
ON
9, 10, 11 I
F
= 10 mA, V
DD
= 28 V,
I
O
= 800 mA
I
F
= 5 mA, V
DD
= 28 V,
I
O
= 800 mA
1.25
6.0
ms
1,10,
11, 12,
13
11
6.0
0.02
0.25
0.25
1000
V/µs
17
ms
1,10,
14,15
10
11
10
Turn Off Time
t
OFF
9,10,11 I
F
= 10 mA,
V
DD
= 28 V, I
O
= 800 mA
I
F
= 5 mA, V
DD
= 28 V,
I
O
= 800 mA
Output Transient
Rejection
Input-Output
Transient Rejection
dVo
dt
dVio
dt
9
V
PEAK
= 50 V,
C
M
= 1000 pF,
C
L
= 15 pF, R
M
≥
1 MΩ
V
DD
= 5 V,
V
I–O(PEAK)
= 50 V,
R
L
= 20 kΩ, C
L
= 15 pF
9
500
V/µs
18
*All typical values are at T
A
= 25°C, I
F(ON)
= 10 mA, V
F(OFF)
= 0.6 V unless otherwise specified.
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