ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DFP, FL20,.3 |
| Reach Compliance Code | compliant |
| series | ACT |
| JESD-30 code | R-GDFP-F20 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.024 A |
| Humidity sensitivity level | 1 |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | INVERTED |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL20,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| propagation delay (tpd) | 10.5 ns |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B |
| Maximum seat height | 2.286 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 6.731 mm |
| Base Number Matches | 1 |
| 54ACTQ533FMQB | 54ACTQ533FMQB/NOPB | 54ACTQ533DMQB | 54ACTQ533LMQB | 54ACTQ533DMQB/NOPB | |
|---|---|---|---|---|---|
| Description | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20 | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20 | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP20 | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20 | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP20 |
| Is it Rohs certified? | incompatible | conform to | incompatible | incompatible | conform to |
| package instruction | DFP, FL20,.3 | DFP, | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, |
| Reach Compliance Code | compliant | compliant | compliant | unknown | compliant |
| series | ACT | ACT | ACT | ACT | ACT |
| JESD-30 code | R-GDFP-F20 | R-GDFP-F20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | DFP | DIP | QCCN | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | NOT SPECIFIED | 260 |
| propagation delay (tpd) | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B |
| Maximum seat height | 2.286 mm | 2.286 mm | 5.08 mm | 1.905 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 6.731 mm | 6.731 mm | 7.62 mm | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| JESD-609 code | e0 | - | e0 | e0 | - |
| MaximumI(ol) | 0.024 A | - | 0.024 A | 0.024 A | - |
| Humidity sensitivity level | 1 | 1 | 1 | - | 1 |
| Encapsulate equivalent code | FL20,.3 | - | DIP20,.3 | LCC20,.35SQ | - |
| power supply | 5 V | - | 5 V | 5 V | - |
| Terminal surface | Tin/Lead (Sn63Pb37) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| length | - | - | 24.51 mm | 8.89 mm | 24.51 mm |