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V62C2802096L-70T

Description
Standard SRAM, 256KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32
Categorystorage    storage   
File Size96KB,10 Pages
ManufacturerMosel Vitelic Corporation ( MVC )
Websitehttp://www.moselvitelic.com
Download Datasheet Parametric View All

V62C2802096L-70T Overview

Standard SRAM, 256KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32

V62C2802096L-70T Parametric

Parameter NameAttribute value
MakerMosel Vitelic Corporation ( MVC )
Parts packaging codeTSOP1
package instructionTSOP1,
Contacts32
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time70 ns
JESD-30 codeR-PDSO-G32
length18.4 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.2 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
width8 mm
Base Number Matches1
V62C2802096L(L)
Ultra Low Power
256K x 8 CMOS SRAM
Features
• Ultra Low-power consumption
- Active: 35mA at 55ns
- Stand-by: 10
µA
(CMOS input/output)
2
µA
CMOS input/output, L version
• Single +2.2V to 2.7V Power Supply_Typical
• Extented Voltage from 2.2 to 3.6V.
• Equal access and cycle time
• 55/70/85/100 ns access time
• Easy memory expansion with CE1, CE2
and OE inputs
• 1.0V data retention mode
• TTL compatible, Tri-state input/output
• Automatic power-down when deselected
• Package available: 32L TSOP(I)/ STSOP(I)
• 48 Ball CSP_BGA
Functional Description
The V62C2802096L is a low power CMOS Static RAM
organized as 262,144 words by 8 bits. Easy memory exp-
ansion is provided by an active LOW CE1, an active
HIGH CE2, an active LOW OE, and Tri-state I/O’s. This
device has an automatic power-down mode feature when
deselected.
Writing to the device is accomplished by taking Chip
Enable 1 (CE1) with Write Enable (WE) LOW, and Chip
Enable 2 (CE2) HIGH. Reading from the device is per-
formed by taking Chip Enable 1 (CE1) with Output
Enable (OE) LOW while Write Enable (WE) and Chip
Enable 2 (CE2) is HIGH. The I/O pins are placed in a
high-impedance state when the device is deselected: the
outputs are disabled during a write cycle.
TheV62C2802096LL comes with a 1V data retention fe-
ature and Lower Standby Power. The V62C2802096L is
avalable in a 32-pin 8 x 20 mm TSOP1 / STSOP 8x13.4 mm
and CSP type 48-fpBGA packages.
Logic Block Diagram
32-Pin TSOP1 / STSOP
(CSP_BGA See next page)
A
11
A
9
A
8
INPUT BUFFER
ROW DECODER
SENSE AMP
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A9
A
13
WE
CE
2
I/O8
Cell Array
A
15
Vcc
A17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
I/O1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A
10
CE1
I/O
8
I/O
7
I/O
6
I/O
5
I/O
4
GND
I/O
3
I/O
2
I/O
1
A
0
A
1
A
2
A
3
COLUMN DECODER
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
CONTROL
CIRCUIT
OE
WE
CE1
CE2
1
REV. 1.1
April
2001 V62C2802096L(L)
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