AM27256JC datasheet, PDF - EEWORLD Datasheet

AM27256JC: DescriptionOTP ROM, 32KX8, 250ns, NMOS, PQCC32, PLASTIC, LCC-32; Categorystorage storage; File Size363KB，15 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27256JC Overview

OTP ROM, 32KX8, 250ns, NMOS, PQCC32, PLASTIC, LCC-32

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	QFJ
package instruction	QCCJ, LDCC32,.5X.6
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	250 ns
I/O type	COMMON
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
length	13.97 mm
memory density	262144 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12.5 V
Certification status	Not Qualified
Maximum seat height	3.556 mm
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	NMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm
Base Number Matches	1

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