2400 Series
A
Shrink DIP Sockets (.070 Pitch)
2400-FPGT-764
FEATURES:
The Augat 2400 Series enables the user to reliably remove or replace
shrink DIP devices (devices on .070 centerline).
• Sleeve body incorporated in socket reduces the risk of solder bridging
during wave solder
• Open ladder design to permit device cooling
• Open ladder design makes available additional space within socket for
component placement
• Non-wicking, closed bottom, machined sleeve protects 100% against
flux or solder contamination
• Concentric funnel entry for easy insertion of flat or round IC leads
•
Recognized under the Component Program of Underwriters
®
Laboratories, Inc. File No. E111362
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G’s
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 200 Grams with .018" (0,46) dia. polished
steel pin (typ.)
Inner Contact
Retention .................... 7.5 Lbs. per line average
Sleeve Retention
in Plastic .................... 3.0 Lbs. per line minimum
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force .............. 179 grams (6.3 oz.) average with a .018" (0,46)
dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms max.
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55°C to +125°C,
Tin/lead inner contact -55°C to +105°C
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .062' (1,57)
• PCB Hole Size Range: .035"± .003" (0,89
±
0,08)
• IC Pin Dimension Range: .016" to .021" (0,41 to 0,53) dia.
.105" (2,67) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester UL rated 94V-0
Outer Sleeve .................. Machined brass/formed copper, tin/lead plated
Inner Contact .................. Beryllium copper, gold or tin/lead plated
Quality & Innovation From The
Product Group
A18
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805