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MC74LCX574

Description
LOW-VOLTAGE CMOS OCTAL D-TYPE FLIP-FLOP
File Size103KB,8 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MC74LCX574 Overview

LOW-VOLTAGE CMOS OCTAL D-TYPE FLIP-FLOP

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Low-Voltage CMOS
Octal D-Type Flip-Flop
Flow Through Pinout
With 5V-Tolerant Inputs and Outputs
(3-State, Non-Inverting)
The MC74LCX574 is a high performance, non–inverting octal D–type
flip–flop operating from a 2.7 to 3.6V supply. High impedance TTL
compatible inputs significantly reduce current loading to input drivers
while TTL compatible outputs offer improved switching noise
performance. A VI specification of 5.5V allows MC74LCX574 inputs to be
safely driven from 5V devices.
The MC74LCX574 consists of 8 edge–triggered flip–flops with
individual D–type inputs and 3–state true outputs. The buffered clock and
buffered Output Enable (OE) are common to all flip–flops. The eight
flip–flops will store the state of individual D inputs that meet the setup and
hold time requirements on the LOW–to–HIGH Clock (CP) transition. With
the OE LOW, the contents of the eight flip–flops are available at the
outputs. When the OE is HIGH, the outputs go to the high impedance
state. The OE input level does not affect the operation of the flip–flops.
The LCX574 flow through design facilitates easy PC board layout.
MC74LCX574
LOW–VOLTAGE CMOS
OCTAL D–TYPE FLIP–FLOP
20
1
DW SUFFIX
PLASTIC SOIC
CASE 751D–04
Designed for 2.7 to 3.6V VCC Operation
5V Tolerant — Interface Capability With 5V TTL Logic
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0V
LVTTL Compatible
LVCMOS Compatible
24mA Balanced Output Sink and Source Capability
20
1
1
20
M SUFFIX
PLASTIC SOIC EIAJ
CASE 967–01
Near Zero Static Supply Current in All Three Logic States (10µA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds 500mA
SD SUFFIX
PLASTIC SSOP
CASE 940C–03
ESD Performance: Human Body Model >2000V; Machine Model >200V
20
1
DT SUFFIX
PLASTIC TSSOP
CASE 948E–02
Pinout: 20–Lead
(Top View)
VCC
20
O0
19
O1
18
O2
17
O3
16
O4
15
O5
14
O6
13
O7
12
CP
11
PIN NAMES
Pins
OE
CP
D0–D7
O0–O7
Function
Output Enable Input
Clock Pulse Input
Data Inputs
3–State Outputs
1
OE
2
D0
3
D1
4
D2
5
D3
6
D4
7
D5
8
D6
9
D7
10
GND
9/95
©
Motorola, Inc. 1996
1
REV 2

MC74LCX574 Related Products

MC74LCX574 MC74LCX574SD MC74LCX574M MC74LCX574DT
Description LOW-VOLTAGE CMOS OCTAL D-TYPE FLIP-FLOP LOW-VOLTAGE CMOS OCTAL D-TYPE FLIP-FLOP LOW-VOLTAGE CMOS OCTAL D-TYPE FLIP-FLOP LOW-VOLTAGE CMOS OCTAL D-TYPE FLIP-FLOP
Maker - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
Parts packaging code - SSOP SOIC TSSOP
package instruction - SSOP, SOP, TSSOP,
Contacts - 20 20 20
Reach Compliance Code - unknow unknow unknow
Other features - BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374
series - LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code - R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
JESD-609 code - e0 e0 e0
length - 7.2 mm 12.575 mm 6.5 mm
Load capacitance (CL) - 50 pF 50 pF 50 pF
Logic integrated circuit type - BUS DRIVER BUS DRIVER BUS DRIVER
Number of digits - 8 8 8
Number of functions - 1 1 1
Number of ports - 2 2 2
Number of terminals - 20 20 20
Maximum operating temperature - 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C
Output characteristics - 3-STATE 3-STATE 3-STATE
Output polarity - TRUE TRUE TRUE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SSOP SOP TSSOP
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd) - 9.5 ns 9.5 ns 9.5 ns
Certification status - Not Qualified Not Qualified Not Qualified
Maximum seat height - 2 mm 2.05 mm 1.2 mm
Maximum supply voltage (Vsup) - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 2 V 2 V 2 V
Nominal supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V
surface mount - YES YES YES
technology - CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - GULL WING GULL WING GULL WING
Terminal pitch - 0.65 mm 1.27 mm 0.65 mm
Terminal location - DUAL DUAL DUAL
width - 5.3 mm 5.275 mm 4.4 mm

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