100% pin-to-pin drop-in replacement to quartz-based XO
Excellent total frequency stability as low as ±20 ppm
Operating temperature from -40°C to 85°C. For 125°C and/
or -55°C options, refer to
SiT8919
and
SiT8921
Low power consumption of 4.9 mA typical at 1.8V
Standby mode for longer battery life
Fast startup time of 5 ms
LVCMOS/HCMOS compatible output
Industry-standard packages: 2.0 x 1.6, 2.5 x 2.0, 3.2 x 2.5,
5.0 x 3.2, 7.0 x 5.0 mm x mm
Instant samples with
Time Machine II
and
Field Programmable
Oscillators
RoHS and REACH compliant, Pb-free, Halogen-free and
Antimony-free
For AEC-Q100 oscillators, refer to
SiT8924
and
SiT8925
Ideal for GPON/EPON, network switches, routers,
servers, embedded systems
Ideal for Ethernet, PCI-E, DDR, etc.
Electrical Characteristics
All Min and Max limits are specified over temperature and rated operating voltage with 15 pF output load unless otherwise
stated. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics
Parameters
Output Frequency Range
Frequency Stability
Symbol
f
F_stab
Min.
115
-20
-25
-50
Operating Temperature Range
T_use
-20
-40
Supply Voltage
Vdd
1.62
2.25
2.52
2.7
2.97
2.25
Current Consumption
Idd
–
–
–
OE Disable Current
Standby Current
I_OD
I_std
–
–
–
–
–
Duty Cycle
Rise/Fall Time
DC
Tr, Tf
45
–
–
–
Output High Voltage
Output Low Voltage
VOH
VOL
90%
–
Typ.
–
–
–
–
–
–
1.8
2.5
2.8
3.0
3.3
–
6.2
5.5
4.9
–
–
2.6
1.4
0.6
–
1
1.3
0.8
–
–
Max.
137
+20
+25
+50
+70
+85
1.98
2.75
3.08
3.3
3.63
3.63
7.5
6.4
5.6
4.2
4.0
4.3
2.5
1.3
55
2
2.5
2
–
10%
Unit
MHz
ppm
ppm
ppm
°C
°C
V
V
V
V
V
V
mA
mA
mA
mA
mA
A
A
A
%
ns
ns
ns
Vdd
Vdd
No load condition, f = 125 MHz, Vdd = 2.8V, 3.0V, 3.3V or
2.25 to 3.63V
No load condition, f = 125 MHz, Vdd = 2.5V
No load condition, f = 125 MHz, Vdd = 1.8V
Vdd = 2.5V to 3.3V, OE = GND, Output in high-Z state
Vdd = 1.8V, OE = GND, Output in high-Z state
ST = GND, Vdd = 2.8V to 3.3V, Output is weakly pulled down
̅ ̅̅
ST = GND, Vdd = 2.5V, Output is weakly pulled down
̅ ̅̅
ST = GND, Vdd = 1.8V, Output is weakly pulled down
̅ ̅̅
All Vdds
Vdd = 2.5V, 2.8V, 3.0V or 3.3V, 20% - 80%
Vdd =1.8V, 20% - 80%
Vdd = 2.25V - 3.63V, 20% - 80%
IOH = -4 mA (Vdd = 3.0V or 3.3V)
IOL = 4 mA (Vdd = 3.0V or 3.3V)
Inclusive of Initial tolerance at 25°C, 1
st
year aging at 25°C,
and variations over operating temperature, rated power
supply voltage and load.
Condition
Frequency Range
Frequency Stability and Aging
Operating Temperature Range
Extended Commercial
Industrial
Contact
SiTime
for 1.5V support
Supply Voltage and Current Consumption
LVCMOS Output Characteristics
Rev 1.04
January 30, 2018
www.sitime.com
SiT8009B
High Frequency, Low Power Oscillator
Table 1. Electrical Characteristics (continued)
Parameters
Input High Voltage
Input Low Voltage
Input Pull-up Impedance
Symbol
Min.
Typ.
–
–
87
Max.
–
30%
150
Unit
Pin 1, OE or ST
̅ ̅̅
Pin 1, OE or ST
̅ ̅̅
Pin 1, OE logic high or logic low, or ST logic high
Condition
Input Characteristics
VIH
VIL
Z_in
70%
–
50
2
Startup Time
Enable/Disable Time
Resume Time
RMS Period Jitter
T_start
T_oe
T_resume
T_jitt
–
–
–
–
–
Peak-to-peak Period Jitter
T_pk
–
–
RMS Phase Jitter (random)
T_phj
–
–
Vdd
Vdd
k
–
–
Pin 1, ST logic low
̅ ̅̅
M
Startup and Resume Timing
–
–
–
5
122
5
Jitter
1.9
1.8
12
14
0.5
1.3
3
4
25
30
0.9
2
ps
ps
ps
ps
ps
ps
f = 125 MHz, Vdd = 2.5V, 2.8V, 3.0V or 3.3V
f = 125 MHz, Vdd = 1.8V
f = 125 MHz, Vdd = 2.5V, 2.8V, 3.0V or 3.3V
f = 125 MHz, Vdd = 1.8V
Integration bandwidth = 900 kHz to 7.5 MHz
Integration bandwidth = 12 kHz to 20 MHz
ms
ns
ms
Measured from the time Vdd reaches its rated minimum value
f = 137 MHz. For other frequencies, T_oe = 100 ns + 3 * cycles
Measured from the time ST pin crosses 50% threshold
̅ ̅̅
Table 2. Pin Description
Pin
Symbol
[1]
Functionality
Output Enable
H : specified frequency output
L: output is high impedance. Only output driver is disabled.
H
[1]
: specified frequency output
L: output is low (weak pull down). Device goes to sleep mode. Supply
current reduces to I_std.
Any voltage between 0 and Vdd or Open
[1]
: Specified frequency
output. Pin 1 has no function.
Electrical ground
Oscillator output
Power supply voltage
[2]
OE/ST/NC
Top View
1
OE/ST /NC
̅ ̅̅
Standby
No Connect
2
3
4
GND
OUT
VDD
Power
Output
Power
Figure 1. Pin Assignments
Notes:
1. In OE or ST mode, a pull-up resistor of 10 kΩ or less is recommended if pin 1 is not externally driven. If pin 1 needs to be left floating, use the NC option.
̅ ̅̅
2. A capacitor of value 0.1 µF or higher between Vdd and GND is required.
Rev 1.04
Page 2 of 17
www.sitime.com
SiT8009B
High Frequency, Low Power Oscillator
Table 3. Absolute Maximum Limits
Attempted operation outside the absolute maximum ratings may cause permanent damage to the part.
Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.
Parameter
Storage Temperature
Vdd
Electrostatic Discharge
Soldering Temperature (follow standard Pb free
soldering guidelines)
Junction Temperature
[3]
Min.
-65
-0.5
–
–
–
Max.
150
4
2000
260
150
Unit
°C
V
V
°C
°C
Note:
3. Exceeding this temperature for extended period of time may damage the device.
Table 4. Thermal Consideration
[4]
Package
7050
5032
3225
2520
2016
Note:
4. Refer to JESD51 for
JA
and
JC
definitions, and reference layout used to determine the
JA
and
JC
values in the above table.
JA, 4 Layer Board
(°C/W)
142
97
109
117
152
JA, 2 Layer Board
(°C/W)
273
199
212
222
252
JC, Bottom
(°C/W)
30
24
27
26
36
Table 5. Maximum Operating Junction Temperature
[5]
Max Operating Temperature (ambient)
70°C
85°C
Maximum Operating Junction Temperature
80°C
95°C
Note:
5. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature.
Table 6. Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Temperature Cycle
Solderability
Moisture Sensitivity Level
Condition/Test Method
MIL-STD-883F, Method 2002
MIL-STD-883F, Method 2007
JESD22, Method A104
MIL-STD-883F, Method 2003
MSL1 @ 260°C
Rev 1.04
Page 3 of 17
www.sitime.com
SiT8009B
High Frequency, Low Power Oscillator
Test Circuit and Waveform
[6]
Vdd
Vout
Test Point
tr
4
Power
Supply
0.1 uF
1
2
3
15pF
(including probe
and fixture
capacitance)
tf
80% Vdd
50%
20% Vdd
High Pulse
(TH)
Period
Low Pulse
(TL)
Vdd
OE/ST Function
1 kΩ
Figure 2. Test Circuit
Note:
6. Duty Cycle is computed as Duty Cycle = TH/Period.
Figure 3. Waveform
Timing Diagrams
90% Vdd
Vdd
Vdd
50% Vdd
[7]
Pin 4 Voltage
T_start
No Glitch
during start up
ST Voltage
T_resume
CLK Output
HZ
T_start: Time to start from power-off
CLK Output
HZ
T_resume: Time to resume from ST
Figure 4. Startup Timing (OE/ ST̅ Mode)
̅ ̅
Figure 5. Standby Resume Timing ( ST̅ Mode Only)
̅ ̅
Vdd
50% Vdd
OE Voltage
T_oe
Vdd
OE Voltage
50% Vdd
T_oe
CLK Output
HZ
T_oe: Time to re-enable the clock output
CLK Output
HZ
T_oe: Time to put the output in High Z mode
Figure 6. OE Enable Timing (OE Mode Only)
Figure 7. OE Disable Timing (OE Mode Only)
Note:
7. SiT8009 has “no runt” pulses and “no glitch” output during startup or resume.
I want to write a program that outputs a square wave of 100ms on p1.1 (t1 is used as an interrupt). I debugged it using assembly, but c doesn't respond! I don't know where I went wrong.#includereg51.h...
[i=s]This post was last edited by fjjjnk1234 on 2015-10-11 10:39[/i] [size=5]I saw a black and gold Cyclone II FPGA development board on Taobao second-hand market in July and bought it on impulse. I w...
Does C code have a significant or greater efficiency advantage over C++ code in embedded development? How big is the difference between the two in today's hardware development? Is C++ really not neede...
WEBENCH Design Environments are unique and powerful software tools that deliver custom power, lighting, filtering, clocking and sensing designs in seconds. These easy-to-use tools help you create, opt...
Today's security industry has entered the era of massive networking. Many enterprises, especially financial institutions, have established multi-level video surveillance networking platforms. Lever...[Details]
Based on a survey of more than ten intelligent robot companies, this article sorts out and analyzes the current development status of the intelligent industry and the challenges and differences it ...[Details]
The automotive industry in 2025 is undergoing a thorough intelligent reshuffle.
Geely wants to make changes in the field of AI cockpits: in the future, there will be no traditional smart...[Details]
Electric vehicles are now widespread, but they've brought with them a host of problems, the most prominent of which is charging. Small electric vehicles (EVs) are a new form of transportation in a ...[Details]
Electric vehicles are powered by electricity, and charging is a device that supplements the vehicle's energy source. It is common to need to recharge the vehicle when driving. But can you charge th...[Details]
In the field of intelligent driving, regulations are becoming increasingly stringent, and the technical threshold continues to rise. Especially after the traffic accident in March 2025, the Ministr...[Details]
In daily life, when we purchase a transformer, we are faced with the installation and wiring procedures. Generally speaking, large transformers such as power transformers are equipped with speciali...[Details]
The range of an electric vehicle is crucial to the driving experience, and range anxiety is a common headache when driving an electric vehicle. Although the latest electric vehicles can achieve a r...[Details]
Summer is the peak season for buying and using air conditioners. Do you pay attention to the energy efficiency of your air conditioner? Did you buy a DC inverter air conditioner? Do you know the re...[Details]
As a core component of electric vehicles, power batteries, like batteries for other electronic products, inevitably experience degradation after a certain period of use due to their characteristics...[Details]
Charge your electric car for just six minutes and you'll get 1,000 kilometers! This isn't just a scene from a science fiction film, but a reality made possible by Guoxuan High-Tech's Jinshi solid-s...[Details]
Arm helps automakers bring new models to market at least a year earlier.
Zena CSS accelerates software and silicon development, enabling faster and more efficient delivery of AI cap...[Details]
With the improvement of China's supporting infrastructure and the accumulation of technology and capital, demand for industrial automation and intelligent applications of machine vision technology ...[Details]
Motor potting compound is a high-performance sealing material widely used for motor encapsulation and insulation. It is essential for motor protection and packaging. Its ideal moisture and water re...[Details]
New energy electric vehicles are energy-saving, environmentally friendly, have low operating costs, and enjoy strong support from national policies. With the growth in sales of new energy electric ...[Details]