6N140A, HCPL-675x, 83024, HCPL-570x,
HCPL-177K, 5962-89810, HCPL-573x,
HCPL-673x, 5962-89785, 5962-98002
1
Hermetically Sealed, Low I
F
, Wide V
CC
, High Gain
Optocouplers
Data Sheet
Description
These units are single, dual, and quad channel, hermetically
sealed optocouplers. The products are capable of operation
and storage over the full military temperature range and can
be purchased as either commercial product or with full
MIL-PRF-38534 Class Level H or K testing or from the
appropriate DLA Standard Microcircuit Drawing (SMD). All
devices are manufactured and tested on a MIL-PRF-38534
certified line, and Class H and K devices are included in the DLA
Qualified Manufacturers List QML-38534 for Hybrid
Microcircuits.
Each channel contains a GaAsP light emitting diode that is
optically coupled to an integrated high gain photon detector.
The high gain output stage features an open collector output,
providing both lower saturation voltage and higher signaling
speed than possible with conventional photo-Darlington
optocouplers. The shallow depth and small junctions offered
by the IC process provides better radiation immunity than
conventional photo transistor optocouplers.
The supply voltage can be operated as low as 2.0V without
adversely affecting the parametric performance.
These devices have a 300% minimum CTR at an input current
of only 0.5 mA making them ideal for use in low input current
applications such as MOS, CMOS, low power logic interfaces or
line receivers. Compatibility with high-voltage CMOS logic
systems is assured by specifying I
CCH
and I
OH
at 18 Volts.
Features
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
Manufactured and tested on a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Five hermetically sealed package configurations
Performance guaranteed over full military temperature
range: –55°C to +125°C
Low input current requirement: 0.5 mA
High current transfer ratio: 1500% typical at I
F
= 0.5 mA
Low output saturation voltage: 0.11V typical
1500 Vdc withstand test voltage
High radiation immunity
6N138/9, HCPL-2730/31 function compatibility
Reliability data
Applications
CAUTION
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation which may be induced by ESD.
Military and aerospace
High reliability systems
Microprocessor system interface
Transportation, medical, and life critical systems
Isolated input line receiver
EIA RS-232-C line receiver
Voltage level shifting
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Current loop receiver
System test equipment isolation
Process control input/output isolation
1.
See
Selection Guide–Package Styles and Lead Configuration
Options
for available extensions.
Broadcom
-1-
6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x,
5962-89785, 5962-98002
Data Sheet
Functional Diagram
Functional Diagram
Multiple channel devices available.
1
2
3
4
8
7
6
5
Package styles for these parts are 8-pin and 16-pin DIP through
hole (case outlines P and E respectively), 16-pin DIP flat pack
(case outline F), and leadless ceramic chip carrier (case outline
2). Devices may be purchased with a variety of lead bend and
plating options. See
Selection Guide–Package Styles and Lead
Configuration Options
for details. Standard Military Drawing
(SMD) parts are available for each package and lead style.
Because the same electrical die (emitters and detectors) are
used for each channel of each device listed in this data sheet,
absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance
characteristics shown in the figures are similar for all parts
except as noted. Additionally, the same package assembly
processes and materials are used in all devices. These
similarities justify the use of a common data base for die
related reliability and certain limited radiation test results.
Truth Table
(Positive Logic)
Input
On (H)
Off (L)
L
H
Output
NOTE
The connection of a 0.1-μF bypass capacitor
between V
CC
and GND is recommended.
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Part Number and Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class K
Standard Lead Finish
Solder Dipped
b
Butt Cut/Gold Plate
a
Gull Wing/Soldered
b
Crew Cut/Gold Plate
a
Class H SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
None
8302401EC
8302401EA
5962-
8981001PC
8981001PA
5962-
8978501PC
8978501PA
None
8302401FC
89785022A
5962-
6N140A
6N140A/883B
HCPL-177K
Gold Plate
a
Option #200
Option #100
Option #300
Option #600
HCPL-5700
HCPL-5701
HCPL-570K
Gold Plate
a
Option #200
Option #100
Option #300
Option #600
HCPL-5730
HCPL-5731
HCPL-573K
Gold Plate
a
Option #200
Option #100
Option #300
Option #600
HCPL-6750
HCPL-6751
HCPL-675K
Gold Plate
a
HCPL-6730
HCPL-6731
HCPL-673K
Solder Pads
b
16-pin DIP
Through Hole
4
V
CC
, GND
8-pin DIP
Through Hole
1
None
8-pin DIP
Through Hole
2
V
CC
, GND
16-pin Flat Pack
Unformed Leads
4
V
CC
, GND
20-Pad LCCC
Surface Mount
2
None
Broadcom
-2-
6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x,
5962-89785, 5962-98002
Data Sheet
Functional Diagrams
Package
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
Crew Cut/Gold Plate
a
Crew Cut/Soldered
b
Class K SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
Crew Cut/Gold Plate
a
Crew Cut/Soldered
b
a.
b.
Solder lead finish: Sn63/Pb37.
16-pin DIP
8302401YC
8302401YA
8302401XA
8302401ZC
8302401ZA
8-pin DIP
8981001YC
8981001YA
8981001XA
8-pin DIP
8978501YC
8978501YA
8978501ZA
16-pin Flat Pack
20-Pad LCCC
5962-
9800201KEC
9800201KEA
9800201KYC
9800201KYA
9800201KXA
9800201KZC
9800201KZA
5962-
8981002KPC
8981002KPA
8981002KYC
8981002KYA
8981002KXA
5962-
8978503KPC
8978503KPA
8978503KYC
8978503KYA
8978503KZA
5962-
9800201KFC
5962-
8978504K2A
Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches.
Functional Diagrams
16-pin DIP
Through Hole
4 Channels
1
2
16
8-pin DIP
Through Hole
1 Channel
1
8
8-pin DIP
Through Hole
2 Channels
1
8
16-pin Flat Pack
Unformed Leads
4 Channels
1
2
16
15
15
14
14
13
20-Pad LCCC
Surface Mount
2 Channels
15
VCC2
19
20
2
3
GND1
7
VO2
GND2
13
12
10
15
2
7
2
7
3
14
13
12
11
10
9
3
6
3
6
3
4
5
6
7
VCC1
4
5
6
4
5
4
5
VO1
8
12
11
7
8
10
9
8
NOTE
All DIP and flat pack devices have common V
CC
and ground. LCCC (leadless ceramic chip carrier) package has
isolated channels with separate V
CC
and ground connections. All diagrams are top view.
Broadcom
-3-
6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x,
5962-89785, 5962-98002
Data Sheet
Leaded Device Marking
Leaded Device Marking
Avago LOGO
Avago P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
X 50434
[1] QML PARTS ONLY
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE
[1]
Leadless Device Marking
Avago LOGO
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
X XXXX
XXXXXX
XXX 50434
[1] QML PARTS ONLY
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
DLA SMD
[1]
DLA SMD
[1]
Avago CAGE CODE
[1]
Outline Drawings
16-Pin DIP Through Hole, 4 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
Note: Dimensions in millimeters (inches).
16-Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
8.13 (0.320)
MAX.
2.84 (0.112)
MAX.
0.88 (0.0345)
MIN.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
9.14 (0.360)
8.64 (0.340)
0.30 (0.012)
0.23 (0.009)
Note: Dimensions in millimeters (inches).
Broadcom
-4-
Microcontroller MCU
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