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MC74HC11AD

Description
Triple 3-Input AND Gate
Categorylogic    logic   
File Size80KB,5 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC74HC11AD Overview

Triple 3-Input AND Gate

MC74HC11AD Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
Parts packaging codeSOIC
package instructionSOP, SOP14,.25
Contacts14
Reach Compliance Codeunknow
seriesHC/UH
JESD-30 codeR-PDSO-G14
JESD-609 codee0
length8.65 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeAND GATE
MaximumI(ol)0.0024 A
Number of functions3
Number of entries3
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2/6 V
Prop。Delay @ Nom-Su75 ns
propagation delay (tpd)145 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.75 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Advance Information
MC74HC11A
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
1
Triple 3-Input AND Gate
High–Performance Silicon–Gate CMOS
The MC74HC11A is identical in pinout to the LS11. The device inputs are
compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LSTTL outputs.
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1
µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 60 FETs or 15 Equivalent Gates
LOGIC DIAGRAM
1
A1
2
B1
13
C1
3
A2
4
B2
5
C2
9
A3
10
B3
11
C3
PIN 14 = VCC
PIN 7 = GND
14
14
1
D SUFFIX
SOIC PACKAGE
CASE 751A–03
14
1
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
ORDERING INFORMATION
MC74HCXXAN
MC74HCXXAD
MC74HCXXADT
Plastic
SOIC
TSSOP
12
Y1
6
Y2
Y = ABC
PIN ASSIGNMENT
A1
B1
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VCC
C1
Y1
C3
B3
A3
Y3
8
Y3
A2
B2
C2
Y2
GND
FUNCTION TABLE
Inputs
A
L
X
X
H
B
X
L
X
H
C
X
X
L
H
Output
Y
L
L
L
H
This document contains information on a new product. Specifications and information herein are subject to
change without notice.
12/97
©
Motorola, Inc. 1997
1
REV 0

MC74HC11AD Related Products

MC74HC11AD MC74HC11AN MC74HC11ADT
Description Triple 3-Input AND Gate Triple 3-Input AND Gate Triple 3-Input AND Gate
Is it Rohs certified? incompatible incompatible incompatible
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
package instruction SOP, SOP14,.25 DIP, DIP14,.3 TSSOP, TSSOP14,.25
Reach Compliance Code unknow unknow unknow
series HC/UH HC/UH HC/UH
JESD-30 code R-PDSO-G14 R-PDIP-T14 R-PDSO-G14
JESD-609 code e0 e0 e0
length 8.65 mm 18.86 mm 5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type AND GATE AND GATE AND GATE
MaximumI(ol) 0.0024 A 0.0024 A 0.0024 A
Number of functions 3 3 3
Number of entries 3 3 3
Number of terminals 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP TSSOP
Encapsulate equivalent code SOP14,.25 DIP14,.3 TSSOP14,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2/6 V 2/6 V 2/6 V
Prop。Delay @ Nom-Su 75 ns 75 ns 75 ns
propagation delay (tpd) 145 ns 145 ns 145 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
Maximum seat height 1.75 mm 4.69 mm 1.2 mm
Maximum supply voltage (Vsup) 6 V 6 V 6 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V
surface mount YES NO YES
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 2.54 mm 0.65 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3.9 mm 7.62 mm 4.4 mm
Parts packaging code SOIC DIP -
Contacts 14 14 -
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