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IDT72V51546L7-5BBGI

Description
FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Categorystorage    storage   
File Size556KB,58 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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IDT72V51546L7-5BBGI Overview

FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72V51546L7-5BBGI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeBGA
package instructionBGA,
Contacts256
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time4 ns
Other featuresALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
period time7.5 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee1
length17 mm
memory density1179648 bit
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals256
word count32768 words
character code32000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height3.5 mm
Maximum supply voltage (Vsup)3.45 V
Minimum supply voltage (Vsup)3.15 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
Base Number Matches1
3.3V MULTI-QUEUE FLOW-CONTROL DEVICES
(32 QUEUES) 36 BIT WIDE CONFIGURATION
1,179,648 bits
2,359,296 bits
IDT72V51546
IDT72V51556
FEATURES:
Choose from among the following memory density options:
IDT72V51546
Total Available Memory = 1,179,648 bits
IDT72V51556
Total Available Memory = 2,359,296 bits
Configurable from 1 to 32 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 256 x 36
Independent Read and Write access per queue
User programmable via serial port
Default multi-queue device configurations
– IDT72V51546 : 1,024 x 36 x 32Q
– IDT72V51556 : 2,048 x 36 x 32Q
100% Bus Utilization, Read and Write on every clock cycle
166 MHz High speed operation (6ns cycle time)
3.7ns access time
Individual, Active queue flags (OV,
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Shows
PAE
and
PAF
status of 8 Queues
Direct or polled operation of flag status bus
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
– x36in to x36out
– x18in to x36out
– x9in to x36out
– x36in to x18out
– x36in to x9out
FWFT mode of operation on read port
Packet mode operation
Partial Reset, clears data in single Queue
Expansion of up to 8 multi-queue devices in parallel is available
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
Q
0
FSTR
WRADD
WEN
WCLK
8
READ CONTROL
WADEN
RADEN
ESTR
8
WRITE CONTROL
Q
1
RDADD
REN
RCLK
OE
Q
2
Din
Qout
x36
DATA
OUT
WRITE FLAGS
READ FLAGS
OV
PR
PAE
8
x36
DATA IN
FF
PAF
PAFn
8
Q
31
PAEn/PRn
5904 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
JUNE 2003
DSC-5904/9

IDT72V51546L7-5BBGI Related Products

IDT72V51546L7-5BBGI BURNDY_YF1018ID IDT72V51546L7-5BBG IDT72V51556L7-5BBG IDT72V51556L7-5BBGI IDT72V51556L6BBG
Description FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 Elect Cu Single Insul Wire Ferrules, Smooth Funnel Entry, 10 AWG, 1.02" L, Tin Plated, Yellow, For use on Cu Cond. FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Is it lead-free? Lead free - Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to - conform to conform to conform to conform to
Parts packaging code BGA - BGA BGA BGA BGA
package instruction BGA, - BGA, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 BGA, BGA,
Contacts 256 - 256 256 256 256
Reach Compliance Code compliant - compliant compliant compliant compliant
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99
Maximum access time 4 ns - 4 ns 4 ns 4 ns 3.7 ns
Other features ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT - ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
period time 7.5 ns - 7.5 ns 7.5 ns 7.5 ns 6 ns
JESD-30 code S-PBGA-B256 - S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e1 - e1 e1 e1 e1
length 17 mm - 17 mm 17 mm 17 mm 17 mm
memory density 1179648 bit - 1179648 bit 2359296 bit 2359296 bit 2359296 bit
memory width 36 - 36 36 36 36
Humidity sensitivity level 3 - 3 3 3 3
Number of functions 1 - 1 1 1 1
Number of terminals 256 - 256 256 256 256
word count 32768 words - 32768 words 65536 words 65536 words 65536 words
character code 32000 - 32000 64000 64000 64000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C - 70 °C 70 °C 85 °C 70 °C
organize 32KX36 - 32KX36 64KX36 64KX36 64KX36
Exportable YES - YES YES YES YES
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA - BGA BGA BGA BGA
Package shape SQUARE - SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 - 260 260 260 260
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.5 mm - 3.5 mm 3.5 mm 3.5 mm 3.5 mm
Maximum supply voltage (Vsup) 3.45 V - 3.45 V 3.45 V 3.45 V 3.45 V
Minimum supply voltage (Vsup) 3.15 V - 3.15 V 3.15 V 3.15 V 3.15 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES - YES YES YES YES
technology CMOS - CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface TIN SILVER COPPER - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL - BALL BALL BALL BALL
Terminal pitch 1 mm - 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 - 30 30 30 30
width 17 mm - 17 mm 17 mm 17 mm 17 mm
Maker - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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