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54AC823LMQB

Description
IC,FLIP-FLOP,9-BIT,D TYPE,AC-CMOS,LLCC,28PIN,CERAMIC
Categorylogic    logic   
File Size231KB,4 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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54AC823LMQB Overview

IC,FLIP-FLOP,9-BIT,D TYPE,AC-CMOS,LLCC,28PIN,CERAMIC

54AC823LMQB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Codecompliant
JESD-30 codeS-XQCC-N28
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeD FLIP-FLOP
MaximumI(ol)0.024 A
Number of functions9
Number of terminals28
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC28,.45SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply3.3/5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Trigger typePOSITIVE EDGE
Base Number Matches1

54AC823LMQB Related Products

54AC823LMQB SLTLC2000204PCW 74AC823LCQR 74AC823DCQR
Description IC,FLIP-FLOP,9-BIT,D TYPE,AC-CMOS,LLCC,28PIN,CERAMIC Data Line Filter IC,FLIP-FLOP,9-BIT,D TYPE,AC-CMOS,LLCC,28PIN,CERAMIC IC,FLIP-FLOP,9-BIT,D TYPE,AC-CMOS,DIP,24PIN,CERAMIC
Reach Compliance Code compliant compliant compliant compliant
Is it Rohs certified? incompatible - incompatible incompatible
JESD-30 code S-XQCC-N28 - S-XQCC-N28 R-XDIP-T24
JESD-609 code e0 - e0 e0
Load capacitance (CL) 50 pF - 50 pF 50 pF
Logic integrated circuit type D FLIP-FLOP - D FLIP-FLOP D FLIP-FLOP
MaximumI(ol) 0.024 A - 0.024 A 0.024 A
Number of functions 9 - 9 9
Number of terminals 28 - 28 24
Maximum operating temperature 125 °C - 85 °C 85 °C
Minimum operating temperature -55 °C - -40 °C -40 °C
Output characteristics 3-STATE - 3-STATE 3-STATE
Package body material CERAMIC - CERAMIC CERAMIC
encapsulated code QCCN - QCCN DIP
Encapsulate equivalent code LCC28,.45SQ - LCC28,.45SQ DIP24,.6
Package shape SQUARE - SQUARE RECTANGULAR
Package form CHIP CARRIER - CHIP CARRIER IN-LINE
power supply 3.3/5 V - 3.3/5 V 3.3/5 V
surface mount YES - YES NO
technology CMOS - CMOS CMOS
Temperature level MILITARY - INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD - NO LEAD THROUGH-HOLE
Terminal pitch 1.27 mm - 1.27 mm 2.54 mm
Terminal location QUAD - QUAD DUAL
Trigger type POSITIVE EDGE - POSITIVE EDGE POSITIVE EDGE
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