5962F9565101VXX datasheet, PDF

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5962F9565101VXX: DescriptionAC SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, DFP-14; Categorylogic logic; File Size48KB，2 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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5962F9565101VXX Overview

AC SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, DFP-14

5962F9565101VXX Parametric

Parameter Name	Attribute value
Parts packaging code	DFP
package instruction	DFP,
Contacts	14
Reach Compliance Code	unknown
series	AC
JESD-30 code	R-CDFP-F14
Logic integrated circuit type	AND GATE
Number of functions	4
Number of entries	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
propagation delay (tpd)	15 ns
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class V
Maximum seat height	2.92 mm
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
total dose	300k Rad(Si) V
width	6.285 mm
Base Number Matches	1

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ACS08MS

July 1998

Radiation Hardened

Quad 2-Input AND Gate

Description

The Radiation Hardened ACS08MS is a Quad 2-Input AND

Gate. For each gate, a HIGH level on both the A and B

inputs results in a HIGH level on the Y output. A LOW level

on either the A or B input results in a LOW level on the Y

output. All inputs are buffered and the outputs are designed

for balanced propagation delay and transition times.

The ACS08MS is fabricated on a CMOS Silicon on

Sapphire (SOS) process, which provides an immunity to

Single Event Latch-up and the capability of highly reliable

performance in any radiation environment. These devices

offer significant power reduction and faster performance

when compared to ALSTTL types.

Speciﬁcations for Rad Hard QML devices are controlled

by the Defense Supply Center in Columbus (DSCC). The

SMD numbers listed below must be used when ordering.

Detailed Electrical Speciﬁcations for the ACS08 are

contained in SMD 5962-95651. A “hot-link” is provided

on our homepage with instructions for downloading.

www.intersil.com/data/sm/index.asp

Features

• QML Qualiﬁed Per MIL-PRF-38535 Requirements

• 1.25Micron Radiation Hardened SOS CMOS

• Radiation Environment

- Latch-up Free Under any Conditions

- Total Dose . . . . . . . . . . . . . . . . . . . . . . 3 x 10

RAD(Si)

- SEU Immunity . . . . . . . . . . . <1 x 10

-10

Errors/Bit/Day

- SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm

)

• Input Logic Levels . . .V

= (0.3)(V

), V

= (0.7)(V

)

• Output Current . . . . . . . . . . . . . . . . . . . . . . .

±8mA

(Min)

• Quiescent Supply Current. . . . . . . . . . . . . 100µA (Max)

• Propagation Delay . . . . . . . . . . . . . . . . . . . . .15ns (Max)

Applications

• High Speed Control Circuits

• Sensor Monitoring

• Low Power Designs

Ordering Information

ORDERING NUMBER

5962F9565101VCC

ACS08D/SAMPLE

5962F9565101VXC

ACS08K/SAMPLE

5962F9565101V9A

INTERNAL MARKETING NUMBER

ACS08DMSR

ACS08D/SAMPLE

ACS08KMSR

ACS08K/SAMPLE

ACS08HMSR

TEMP. RANGE (

-55 to 125

PACKAGE

14 Ld SBDIP

14 Ld Flatpack

Die

DESIGNATOR

CDIP2-T14

CDFP4-F14

N/A

Pinouts

ACS08 (SBDIP)

TOP VIEW

A1 1

B1 2

Y1 3

A2 4

B2 5

Y2 6

GND 7

14 V

13 B4

12 A4

11 Y4

10 B3

9 A3

8 Y3

ACS08 (FLATPACK)

TOP VIEW

GND

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

File Number

3993.1

5962F9565101VXX Related Products

	5962F9565101VXX	5962F9565101VCX	5962F9565101V9X
Description	AC SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, DFP-14	AC SERIES, QUAD 2-INPUT AND GATE, CDIP14, SIDE BRAZED, DIP-14	AC SERIES, QUAD 2-INPUT AND GATE, UUC16, DIE-16
Parts packaging code	DFP	DIP	DIE
package instruction	DFP,	DIP,	DIE,
Contacts	14	14	16
Reach Compliance Code	unknown	unknown	unknow
series	AC	AC	AC
JESD-30 code	R-CDFP-F14	R-CDIP-T14	X-XUUC-N16
Logic integrated circuit type	AND GATE	AND GATE	AND GATE
Number of functions	4	4	4
Number of entries	2	2	2
Number of terminals	14	14	16
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
encapsulated code	DFP	DIP	DIE
Package shape	RECTANGULAR	RECTANGULAR	UNSPECIFIED
Package form	FLATPACK	IN-LINE	UNCASED CHIP
propagation delay (tpd)	15 ns	15 ns	15 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V
surface mount	YES	NO	YES
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	DUAL	UPPER
total dose	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V
Maximum seat height	2.92 mm	5.08 mm	-
Terminal pitch	1.27 mm	2.54 mm	-
width	6.285 mm	7.62 mm	-
Base Number Matches	1	1	-

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