5962F9860101V9A datasheet, PDF

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5962F9860101V9A: DescriptionAC SERIES, QUAD 2-INPUT NOR GATE, UUC16, DIE-16; Categorylogic logic; File Size49KB，2 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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5962F9860101V9A Overview

AC SERIES, QUAD 2-INPUT NOR GATE, UUC16, DIE-16

5962F9860101V9A Parametric

Parameter Name	Attribute value
Parts packaging code	DIE
package instruction	DIE,
Contacts	16
Reach Compliance Code	unknown
series	AC
JESD-30 code	R-XUUC-N16
JESD-609 code	e0
Logic integrated circuit type	NOR GATE
Number of functions	4
Number of entries	2
Number of terminals	16
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
propagation delay (tpd)	12 ns
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class V
surface mount	YES
technology	CMOS
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal location	UPPER
total dose	300k Rad(Si) V
Base Number Matches	1

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ACS02MS

Data Sheet

November 1998

File Number

4540

Radiation Hardened Quad 2-Input NOR Gate

The Radiation Hardened ACS02MS is a Quad 2-Input NOR

Gate. For each gate, a HIGH level on either A or B input

results in a LOW level on the Y output. A LOW level on both

the A and B inputs results in a HIGH level on the Y output.

All inputs are buffered and the outputs are designed for

balanced propagation delay and transition times.

The ACS02MS is fabricated on a CMOS Silicon on

Sapphire (SOS) process, which provides an immunity to

Single Event Latch-up and the capability of highly reliable

performance in any radiation environment. These devices

offer significant power reduction and faster performance

when compared to ALSTTL types.

Speciﬁcations for Rad Hard QML devices are controlled

by the Defense Supply Center in Columbus (DSCC). The

SMD numbers listed below must be used when ordering.

Detailed Electrical Speciﬁcations for the ACS02MS are

contained in SMD 5962-98601. A “hot-link” is provided

on our homepage with instructions for downloading.

www.intersil.com/data/sm/index.asp

Features

• QML Qualiﬁed Per MIL-PRF-38535 Requirements

• 1.25 Micron Radiation Hardened SOS CMOS

• Radiation Environment

- Latch-Up Free Under Any Conditions

- Total Dose. . . . . . . . . . . . . . . . . . . . . . . 3 x 10

RAD(Si)

- SEU Immunity . . . . . . . . . . . . . <1 x 10

-10

Errors/Bit/Day

- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm

)

• Input Logic Levels. . . . V

= (0.3)(V

), V

= (0.7)(V

)

• Output Current . . . . . . . . . . . . . . . . . . . . . . . .

±8mA

(Min)

• Quiescent Supply Current . . . . . . . . . . . . . . 100µA (Max)

• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . 12ns (Max)

Applications

• High Speed Control Circuits

• Sensor Monitoring

• Low Power Designs

Ordering Information

ORDERING NUMBER

5962F9860101VCC

ACS02D/SAMPLE-03

5962F9860101VXC

ACS02K/SAMPLE-03

5962F9860101V9A

INTERNAL MARKETING

NUMBER

ACS02DMSR-03

ACS02D/SAMPLE-03

ACS02KMSR-03

ACS02K/SAMPLE-03

ACS02HMSR-03

TEMP. RANGE (

-55 to 125

PACKAGE

14 Ld SBDIP

14 Ld Flatpack

Die

DESIGNATOR

CDIP2-T14

CDFP4-F14

N/A

Pinouts

ACS02MS

(SBDIP)

TOP VIEW

1Y 1

A1 2

B1 3

Y2 4

A2 5

B2 6

GND 7

14 V

13 Y4

12 B4

11 A4

10 Y3

9 B3

8 A3

ACS02MS

(FLATPACK)

TOP VIEW

GND

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

5962F9860101V9A Related Products

	5962F9860101V9A	5962F9860101VXC	5962F9860101VCC
Description	AC SERIES, QUAD 2-INPUT NOR GATE, UUC16, DIE-16	AC SERIES, QUAD 2-INPUT NOR GATE, CDFP14, CERAMIC, DFP-14	AC SERIES, QUAD 2-INPUT NOR GATE, CDIP14
Parts packaging code	DIE	DFP	DIP
package instruction	DIE,	DFP, FL14,.3	DIP, DIP14,.3
Contacts	16	14	14
Reach Compliance Code	unknown	_compli	not_compliant
series	AC	AC	AC
JESD-30 code	R-XUUC-N16	R-CDFP-F14	R-CDIP-T14
JESD-609 code	e0	e0	e0
Logic integrated circuit type	NOR GATE	NOR GATE	NOR GATE
Number of functions	4	4	4
Number of entries	2	2	2
Number of terminals	16	14	14
Package body material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIE	DFP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	FLATPACK	IN-LINE
propagation delay (tpd)	12 ns	12 ns	12 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Terminal surface	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	FLAT	THROUGH-HOLE
Terminal location	UPPER	DUAL	DUAL
total dose	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V
Base Number Matches	1	1	1
Is it Rohs certified?	-	incompatible	incompatible
Load capacitance (CL)	-	50 pF	50 pF
MaximumI(ol)	-	0.008 A	0.008 A
Maximum operating temperature	-	125 °C	125 °C
Minimum operating temperature	-	-55 °C	-55 °C
Encapsulate equivalent code	-	FL14,.3	DIP14,.3
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED
power supply	-	5 V	5 V
Schmitt trigger	-	NO	NO
Maximum seat height	-	2.92 mm	5.08 mm
Nominal supply voltage (Vsup)	-	5 V	5 V
Temperature level	-	MILITARY	MILITARY
Terminal pitch	-	1.27 mm	2.54 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED
width	-	6.285 mm	7.62 mm

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