|
DAC70BH-COB-IBI |
DAC70BH-COB-I |
DAC72BH-COB-V |
DAC72BH-COB-VBI |
DAC72BH-COB-I |
DAC72BH-COB-IBI |
| Description |
D/A Converter, 1 Func, Parallel, Word Input Loading, 50us Settling Time, CDIP24, |
D/A Converter, 1 Func, Parallel, Word Input Loading, 50us Settling Time, CDIP24, |
D/A Converter, 1 Func, Parallel, Word Input Loading, 5us Settling Time, CDIP24, |
D/A Converter, 1 Func, Parallel, Word Input Loading, 5us Settling Time, CDIP24, |
D/A Converter, 1 Func, Parallel, Word Input Loading, 3us Settling Time, CDIP24, |
D/A Converter, 1 Func, Parallel, Word Input Loading, 3us Settling Time, CDIP24, |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
| Converter type |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
| Enter bit code |
COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
| Input format |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
| JESD-30 code |
R-CDIP-T24 |
R-CDIP-T24 |
R-CDIP-T24 |
R-CDIP-T24 |
R-CDIP-T24 |
R-CDIP-T24 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| Maximum linear error (EL) |
0.003% |
0.003% |
0.003% |
0.003% |
0.003% |
0.003% |
| Nominal negative supply voltage |
-15 V |
-15 V |
-15 V |
-15 V |
-15 V |
-15 V |
| Number of digits |
16 |
16 |
16 |
16 |
16 |
16 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
24 |
24 |
24 |
24 |
24 |
24 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-25 °C |
-25 °C |
-25 °C |
-25 °C |
-25 °C |
-25 °C |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
DIP |
DIP |
DIP |
DIP |
DIP |
DIP |
| Encapsulate equivalent code |
DIP24,.6 |
DIP24,.6 |
DIP24,.6 |
DIP24,.6 |
DIP24,.6 |
DIP24,.6 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
| power supply |
5,+-15 V |
5,+-15 V |
5,+-15 V |
5,+-15 V |
5,+-15 V |
5,+-15 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Nominal settling time (tstl) |
50 µs |
50 µs |
5 µs |
5 µs |
3 µs |
3 µs |
| Nominal supply voltage |
15 V |
15 V |
15 V |
15 V |
15 V |
15 V |
| surface mount |
NO |
NO |
NO |
NO |
NO |
NO |
| technology |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
| Temperature level |
OTHER |
OTHER |
OTHER |
OTHER |
OTHER |
OTHER |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| Maker |
Burr-Brown |
Burr-Brown |
- |
- |
Burr-Brown |
Burr-Brown |
| Base Number Matches |
1 |
1 |
1 |
1 |
- |
- |
| package instruction |
- |
DIP, DIP24,.6 |
DIP, DIP24,.6 |
DIP, DIP24,.6 |
DIP, DIP24,.6 |
DIP, DIP24,.6 |
| Maximum stabilization time |
- |
- |
10 µs |
10 µs |
3 µs |
3 µs |
| Maximum slew rate |
- |
- |
30 mA |
30 mA |
30 mA |
30 mA |