27C256TRPDS-15 datasheet, PDF - EEWORLD Datasheet

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27C256TRPDS-15: DescriptionOTP ROM, 32KX8, 150ns, CMOS, PDIP32, DIP-32; Categorystorage storage; File Size121KB，14 Pages; ManufacturerMaxwell Technologies Inc.

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27C256TRPDS-15 Overview

OTP ROM, 32KX8, 150ns, CMOS, PDIP32, DIP-32

27C256TRPDS-15 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
JESD-30 code	R-PDIP-T32
length	40.64 mm
memory density	262144 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883 Class S
Maximum seat height	6.096 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
total dose	100k Rad(Si) V
width	15.24 mm
Base Number Matches	1

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27C256T

256K (32K x 8-Bit) OTP EPROM

A5-A9

1024 x 1022

Memory Matrix

x-Decoder

A12-A14

A12-A16

I/O0

I/O 7

I/O15

Input

Data

Control

Y- Gating

Y - Decoder

27C256T

PGM

A0-A4

A10-A11

: High Threshhold Inverter

Memory

Logic Diagram

EATURES

• 32K x 8-bit OTP EPROM organization

• R

-P

® radiation-hardened against natural space

radiation

• Total dose hardness:

- > 100 Krad (Si), depending upon space mission

• Excellent Single Event Effects:

-SEL

> 80 MeV/mg/cm2

-SEU

> 80 Mev/mg/cm2

• Package:

-32 pin R

-P

® flat pack

-32 pin R

-P

® DIP

• Fast access time:

- 120, 150, 200 ns (max)

• Low power dissipation:

- Active mode: 100 mW/MHz (typ)

- Standby mode: 10 µ W (typ)

Page programming time: 14 sec (typ)

• Programming power supply:

- V

= 12.5 V

• One-time programmable

• Pin arrangement

- JEDEC standard byte-wide EPROM

- Flash memory and mask ROM compatible

ESCRIPTION

Maxwell Technologies’ 27C256T high density 256-Kilobit one-

time programmable electrically programmable read only mem-

ory microcircuit features a greater than 100 krad (Si) total

dose tolerance, depending upon space mission. The 27C256T

features fast address times and low power dissipation. The

27C256T offers high speed programming using page pro-

gramming mode.

Maxwell Technologies' patented R

-P

® packaging technol-

ogy incorporates radiation shielding in the microcircuit pack-

age. It eliminates the need for box shielding while providing

the required radiation shielding for a lifetime in orbit or space

mission. In a GEO orbit, R

-P

® provides greater than 100

krad (Si) radiation dose tolerance. This product is available

with screening up to Class S.

06.24.02 REV 4

All data sheets are subject to change without notice

(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com

27C256TRPDS-15 Related Products

	27C256TRPDS-15	27C256TRPDB-12	27C256TRPDS-20	27C256TRPDB-20	27C256TRPDI-12	27C256TRPDB-15	27C256TRPDI-20	27C256TRPDI-15	27C256TRPDS-12
Description	OTP ROM, 32KX8, 150ns, CMOS, PDIP32, DIP-32	OTP ROM, 32KX8, 120ns, CMOS, PDIP32, DIP-32	OTP ROM, 32KX8, 200ns, CMOS, PDIP32, DIP-32	OTP ROM, 32KX8, 200ns, CMOS, PDIP32, DIP-32	OTP ROM, 32KX8, 120ns, CMOS, PDIP32, DIP-32	OTP ROM, 32KX8, 150ns, CMOS, PDIP32, DIP-32	OTP ROM, 32KX8, 200ns, CMOS, PDIP32, DIP-32	OTP ROM, 32KX8, 150ns, CMOS, PDIP32, DIP-32	OTP ROM, 32KX8, 120ns, CMOS, PDIP32, DIP-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP,	DIP,	DIP,	DIP,	DIP-32	DIP,	DIP-32	DIP-32	DIP,
Contacts	32	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	120 ns	200 ns	200 ns	120 ns	150 ns	200 ns	150 ns	120 ns
JESD-30 code	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32
length	40.64 mm	40.64 mm	40.64 mm	40.64 mm	40.64 mm	40.64 mm	40.64 mm	40.64 mm	40.64 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32	32
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	6.096 mm	6.096 mm	6.096 mm	6.096 mm	6.096 mm	6.096 mm	6.096 mm	6.096 mm	6.096 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
Base Number Matches	1	1	1	1	1	1	1	1	1
Filter level	MIL-STD-883 Class S	MIL-STD-883 Class B	MIL-STD-883 Class S	MIL-STD-883 Class B	-	MIL-STD-883 Class B	-	-	MIL-STD-883 Class S
total dose	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	-	100k Rad(Si) V	-	-	100k Rad(Si) V

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