EEWORLDEEWORLDEEWORLD

Part Number

Search

DF005SA27

Description
1A, 50V, SILICON, BRIDGE RECTIFIER DIODE, PLASTIC, DFS, 4 PIN
CategoryDiscrete semiconductor    diode   
File Size31KB,2 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

DF005SA27 Overview

1A, 50V, SILICON, BRIDGE RECTIFIER DIODE, PLASTIC, DFS, 4 PIN

DF005SA27 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerVishay
package instructionPLASTIC, DFS, 4 PIN
Contacts4
Reach Compliance Codeunknown
ConfigurationBRIDGE, 4 ELEMENTS
Diode component materialsSILICON
Diode typeBRIDGE RECTIFIER DIODE
JESD-30 codeR-PDSO-G4
JESD-609 codee0
Humidity sensitivity levelNOT SPECIFIED
Maximum non-repetitive peak forward current30 A
Number of components4
Phase1
Number of terminals4
Maximum output current1 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum repetitive peak reverse voltage50 V
surface mountYES
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature30
Base Number Matches1
DF005SA thru DF10SA
New Product
Vishay Semiconductors
formerly General Semiconductor
Miniature Glass Passivated Single-Phase
Surface Mount Bridge Rectifier
Reverse Voltage
Case Style DFS
0.205 (5.2)
0.195 (5.0)
0.047 (1.20)
0.040 (1.02)
50 to 1000V
Forward Current
1.0A
Mounting Pad Layout
0.047 MIN.
(1.20 MIN.)
Dimensions in inches
and (millimeters)
0.404 (10.3)
0.386 (9.80)
0.335 (8.51)
0.320 (8.13)
45
o
0.255 (6.5)
0.245 (6.2)
0.404 MAX.
(10.26 MAX.)
0.060 MIN.
(1.52 MIN.)
0.130 (3.3)
0.120 (3.05)
0.013 (0.330)
0.009 (0.241)
0.205 (5.2)
0.195 (5.0)
0.060 (1.524)
0.040 (1.016)
Mechanical Data
0.013 (0.330)
0.003 (0.076)
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• This series is UL listed under Recognized Component
Index, file number E54214
• Glass passivated chip junctions
• High surge overload rating of 30 Amperes peak
• Ideal for printed circuit boards
• High temperature soldering guaranteed:
260°C/10 seconds at 5 lbs. (2.3kg) tension
(T
A
= 25°C unless otherwise noted)
Case:
Molded plastic body over passivated junctions
Terminals:
Plated leads solderable per MIL-STD-750,
Method 2026
Polarity:
Polarity symbols marked on body
Mounting Position:
Any
Weight:
0.014oz., 0.4g
Packaging codes/options:
27/1.5K per 13” Reel (16mm Tape)
45/50 EA. per Tube-Bulk
Maximum Ratings and Thermal Characteristics
Parameter
Device marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward output rectified current
at T
A
= 40°C
(2)
Peak forward surge current single half sine-wave
superimposed on rated load (JEDEC Method) T
J
= 150°C
Rating for fusing (t < 8.3ms)
Typical thermal resistance per leg
(2)
Symbol DF005SA DF01SA DF02SA DF04SA DF06SA DF08SA DF10SA
DFA DFA DFA DFA DFA DFA DFA
005S 01S
02S
04S
06S
08S
10S
V
RRM
50
100
200
400
600
800 1000
V
RMS
35
70
140
280
420
560
700
V
DC
50
100
200
400
600
800 1000
I
F(AV)
I
FSM
I
2
t
R
θJA
R
θJL
T
J
, T
STG
1.0
30
4.5
40
15
–55 to +150
Unit
V
V
V
A
A
A
2
sec
°C/W
°C
Operating junction and storage temperature range
Electrical Characteristics
(T
A
= 25°C unless otherwise noted)
Maximum instantaneous forward voltage drop
per leg at 1.0A
Maximum DC reverse current
T
A
= 25°C
at rated DC blocking voltage per leg
T
A
= 125°C
(1)
Typical junction capacitance per leg
V
F
I
R
C
J
1.1
5.0
500
25
V
µA
pF
Notes:
(1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(2) Units mounted on P.C.B. with 0.51 x 0.51” (13 x 13mm) copper pads
Document Number 88574
2-Apr-02
www.vishay.com
1
Arteli-USB read RAM buffer usage specification recommendations
Questions: Hardware and software access USB RAM buffer at the same time, causing data to be messed up or lost.The process of causing garbled code:1. Software sets USB Valid2. Turn off the general inte...
火辣西米秀 Domestic Chip Exchange
NIOS Ⅱ based SD card
How to design an SD card based on NIOS Ⅱ? Designing with SOPC bulider and NIOS II is a combination of hardware and software. SOPC builds the SD card controller (hardware), and NIOSS II writes the corr...
阿飞 FPGA/CPLD
Can PIC16F628 enter low power consumption directly using the sleep function?
This is my first time using PIC chips, and there are still many things I don't understand. The manual only has a short description of low power consumption, which is not very clear. If I can't use sle...
star143133 Microchip MCU
Question 3 about ucgui
[color=black][font=宋体][size=10pt]Hello experts, I have transplanted [/size][/font][/color][color=black][font=Monospace][size=10pt][font=新宋体]ucgui[/font][/size][/font][/color][color=black][font=宋体][siz...
wangxd5429 Real-time operating system RTOS
How to configure 6410 OTG to host?
How to configure 6410 OTG to host, how to modify the hardware, how to configure the software?...
lianjingen Embedded System
 Waveform Generator Implemented on SoPC
SoPC is a special embedded microprocessor system. First, it is a system on chip ( SOC ) , that is, a single chip completes the main logic functions of the entire system; second, it is a programmable s...
feifei DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2188  261  1268  461  2502  45  6  26  10  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号