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MC14580BCP

Description
4 x 4 Multiport Register
Categorystorage    storage   
File Size111KB,7 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC14580BCP Overview

4 x 4 Multiport Register

MC14580BCP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
Parts packaging codeDIP
package instructionDIP, DIP24,.6
Contacts24
Reach Compliance Codeunknow
ECCN code3A001.A.2.C
Maximum access time1300 ns
JESD-30 codeR-PDIP-T24
JESD-609 codee0
length31.75 mm
memory density16 bi
Memory IC TypeMULTI-PORT SRAM
memory width4
Number of functions1
Number of ports2
Number of terminals24
word count4 words
character code4
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4X4
Output characteristics3-STATE
ExportableNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5/15 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)18 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
MC14580B
4 x 4 Multiport Register
The MC14580B is a 4 by 4 multiport register useful in small scratch pad
memories, arithmetic operations when coupled with an adder, and other data
storage applications. It allows independent reading of any two words (or the
same word at both outputs) while writing into any one of four words.
Address changing and data entry occur on the rising edge of the clock.
When the write enable input is low, the contents of any word may be
accessed but not altered.
No Restrictions on Clock Input Rise or Fall Times
3–State Outputs
Single Phase Clocking
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or one Low–power
Schottky TTL Load Over the Rated Temperature Range
Pin Compatible with CD40108
MAXIMUM RATINGS*
(Voltages Referenced to VSS)
Symbol
VDD
Parameter
DC Supply Voltage
L SUFFIX
CERAMIC
CASE 623
P SUFFIX
PLASTIC
CASE 709
DW SUFFIX
SOIC
CASE 751E
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Value
Unit
V
V
mA
– 0.5 to + 18.0
Vin, Vout
Iin, Iout
PD
Tstg
TL
Input or Output Voltage (DC or Transient)
Input or Output Current (DC or Transient),
per Pin
Power Dissipation, per Package†
Storage Temperature
Lead Temperature (8–Second Soldering)
– 0.5 to VDD + 0.5
±
10
500
– 65 to + 150
260
mW
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBDW
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
PIN ASSIGNMENT
Q3B
Q2B
3–STATE A
Q0A
Q1A
Q2A
Q3A
WRITE 0
WRITE 1
READ 1B
READ 0B
VSS
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VDD
Q1B
Q0B
3–STATE B
D0
D1
D2
D3
CLOCK
WE
READ 1A
READ 0A
_
C
_
C
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/
_
C From 65
_
C To 125
_
C
Ceramic “L” Packages: – 12 mW/
_
C From 100
_
C To 125
_
C
BLOCK DIAGRAM
W0 W1 R0A R1A R0B R1B
8 9 13 14 11 10
16
CLOCK
DECODER
3–STATE A
3
WE
15
20
D0
19
D1
18
D2
17
D3
DATA
INPUT
4X4
MEMORY
Q0A
Q1A
Q2A
Q3A
4
5
6
7
WORD A
OUTPUT
22
Q0B
23
Q1B
2
Q2B
1
Q3B
21
3–STATE B
WORD B
OUTPUT
VDD = PIN 24
VSS = PIN 12
REV 3
1/94
©
MOTOROLA CMOS LOGIC DATA
Motorola, Inc. 1995
MC14580B
1

MC14580BCP Related Products

MC14580BCP MC14580BDW MC14580BCL
Description 4 x 4 Multiport Register 4 x 4 Multiport Register 4 x 4 Multiport Register
Is it Rohs certified? incompatible - incompatible
Maker Motorola ( NXP ) - Motorola ( NXP )
Parts packaging code DIP - DIP
package instruction DIP, DIP24,.6 - DIP,
Contacts 24 - 24
Reach Compliance Code unknow - unknow
ECCN code 3A001.A.2.C - 3A001.A.2.C
Maximum access time 1300 ns - 1300 ns
JESD-30 code R-PDIP-T24 - R-CDIP-T24
JESD-609 code e0 - e0
length 31.75 mm - 32.005 mm
memory density 16 bi - 16 bi
Memory IC Type MULTI-PORT SRAM - MULTI-PORT SRAM
memory width 4 - 4
Number of functions 1 - 1
Number of ports 2 - 2
Number of terminals 24 - 24
word count 4 words - 4 words
character code 4 - 4
Operating mode SYNCHRONOUS - SYNCHRONOUS
Maximum operating temperature 125 °C - 125 °C
Minimum operating temperature -55 °C - -55 °C
organize 4X4 - 4X4
Output characteristics 3-STATE - 3-STATE
Exportable NO - NO
Package body material PLASTIC/EPOXY - CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP - DIP
Package shape RECTANGULAR - RECTANGULAR
Package form IN-LINE - IN-LINE
Parallel/Serial PARALLEL - PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED
Certification status Not Qualified - Not Qualified
Maximum seat height 5.08 mm - 5.59 mm
Maximum supply voltage (Vsup) 18 V - 18 V
Minimum supply voltage (Vsup) 3 V - 3 V
Nominal supply voltage (Vsup) 5 V - 5 V
surface mount NO - NO
technology CMOS - CMOS
Temperature level MILITARY - MILITARY
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE - THROUGH-HOLE
Terminal pitch 2.54 mm - 2.54 mm
Terminal location DUAL - DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED
width 15.24 mm - 15.24 mm
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