0.2A, 75V, SILICON, SIGNAL DIODE, DO-35
| Parameter Name | Attribute value |
| package instruction | O-LALF-W2 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | RECTIFIER DIODE |
| Maximum forward voltage (VF) | 1 V |
| JEDEC-95 code | DO-35 |
| JESD-30 code | O-LALF-W2 |
| Maximum non-repetitive peak forward current | 4 A |
| Number of components | 1 |
| Number of terminals | 2 |
| Maximum operating temperature | 175 °C |
| Maximum output current | 0.2 A |
| Package body material | GLASS |
| Package shape | ROUND |
| Package form | LONG FORM |
| Maximum power dissipation | 0.5 W |
| Certification status | Not Qualified |
| Maximum repetitive peak reverse voltage | 75 V |
| Maximum reverse current | 0.1 µA |
| Maximum reverse recovery time | 0.006 µs |
| surface mount | NO |
| Terminal form | WIRE |
| Terminal location | AXIAL |
| Base Number Matches | 1 |
| 1N4150T26R | RNC20TA270.1%I | 0522710779_V01 | 0522711779_V01 | 1N4150T50R | FDLL4150S62Z | FDLL4150D87Z | FDLL4150L99Z | |
|---|---|---|---|---|---|---|---|---|
| Description | 0.2A, 75V, SILICON, SIGNAL DIODE, DO-35 | Fixed Resistor, Thin Film, 0.1W, 27ohm, 100V, 0.1% +/-Tol, 5ppm/Cel, Surface Mount, 0805, CHIP | Easy-On FFC/FPC Connector, 1.00mm Pitch, Slider Series, Right-Angle, Bottom Contact, 3.00mm Height, 7 Circuits, Tin-Bismuth Plating | Easy-On FFC/FPC Connector, 1.00mm Pitch, Slider Series, Right-Angle, Bottom Contact, 3.00mm Height, 17 Circuits, Tin-Bismuth Plating | 0.2A, 75V, SILICON, SIGNAL DIODE, DO-35 | 0.2A, 75V, SILICON, SIGNAL DIODE | 0.2A, SILICON, SIGNAL DIODE | 0.2A, SILICON, SIGNAL DIODE |
| package instruction | O-LALF-W2 | CHIP | - | - | O-LALF-W2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 |
| Reach Compliance Code | unknow | not_compliant | - | - | unknown | unknown | unknow | unknow |
| ECCN code | EAR99 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| Shell connection | ISOLATED | - | - | - | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| Configuration | SINGLE | - | - | - | SINGLE | SINGLE | SINGLE | SINGLE |
| Diode component materials | SILICON | - | - | - | SILICON | SILICON | SILICON | SILICON |
| Diode type | RECTIFIER DIODE | - | - | - | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| Maximum forward voltage (VF) | 1 V | - | - | - | 1 V | 1 V | 1 V | 1 V |
| JESD-30 code | O-LALF-W2 | - | - | - | O-LALF-W2 | O-LELF-R2 | O-LELF-R2 | O-LELF-R2 |
| Maximum non-repetitive peak forward current | 4 A | - | - | - | 4 A | 4 A | 4 A | 4 A |
| Number of components | 1 | - | - | - | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | - | - | 2 | 2 | 2 | 2 |
| Maximum operating temperature | 175 °C | 155 °C | - | - | 175 °C | 175 °C | 175 °C | 175 °C |
| Maximum output current | 0.2 A | - | - | - | 0.2 A | 0.2 A | 0.2 A | 0.2 A |
| Package body material | GLASS | - | - | - | GLASS | GLASS | GLASS | GLASS |
| Package shape | ROUND | RECTANGULAR PACKAGE | - | - | ROUND | ROUND | ROUND | ROUND |
| Package form | LONG FORM | SMT | - | - | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| Maximum power dissipation | 0.5 W | - | - | - | 0.5 W | 0.5 W | 0.5 W | 0.5 W |
| Certification status | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum reverse current | 0.1 µA | - | - | - | 0.1 µA | 0.1 µA | 0.1 µA | 0.1 µA |
| Maximum reverse recovery time | 0.006 µs | - | - | - | 0.006 µs | 0.006 µs | 0.006 µs | 0.006 µs |
| surface mount | NO | YES | - | - | NO | YES | YES | YES |
| Terminal form | WIRE | - | - | - | WIRE | WRAP AROUND | WRAP AROUND | WRAP AROUND |
| Terminal location | AXIAL | - | - | - | AXIAL | END | END | END |