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54ACTQ32DMQB

Description
IC ACT SERIES, QUAD 2-INPUT OR GATE, CDIP14, Gate
Categorylogic    logic   
File Size160KB,8 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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54ACTQ32DMQB Overview

IC ACT SERIES, QUAD 2-INPUT OR GATE, CDIP14, Gate

54ACTQ32DMQB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
seriesACT
JESD-30 codeR-GDIP-T14
JESD-609 codee0
length19.43 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeOR GATE
MaximumI(ol)0.024 A
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
method of packingTUBE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Prop。Delay @ Nom-Sup7.5 ns
propagation delay (tpd)7.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Filter levelMIL-STD-883 Class B
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1

54ACTQ32DMQB Related Products

54ACTQ32DMQB 54ACTQ32FMQB 54ACTQ32LMQB
Description IC ACT SERIES, QUAD 2-INPUT OR GATE, CDIP14, Gate IC ACT SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, FP-14, Gate IC ACT SERIES, QUAD 2-INPUT OR GATE, CQCC20, Gate
Is it Rohs certified? incompatible incompatible incompatible
Reach Compliance Code unknown unknow unknown
series ACT ACT ACT
JESD-30 code R-GDIP-T14 R-GDFP-F14 S-CQCC-N20
JESD-609 code e0 e0 e0
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type OR GATE OR GATE OR GATE
MaximumI(ol) 0.024 A 0.024 A 0.024 A
Number of functions 4 4 4
Number of entries 2 2 2
Number of terminals 14 14 20
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DFP QCCN
Encapsulate equivalent code DIP14,.3 FL14,.3 LCC20,.35SQ
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE FLATPACK CHIP CARRIER
method of packing TUBE TUBE TUBE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
propagation delay (tpd) 7.5 ns 7.5 ns 7.5 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
Filter level MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
Maximum seat height 5.08 mm 2.032 mm 1.905 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO YES YES
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE FLAT NO LEAD
Terminal pitch 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 6.35 mm 8.89 mm
Base Number Matches 1 1 1
package instruction DIP, DIP14,.3 DFP, FL14,.3 -
length 19.43 mm - 8.89 mm
Prop。Delay @ Nom-Sup 7.5 ns - 7.5 ns
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