®
STBR606/608
50-60Hz RECTIFICATION BRIDGE
MAJOR PRODUCT CHARACTERISTICS
+
I
F(AV)
V
RRM
V
F
(max)
6A
600 V / 800 V
1.05 V
-
~
~
FEATURES AND BENEFITS
Dielectric strength of 2000V
High Surge overload rating
High Surge current capability
UL94V0
Planar technology
s
s
s
s
s
~~
-
GBU
STBR606/608
+
DESCRIPTION
Single-phase 6A Bridge for 50 & 60Hz rectification
in Switch Mode Power Supplies.
Applications: Home appliances, Automation,
Telecommunications, PC, Servers.
ABSOLUTE RATINGS
(limiting values)
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
Parameter
Repetitive peak reverse voltage
RMS Voltage
DC Blocking voltage
Average Forward Current
Non repetitive surge peak forward
current
Rating for Fusing (tp < 8.3ms)
Maximum operating junction temperature
Storage temperature range
T
C
= 60°C
tp = 8.3 ms
Single sine wave
(JEDEC method)
STBR606 STBR608
600
800
420
600
6
175
560
800
Unit
V
V
V
A
A
I
2
t
Tj
T
stg
127
150
- 50 to 150
A
2
S
°C
°C
August 2001 - Ed: 4D
1/4
STBR606/608
THERMAL PARAMETERS
Symbol
R
th(j-c)
R
th(j-a)
Parameter
Junction to case
Junction to ambient
Min.
Typ.
7.4
Max.
8
35
Unit
°C/W
°C/W
ELECTRICAL CHARACTERISTICS
Symbol
V
F
I
R
C
Parameter
Forward voltage drop
Reverse leakage current per
leg
Junction capacitance per leg
Test conditions
I
F
= 6A
V
R
= V
RRM
(note 1)
Tj = 25°C
Tj = 125°C
55
Min.
Typ.
Max.
1.05
5
50
Unit
V
µA
µA
pF
Note 1:
Measured at 1MHz and applied reverse voltage of 4V.
Fig. 1:
Average power dissipation of bridge versus
average output current.
PF(av)(W)
12
11
10
9
8
7
6
5
4
3
2
1
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IP / IF(av)=P
(resistive load)
IP / IF(av)=20
IP / IF(av)=10
IP / IF(av)=5
(capacitive load)
Fig. 2:
Average output current versus ambient
temperature (resistive load or inductive load)
IF(av)(A)
7
Rth(j-a)=Rth(j-c)
6
5
Rth(j-a)=15°C/W
4
3
Rth(j-a)=35°C/W
2
1
IF(av)(A)
0
0
25
50
Tamb(°C)
75
100
125
150
Fig. 3:
Variation of thermal impedance junction to
ambient versus pulse duration (printed circuit
board epoxy FR4)
Zth(j-a)(°C/W)
100.0
Free air
Fig. 4:
Forward voltage drop versus forward
current (typical values, per leg).
IFM(A)
1000.0
100.0
10.0
10.0
Tj=125°C
Tj=25°C
1.0
1.0
tp(s)
0.1
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
VFM(V)
0.1
0.0
0.5
1.0
1.5
2.0
2.5
2/5
STBR606/608
Fig. 5:
Reverse leakage current versus reverse
voltage applied (typical values, per leg).
Fig. 6:
Relative leakage current versus junction
temperature (typical values).
IR(µA)
1.E+01
VR=800V
IR(µA)
1.E+01
Tj=150°C
1.E+00
Tj=125°C
1.E+00
1.E-01
1.E-01
1.E-02
Tj=75°C
1.E-02
1.E-03
1.E-03
1.E-04
1.E-04
Tj=25°C
VR(V)
1.E-05
0
100
200
300
400
500
600
700
800
Tj(°C)
1.E-05
0
25
50
75
100
125
150
Fig. 7:
Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
100
F=1MHz
Vosc=30mV
RMS
Tj=25°C
Fig. 8:
Softness factor versus dIF/dt (typical
values).
S(Softness factor)
1.6
1.4
1.2
1.0
IF=6A
VR=400V
Tj=125°C
10
0.8
0.6
IF
S=[dIF/dt]/[dIR/dt]
0.4
VR(V)
1
1
10
100
1000
0.2
1
dIF/dt(A/µs)
10
dIF/dt
t
100
Fig. 9:
Surge peak forward current versus number
of cycles (per leg).
IFSM(A)
180
160
tp=10ms
140
120
100
80
60
40
20
0
1
10
100
1000
Repetitive
Tj initial=50°C
Non repetitive
Tj initial=150°C
Number of cycles
3/4
STBR606/608
PACKAGE MECHANICAL DATA
GBU
DIMENSIONS
REF.
A
J
Millimeters
Min.
Max.
21.8
22.3
18.3
18.8
3.2 typ. 45°
17.5
18
7.4
7.9
1.65
2.16
2.25
2.75
1.95
2.35
1.02
1.27
3.5
4.1
3.3
3.56
0.76
1
0.46
0.56
4.83
5.33
7° typ.
1.9 typ.
7° typ.
Inches
Min.
Max.
0.86
0.88
0.72
0.74
0.125 typ. 45°
0.69
0.71
0.29
0.31
0.065
0.085
0.089
0.108
0.077
0.093
0.04
0.05
0.14
0.16
0.13
0.14
0.03
0.04
0.018
0.022
0.19
0.21
7° typ.
0.075 typ.
7° typ.
C
E
K
O
O Q
B
-
~
~
Ø
P
F
+
Front Side
O
L
O
G
H
D
I
M
N
N
N
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
Ordering type
STBR606
STBR608
s
Marking
STBR606
STBR608
Package
GBU
GBU
Weight
4.0g
4.0g
Base qty
20
20
Delivery mode
Tube
Tube
s
s
s
Epoxy meets UL94,V0
Cooling method: C
Recommended torque value: 0.8 m.N
Maximum torque value: 1.0 m.N
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2001 STMicroelectronics - Printed in Italy - All rights reserved.
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