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MBM29LV160B-80PFTN

Description
16M (2M xⅴ 8/1M x 16) BIT
Categorystorage    storage   
File Size453KB,60 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
Download Datasheet Parametric View All

MBM29LV160B-80PFTN Overview

16M (2M xⅴ 8/1M x 16) BIT

MBM29LV160B-80PFTN Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFUJITSU
Objectid1491418309
Parts packaging codeTSOP1
package instructionPLASTIC, TSOP1-48
Contacts48
Reach Compliance Codeunknow
ECCN codeEAR99
compound_id9911441
Maximum access time80 ns
Other featuresCONFIGURABLE AS 1M X 16
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G48
JESD-609 codee0
length18.4 mm
memory density16777216 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size1,2,1,31
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
power supply3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size16K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.035 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
switch bitYES
typeNOR TYPE
width12 mm
FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-20846-4E
FLASH MEMORY
CMOS
16M (2M
×
8/1M
×
16) BIT
MBM29LV160T
-80/-90/-12
/MBM29LV160B
-80/-90/-12
s
FEATURES
• Single 3.0 V read, program and erase
Minimizes system level power requirements
• Compatible with JEDEC-standard commands
Uses same software commands as E
2
PROMs
• Compatible with JEDEC-standard world-wide pinouts
48-pin TSOP (I) (Package suffix: PFTN-Normal Bend Type, PFTR-Reversed Bend Type)
46-pin SON (Package suffix: PN)
48-pin CSOP (Package suffix: PCV)
48-ball FBGA (Package suffix: PBT)
• Minimum 100,000 program/erase cycles
• High performance
80 ns maximum access time
• Sector erase architecture
One 8K word, two 4K words, one 16K word, and thirty-one 32K words sectors in word mode
One 16K byte, two 8K bytes, one 32K byte, and thirty-one 64K bytes sectors in byte mode
Any combination of sectors can be concurrently erased. Also supports full chip erase
• Boot Code Sector Architecture
T = Top sector
B = Bottom sector
• Embedded Erase
TM
Algorithms
Automatically pre-programs and erases the chip or any sector
• Embedded program
TM
Algorithms
Automatically programs and verifies data at specified address
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
• Automatic sleep mode
When addresses remain stable, automatically switches themselves to low power mode
• Low V
CC
write inhibit
2.5 V
(Continued)
Embedded Erase
TM
and Embedded Program
TM
are trademarks of Advanced Micro Devices, Inc.
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