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SAA7114E

Description
PAL/NTSC/SECAM video decoder with adaptive PAL/NTSC comb filter, VBI data slicer and high performance scaler
CategoryOther integrated circuit (IC)    Consumption circuit   
File Size609KB,147 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

SAA7114E Overview

PAL/NTSC/SECAM video decoder with adaptive PAL/NTSC comb filter, VBI data slicer and high performance scaler

SAA7114E Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionBGA, BGA156,14X14,40
Reach Compliance Codeunknow
JESD-30 codeS-PBGA-B156
JESD-609 codee0
Number of terminals156
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA156,14X14,40
Package shapeSQUARE
Package formGRID ARRAY
power supply3.3 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
INTEGRATED CIRCUITS
DATA SHEET
SAA7114
PAL/NTSC/SECAM video decoder
with adaptive PAL/NTSC comb
filter, VBI data slicer and high
performance scaler
Product specification
Supersedes data of 2000 Mar 15
2004 Mar 03

SAA7114E Related Products

SAA7114E SAA7114H SAA7114
Description PAL/NTSC/SECAM video decoder with adaptive PAL/NTSC comb filter, VBI data slicer and high performance scaler PAL/NTSC/SECAM video decoder with adaptive PAL/NTSC comb filter, VBI data slicer and high performance scaler PAL/NTSC/SECAM video decoder with adaptive PAL/NTSC comb filter, VBI data slicer and high performance scaler
Is it Rohs certified? incompatible conform to -
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) -
Reach Compliance Code unknow unknow -
JESD-30 code S-PBGA-B156 S-PQFP-G100 -
JESD-609 code e0 e3 -
Number of terminals 156 100 -
Maximum operating temperature 70 °C 70 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code BGA QFP -
Encapsulate equivalent code BGA156,14X14,40 QFP100,.63SQ,20 -
Package shape SQUARE SQUARE -
Package form GRID ARRAY FLATPACK -
power supply 3.3 V 3.3 V -
Certification status Not Qualified Not Qualified -
surface mount YES YES -
technology CMOS CMOS -
Temperature level COMMERCIAL COMMERCIAL -
Terminal surface Tin/Lead (Sn/Pb) Matte Tin (Sn) -
Terminal form BALL GULL WING -
Terminal pitch 1 mm 0.5 mm -
Terminal location BOTTOM QUAD -
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