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IS61LV2568L-10BI

Description
Standard SRAM, 256KX8, 10ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36
Categorystorage    storage   
File Size53KB,11 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
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IS61LV2568L-10BI Overview

Standard SRAM, 256KX8, 10ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36

IS61LV2568L-10BI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instruction6 X 8 MM, MINI, BGA-36
Contacts36
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time10 ns
I/O typeCOMMON
JESD-30 codeR-PBGA-B36
JESD-609 codee0
length10 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals36
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA36,6X8,30
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.35 mm
Maximum standby current0.004 A
Maximum slew rate0.065 mA
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)2.97 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
Base Number Matches1
IS61LV2568L
IS61LV2568LL
256K x 8 HIGH-SPEED CMOS STATIC RAM
FEATURES
• High-speed access time:
IS61LV2568L: 8, 10 ns
IS61LV2568LL: 12 ns
• Operating Current:
IS61LV2568L: 50mA (typ.)
IS61LV2568LL: 30mA (typ.)
• Standby Current:
IS61LV2568L: 700µA (typ.)
IS61LV2568LL: 400µA(typ.)
• Multiple center power and ground pins for greater
noise immunity
• Easy memory expansion with
CE
and
OE
options
CE
power-down
• TTL compatible inputs and outputs
• Single 3.3V power supply
• Packages available:
– 36-pin 400-mil SOJ
– 44-pin TSOP (Type II)
– 36-ball mini BGA (6mm x 8mm)
ISSI
APRIL 2003
®
DESCRIPTION
The
ISSI
IS61LV2568L/IS61LV2568LL is a very high-
speed, low power, 262,144-word by 8-bit CMOS static
RAM. The IS61LV2568L/IS61LV2568LL is fabricated
using
ISSI
's high-performance CMOS technology. This
highly reliable process coupled with innovative circuit
design techniques, yields higher performance and low
power consumption devices.
When
CE
is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down to 36mW (max.) with CMOS input levels.
The S61LV2568L/IS61LV2568LL operates from a single
3.3V power supply and all inputs are TTL-compatible.
The S61LV2568L/IS61LV2568LL is available in 36-pin
400-mil SOJ, 44-pin TSOP (Type II), and 36-ball mini
BGA (6mm x 8mm) packages.
FUNCTIONAL BLOCK DIAGRAM
A0-A17
DECODER
256K X 8
MEMORY ARRAY
V
DD
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE
OE
WE
CONTROL
CIRCUIT
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
04/02/03
1

IS61LV2568L-10BI Related Products

IS61LV2568L-10BI IS61LV2568L-8B IS61LV2568LL-12TI IS61LV2568L-10TI IS61LV2568L-10KI IS61LV2568LL-12T
Description Standard SRAM, 256KX8, 10ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36 Standard SRAM, 256KX8, 8ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36 Standard SRAM, 256KX8, 12ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 256KX8, 10ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 256KX8, 10ns, CMOS, PDSO36, 0.400 INCH, PLASTIC, MS-027, SOJ-36 Standard SRAM, 256KX8, 12ns, CMOS, PDSO44, TSOP2-44
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code BGA BGA TSOP2 TSOP2 SOJ TSOP2
package instruction 6 X 8 MM, MINI, BGA-36 6 X 8 MM, MINI, BGA-36 TSOP2-44 TSOP2-44 SOJ, SOJ36,.44 TSOP2-44
Contacts 36 36 44 44 36 44
Reach Compliance Code compliant compli compliant compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 10 ns 8 ns 12 ns 10 ns 10 ns 12 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B36 R-PBGA-B36 R-PDSO-G44 R-PDSO-G44 R-PDSO-J36 R-PDSO-G44
JESD-609 code e0 e0 e0 e0 e0 e0
length 10 mm 10 mm 18.41 mm 18.41 mm 23.5 mm 18.41 mm
memory density 2097152 bit 2097152 bi 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 36 36 44 44 36 44
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 85 °C 85 °C 70 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -
organize 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA TSOP2 TSOP2 SOJ TSOP2
Encapsulate equivalent code BGA36,6X8,30 BGA36,6X8,30 TSOP44,.46,32 TSOP44,.46,32 SOJ36,.44 TSOP44,.46,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED 240 NOT SPECIFIED NOT SPECIFIED 240
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.35 mm 1.35 mm 1.2 mm 1.2 mm 3.75 mm 1.2 mm
Maximum standby current 0.004 A 0.003 A 0.0009 A 0.004 A 0.004 A 0.00075 A
Maximum slew rate 0.065 mA 0.065 mA 0.045 mA 0.065 mA 0.065 mA 0.04 mA
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 2.97 V 3.135 V 2.97 V 2.97 V 2.97 V 2.97 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL GULL WING GULL WING J BEND GULL WING
Terminal pitch 0.75 mm 0.75 mm 0.8 mm 0.8 mm 1.27 mm 0.8 mm
Terminal location BOTTOM BOTTOM DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30
width 8 mm 8 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
Base Number Matches 1 1 1 1 1 -
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