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5962-8754801XX

Description
Serial I/O Controller, 1 Channel(s), 0.0078125MBps, NMOS, CDIP28, CERAMIC, DIP-28
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size154KB,6 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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5962-8754801XX Overview

Serial I/O Controller, 1 Channel(s), 0.0078125MBps, NMOS, CDIP28, CERAMIC, DIP-28

5962-8754801XX Parametric

Parameter NameAttribute value
Parts packaging codeDIP
package instructionDIP,
Contacts28
Reach Compliance Codeunknown
Address bus width
boundary scanNO
Bus compatibilityIAPX 86; IAPX 88
maximum clock frequency2.4 MHz
letter of agreementASYNC, BIT; SYNC, BYTE; BISYNC
Data encoding/decoding methodsNRZ
Maximum data transfer rate0.0078125 MBps
External data bus width8
JESD-30 codeR-GDIP-T28
length37.1475 mm
low power modeNO
Number of DMA channels
Number of I/O lines
Number of serial I/Os1
Number of terminals28
On-chip data RAM width
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
RAM (number of words)0
Maximum seat height5.588 mm
Maximum slew rate120 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyNMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches1

5962-8754801XX Related Products

5962-8754801XX 8251A/BXA 8251A/BXX
Description Serial I/O Controller, 1 Channel(s), 0.0078125MBps, NMOS, CDIP28, CERAMIC, DIP-28 Serial I/O Controller, 1 Channel(s), 0.0078125MBps, NMOS, CDIP28, CERAMIC, DIP-28 Serial I/O Controller, 1 Channel(s), 0.0078125MBps, NMOS, CDIP28
package instruction DIP, DIP, DIP28,.6 DIP,
Reach Compliance Code unknown unknown unknown
boundary scan NO NO NO
Bus compatibility IAPX 86; IAPX 88 IAPX 86; IAPX 88 IAPX 86; IAPX 88
maximum clock frequency 2.4 MHz 2.4 MHz 2.4 MHz
letter of agreement ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC
Data encoding/decoding methods NRZ NRZ NRZ
Maximum data transfer rate 0.0078125 MBps 0.0078125 MBps 0.0078125 MBps
External data bus width 8 8 8
JESD-30 code R-GDIP-T28 R-GDIP-T28 R-GDIP-T28
length 37.1475 mm 37.1475 mm 37.1475 mm
low power mode NO NO NO
Number of serial I/Os 1 1 1
Number of terminals 28 28 28
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 5.588 mm 5.588 mm 5.588 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V
surface mount NO NO NO
technology NMOS NMOS NMOS
Temperature level MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL
width 15.24 mm 15.24 mm 15.24 mm
uPs/uCs/peripheral integrated circuit type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Parts packaging code DIP DIP -
Contacts 28 28 -
Maximum slew rate 120 mA 120 mA -
Maker - AMD AMD
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