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KM736V599AT-10

Description
Cache SRAM, 32KX36, 5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100
Categorystorage    storage   
File Size453KB,8 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KM736V599AT-10 Overview

Cache SRAM, 32KX36, 5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100

KM736V599AT-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time5 ns
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density1179648 bit
Memory IC TypeCACHE SRAM
memory width36
Number of functions1
Number of ports1
Number of terminals100
word count32768 words
character code32000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX36
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.01 A
Minimum standby current3.14 V
Maximum slew rate0.24 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3.13 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Base Number Matches1

KM736V599AT-10 Related Products

KM736V599AT-10 KM736V599AT-8 KM736V599AT-7 KM736V599ALT-7 KM736V599ALT-10 KM736V599ALT-8
Description Cache SRAM, 32KX36, 5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Cache SRAM, 32KX36, 5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Cache SRAM, 32KX36, 4.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Cache SRAM, 32KX36, 4.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Cache SRAM, 32KX36, 5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Cache SRAM, 32KX36, 5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFP QFP QFP QFP QFP QFP
package instruction LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87
Contacts 100 100 100 100 100 100
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 5 ns 5 ns 4.5 ns 4.5 ns 5 ns 5 ns
Maximum clock frequency (fCLK) 100 MHz 116 MHz 133 MHz 133 MHz 100 MHz 116 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609 code e0 e0 e0 e0 e0 e0
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
memory width 36 36 36 36 36 36
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 100 100 100 100 100 100
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 32KX36 32KX36 32KX36 32KX36 32KX36 32KX36
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP LQFP LQFP LQFP LQFP
Encapsulate equivalent code QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum standby current 0.01 A 0.01 A 0.01 A 0.0005 A 0.0005 A 0.0005 A
Minimum standby current 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V
Maximum slew rate 0.24 mA 0.26 mA 0.27 mA 0.27 mA 0.24 mA 0.26 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3.13 V 3.13 V 3.13 V 3.13 V 3.13 V 3.13 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Maker - - SAMSUNG SAMSUNG SAMSUNG SAMSUNG
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