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PPC440GX-3CC533E

Description
RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,86 Pages
ManufacturerApplied Micro Circuits (MACOM)
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PPC440GX-3CC533E Overview

RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552

PPC440GX-3CC533E Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerApplied Micro Circuits (MACOM)
Parts packaging codeBGA
package instructionBGA, BGA552,24X24,40
Contacts552
Reach Compliance Codeunknown
ECCN code3A001.A.3
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width64
bit size32
boundary scanYES
maximum clock frequency83.33 MHz
External data bus width64
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B552
length25 mm
low power modeYES
Humidity sensitivity level1
Number of terminals552
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Encapsulate equivalent codeBGA552,24X24,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1.5 V
Certification statusNot Qualified
Maximum seat height3.977 mm
speed533 MHz
Maximum slew rate2200 mA
Maximum supply voltage1.6 V
Minimum supply voltage1.4 V
Nominal supply voltage1.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
Part Number 440GX
Revision 1.01 – November 1, 2004
440GX
Features
Data Sheet
Power PC 440GX Embedded Processor
• PowerPC
®
440 processor core operating up to
800MHz with 32KB I- and D-caches (with parity
checking)
• On-chip 256KB SRAM configurable as L2 Code
store or Ethernet Packet store memory
• Selectable processor:bus clock ratios (Refer to
the Clocking chapter in the
PPC440GX
Embedded Processor User’s Manual
for details)
• Double Data Rate (DDR) Synchronous DRAM
(SDRAM) interface operating up to 166MHz
• External Peripheral Bus (32 bits) for up to eight
devices with external mastering
• DMA support for external peripherals, internal
UART and memory
• PCI-X V1.0a interface (32 or 64 bits, up to
133MHz) with support for conventional PCI V2.3
• Two Ethernet 10/100/1000Mbps half- or full-
duplex interfaces. Operational modes supported
are SMII, GMII, RGMII, TBI and RTBI.
• TCP/IP Acceleration Hardware (TAH) provided for
10/100/1000 Mbps ports that performs checksum
processing, TCP segmentation, and includes
support for jumbo frames
• Two Ethernet 10/100Mbps half- or full-duplex
interfaces. Operational modes supported are MII,
RMII, and SMII.
• Programmable Interrupt Controller supports
interrupts from a variety of sources.
• I2O Messaging unit for message transfer between
the CPU and PCI-X
• Programmable General Purpose Timers (GPT)
• Two serial ports (16750 compatible UART)
• Two IIC interfaces
• General Purpose I/O (GPIO) interface available
• JTAG interface for board level testing
• Processor can boot from PCI memory
• Available in ceramic and plastic packages
Description
Designed specifically to address high-end embedded
applications, the PowerPC 440GX (PPC440GX)
provides a high-performance, low power solution that
interfaces to a wide range of peripherals by
incorporating on-chip power management features
and lower power dissipation.
This chip contains a high-performance RISC
processor core, DDR SDRAM controller, configurable
256KB SRAM to be used as L2 cache or software-
controlled on-chip memory, PCI-X bus interface,
Gigabit Ethernet interfaces, TCP/IP acceleration
hardware, I2O messaging unit, control for external
ROM and peripherals, DMA with scatter-gather
support, serial ports, IIC interface, and general
purpose I/O.
Technology: CMOS Cu-11, 0.13µm , 6-layer metal
Packages: 25mm, 552-ball Ceramic Ball Grid Array
(CBGA) or Plastic Ball Grid Array (PBGA)
Power (estimated): Less than:
4W typical @533MHz
5W typical @667MHz
6W typical @800MHz (estimated)
Supply voltages required: 3.3V, 2.5V, 1.5V
AMCC
1

PPC440GX-3CC533E Related Products

PPC440GX-3CC533E PPC440GX-3CC533C PPC440GX-3CC800C PPC440GX-3FC533C PPC440GX-3CC667C
Description RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 800MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 533MHz, CMOS, PBGA552, 25 X 25 MM, PLASTIC, BGA-552 RISC Microprocessor, 32-Bit, 667MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM)
Parts packaging code BGA BGA BGA BGA BGA
package instruction BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40
Contacts 552 552 552 552 552
Reach Compliance Code unknown compliant unknown unknown compliant
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address bus width 64 64 64 64 64
bit size 32 32 32 32 32
boundary scan YES YES YES YES YES
maximum clock frequency 83.33 MHz 83.33 MHz 83.33 MHz 83.33 MHz 83.33 MHz
External data bus width 64 64 64 64 64
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES YES
JESD-30 code S-CBGA-B552 S-CBGA-B552 S-CBGA-B552 S-PBGA-B552 S-CBGA-B552
length 25 mm 25 mm 25 mm 25 mm 25 mm
low power mode YES YES YES YES YES
Number of terminals 552 552 552 552 552
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
encapsulated code BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225 225 225 NOT SPECIFIED
power supply 1.5 V 1.5 V 1.55 V 1.5 V 1.55 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.977 mm 3.977 mm 3.977 mm 3.261 mm 3.977 mm
speed 533 MHz 533 MHz 800 MHz 533 MHz 667 MHz
Maximum slew rate 2200 mA 2200 mA 2200 mA 2200 mA 2200 mA
Maximum supply voltage 1.6 V 1.6 V 1.6 V 1.6 V 1.6 V
Minimum supply voltage 1.4 V 1.4 V 1.5 V 1.4 V 1.5 V
Nominal supply voltage 1.5 V 1.5 V 1.55 V 1.5 V 1.55 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 25 mm 25 mm 25 mm 25 mm 25 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Humidity sensitivity level 1 1 1 1 -
Base Number Matches 1 1 1 1 -

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