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54F 74F10 Triple 3-Input NAND Gate
December 1994
54F 74F10
Triple 3-Input NAND Gate
General Description
This device contains three independent gates each of
which performs the logic NAND function
Commercial
74F10PC
Military
Package
Number
N14A
Package Description
14-Lead (0 300 Wide) Molded Dual-In-Line
14-Lead Ceramic Dual-In-Line
54F10DM (Note 2)
74F10SC (Note 1)
74F10SJ (Note 1)
54F10FM (Note 2)
54F10LM (Note 2)
J14A
M14A
M14D
W14B
E20A
14-Lead (0 150 Wide) Molded Small Outline JEDEC
14-Lead (0 300 Wide) Molded Small Outline EIAJ
14-Lead Cerpack
Note 1
Devices also available in 13 reel Use suffix
e
SCX and SJX
Note 2
Military grade device with environmental and burn-in processing Use suffix
e
DMQB FMQB and LMQB
bs
ol
IEEE IEC
Pin Assignment for
DIP SOIC and Flatpak
TL F 9458–3
TL F 9458 – 2
Logic Symbol
O
Unit Loading Fan Out
Pin Names
Description
A
n
B
n
C
n
O
n
Inputs
Outputs
C
1995 National Semiconductor Corporation
TL F 9458
UL
HIGH LOW
10 10
50 33 3
FAST and TRI-STATE are registered trademarks of National Semiconductor Corporation
et
20-Lead Ceramic Leadless Chip Carrier Type C
Connection Diagrams
54F 74F
Input I
IH
I
IL
Output I
OH
I
OL
20
mA
b
0 6 mA
b
1 mA 20 mA
e
Pin Assignment
for LCC
TL F 9458 – 1
RRD-B30M75 Printed in U S A
Absolute Maximum Ratings
(Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Storage Temperature
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
V
CC
Pin Potential to
Ground Pin
b
65 C to
a
150 C
b
55 C to
a
125 C
b
55 C to
a
175 C
b
55 C to
a
150 C
b
0 5V to
a
7 0V
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
Supply Voltage
Military
Commercial
b
55 C to
a
125 C
0 C to
a
70 C
a
4 5V to
a
5 5V
a
4 5V to
a
5 5V
b
0 5V to
a
7 0V
Input Voltage (Note 2)
b
30 mA to
a
5 0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
b
0 5V to V
CC
Standard Output
b
0 5V to
a
5 5V
TRI-STATE Output
Current Applied to Output
in LOW State (Max)
twice the rated I
OL
(mA)
Note 2
Either voltage limit or current limit is sufficient to protect inputs
Symbol
V
IH
V
IL
V
CD
V
OH
Parameter
Min
Input HIGH Voltage
Input LOW Voltage
Input Clamp Diode Voltage
Output HIGH
Voltage
Output LOW
Voltage
Input HIGH
Current
20
54F 74F
Typ
V
OL
I
IH
I
BVI
I
CEX
V
ID
I
OD
I
IL
Input HIGH Current
Breakdown Test
Output HIGH
Leakage Current
Input Leakage
Test
O
Output Leakage
Circuit Current
74F
Input LOW Current
I
OS
Output Short-Circuit Current
Power Supply Current
Power Supply Current
I
CCH
I
CCL
bs
ol
b
1 2
54F 10% V
CC
74F 10% V
CC
74F 5% V
CC
54F 10% V
CC
74F 10% V
CC
54F
74F
25
25
27
54F
74F
54F
74F
74F
4 75
b
60
14
51
et
Units
V
V
CC
Conditions
Max
08
V
V
Min
I
IN
e b
18 mA
V
Min
I
OH
e b
1 mA
I
OH
e b
1 mA
I
OH
e b
1 mA
05
05
V
Min
I
OL
e
20 mA
I
OL
e
20 mA
V
IN
e
2 7V
V
IN
e
7 0V
V
OUT
e
V
CC
20 0
50
100
70
mA
mA
mA
V
Max
Max
Max
00
250
50
I
ID
e
1 9
mA
All other pins grounded
V
IOD
e
150 mV
All other pins grounded
V
IN
e
0 5V
V
OUT
e
0V
V
O
e
HIGH
V
O
e
LOW
3 75
b
0 6
b
150
DC Electrical Characteristics
mA
mA
mA
mA
mA
21
77
2
e
Recognized as a HIGH Signal
Recognized as a LOW Signal
00
Max
Max
Max
Max
Note 1
Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired Functional operation under
these conditions is not implied
AC Electrical Characteristics
74F
Symbol
Parameter
Min
t
PLH
t
PHL
Propagation Delay
A
n
B
n
C
n
to O
n
24
15
T
A
e a
25 C
V
CC
e a
5 0V
C
L
e
50 pF
Typ
37
32
Max
50
43
54F
T
A
V
CC
e
Mil
C
L
e
50 pF
Min
20
15
Max
70
65
74F
T
A
V
CC
e
Com
C
L
e
50 pF
Min
24
15
Max
60
53
ns
Units
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
Temperature Range Family
74F
e
Commercial
54F
e
Military
Device Type
Package Code
P
e
Plastic DIP
D
e
Ceramic DIP
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline Package SOIC JEDEC
SJ
e
Small Outline Package SOIC EIAJ
10
S
C
X
Special Variations
QB
e
Military grade device with
environmental and burn-in
processing
X
e
Devices shipped in 13 reels
Physical Dimensions
inches (millimeters)
O
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
3
bs
ol
et
e
Temperature Range
C
e
Commercial (0 C to
a
70 C)
M
e
Military (
b
55 C to
a
125 C)
Physical Dimensions
inches (millimeters) (Continued)
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
O
bs
ol
14-Lead (0 150 Wide) Molded Small Outline Package JEDEC (S)
NS Package Number M14A
4
et
e
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