AM29F016D-90E4C datasheet, PDF

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AM29F016D-90E4C: DescriptionFlash, 2MX8, 90ns, PDSO40, MO-142CD, TSOP-40; Categorystorage storage; File Size2MB，43 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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AM29F016D-90E4C Overview

Flash, 2MX8, 90ns, PDSO40, MO-142CD, TSOP-40

AM29F016D-90E4C Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	TSOP1
package instruction	MO-142CD, TSOP-40
Contacts	40
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	90 ns
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G40
JESD-609 code	e0
length	18.4 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	32
Number of terminals	40
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP40,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	64K
Maximum standby current	0.000005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
switch bit	YES
type	NOR TYPE
width	10 mm
Base Number Matches	1

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Am29F016D

Data Sheet

(Retired Product)

Am29F016D Cover Sheet

This product has been retired and is not recommended for designs. Please contact your Spansion representative for

alternates. Availability of this document is retained for reference and historical purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been

made are the result of normal data sheet improvement and are noted in the document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

21444

Revision

Amendment

Issue Date

March 3, 2009

D A T A

S H E E T

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . .

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . .

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ordering Information . . . . . . . . . . . . . . . . . . . . . . .

Device Bus Operations . . . . . . . . . . . . . . . . . . . . .

Requirements for Reading Array Data .....................................

Writing Commands/Command Sequences ..............................

Program and Erase Operation Status ......................................

Standby Mode ..........................................................................

RESET#: Hardware Reset Pin .................................................

Output Disable Mode................................................................

DQ7: Data# Polling................................................................. 20

Figure 4. Data# Polling Algorithm ................................................. 20

Table 1. Am29F016D Device Bus Operations .................................. 8

RY/BY#: Ready/Busy#............................................................

DQ6: Toggle Bit I ....................................................................

DQ2: Toggle Bit II ...................................................................

Reading Toggle Bits DQ6/DQ2...............................................

DQ5: Exceeded Timing Limits ................................................

DQ3: Sector Erase Timer .......................................................

Figure 5. Toggle Bit Algorithm....................................................... 22

Table 10. Write Operation Status................................................... 23

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 24

Figure 6. Maximum Negative Overshoot Waveform ..................... 24

Figure 7. Maximum Positive Overshoot Waveform....................... 24

Table 2. Sector Address Table........................................................ 10

Autoselect Mode..................................................................... 11

Table 3. Am29F016D Autoselect Codes (High Voltage Method).... 11

Sector Group Protection/Unprotection.................................... 11

Table 4. Sector Group Addresses................................................... 11

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 24

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25

TTL/NMOS Compatible .......................................................... 25

CMOS Compatible.................................................................. 25

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 8. Test Setup..................................................................... 26

Table 11. Test Specifications ......................................................... 26

Temporary Sector Group Unprotect ....................................... 11

Figure 1. Temporary Sector Group Unprotect Operation............... 12

Hardware Data Protection ...................................................... 12

Low V

Write Inhibit ...................................................................... 12

Write Pulse “Glitch” Protection........................................................ 12

Logical Inhibit .................................................................................. 12

Power-Up Write Inhibit .................................................................... 12

Key to Switching Waveforms. . . . . . . . . . . . . . . . 26

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27

Read-only Operations............................................................. 27

Figure 9. Read Operation Timings ................................................ 27

Figure 10. RESET# Timings ......................................................... 28

Erase/Program Operations..................................................... 29

Figure 11. Program Operation Timings.........................................

Figure 12. Chip/Sector Erase Operation Timings .........................

Figure 13. Data# Polling Timings (During Embedded Algorithms)

Figure 14. Toggle Bit Timings (During Embedded Algorithms).....

Figure 15. DQ2 vs. DQ6................................................................

Figure 16. Temporary Sector Group Unprotect Timings ...............

Common Flash Memory Interface (CFI) . . . . . . . 13

Table 5. CFI Query Identification String .......................................... 13

Table 6. System Interface String..................................................... 13

Table 7. Device Geometry Definition .............................................. 14

Table 8. Primary Vendor-Specific Extended Query ........................ 14

Command Definitions . . . . . . . . . . . . . . . . . . . . . 15

Reading Array Data ................................................................ 15

Reset Command..................................................................... 15

Autoselect Command Sequence ............................................ 15

Byte Program Command Sequence....................................... 15

Unlock Bypass Command Sequence.............................................. 16

Figure 2. Program Operation ......................................................... 16

Erase and Program Operations.............................................. 34

Alternate CE# Controlled Writes .................................................... 34

Figure 17. Alternate CE# Controlled Write Operation Timings ..... 35

Chip Erase Command Sequence ........................................... 16

Sector Erase Command Sequence ........................................ 17

Erase Suspend/Erase Resume Commands........................... 17

Figure 3. Erase Operation.............................................................. 18

Command Definitions ............................................................. 19

Table 9. Am29F016D Command Definitions................................... 19

Erase and Programming Performance . . . . . . . 36

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 36

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 36

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 37

TS 040—40-Pin Standard Thin Small Outline Package ......... 37

TS 048—48-Pin Standard Thin Small Outline Package ......... 38

SO 044—44-Pin Small Outline Package ................................ 39

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 40

Write Operation Status . . . . . . . . . . . . . . . . . . . . 20

March 3, 2009 21444E7

Am29F016D

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